3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Baggage and Parcel Inspection
Inspection of bags and parcels has to be effective, efficient, and meet the toughest regulatory requirements. Rapiscan® Systems products deliver on both levels.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Turnkey NDT Corrosion Inspection Services
Robot-enabled ultrasonic inspection that produces thickness grid maps to identify areas where corrosion and other damage mechanisms have caused wall-thinning.
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9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Customized Semiconductor Wafer Inspection, Sorting & Metrology Equipment | Systems
Customized Solutions
Unique Needs? Need better wafer inspection throughput, accuracy, versatility? Need a wafer defect inspection expert who’s not a sales person? We’ve been providing complete semiconductor wafer inspection, sorter, and microscopes solutions to semiconductor wafer manufacturers since 1994.
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Semiconductor / FPD Inspection Microscope
MX61L
Motorized Microscope for 300mm dia. Wafer/17 inch Glass Substrate use Reflected/Transmitted Illumination.
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Sensor for Filament Inspection
EyeFI
EVT presents the EyeFI - the sensor for the inspection of filaments. The sensor contains two cameras with an Aptina sensor and S-Mount lenses. The cameras are perpendicular to each other. It is therefore possible to inspect two sides of the filament, which means that the EyeFI can detect if the filament is out-of-roundness. Additionally the errors and defects can be detected. For example the occurring flaws are point-shaped or partly flaked, or point-shaped and transverse, or also looking like a longitudial rib, or only spots in different shapes. The defects can be detected with the EyeFI sensor. The EyeFI contains board cameras with sensors from Aptina, the IoCap and an evaluation processor. The housing is about 14x10x4 cm in size. The IoCap is the image-capture-IO-board, which is designed and developped by EVT.
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3D Cameras
*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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25-Pin D-Type Male Solder Bucket
92-960-025-M
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Thin Film SPY Inspection w/ Built In Jeep Meter
780
For thin film coatings the easy-carry and easy to handle SPY Model 780 speeds inspection time with its built in Jeep meter and various other time saving and comfort features.
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3D Scanning Software
Software is a comprehensive component to any advanced metrology system. Combined with laptops and portable equipment, 3D scanning and measurement is now possible virtually anywhere. 3D scanner software plays a critical role in every stage from the creation of a concept design to the manufacturing and inspection of prototypes. Below is a look at some of the Laser Scanner Software and 3D Scanner Software providers and platforms we represent and handle.
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Universal 3D Metrology Software Platform
PolyWorks
Defining the cutting edge of 3D metrology, the PolyWorks software suite maximizes productivity, quality, and profitability when integrating 3D measurement technologies into an industrial manufacturing process. From part and tool design and prototyping down to final inspection of assembled products, PolyWorks offers advanced solutions to cover the complete product development cycle. Interfacing directly with major brands and technologies of single-point and point cloud 3D measurement devices through plug-in extension modules, this universal platform also supports a wide array of native point cloud and polygonal model file formats.
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Detailed Stereo Image Analysis with 3D Visualization
StereoScope Pro
StereoScope Pro is a real time stereo field analyzer with multiple views and MIDI/automation output capabilities. It is a powerful help to analyze how the audio signal is spread in the stereo field, and you can easily detect potential phase and mono compatibilities issues.
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Wireless Fiber Inspection Probe
OCI-20BN-W
OCI-20BN-W is a portable optical fiber connector inspector for checking fiber and connector end-face cleanliness, ideal for bench top and fiber optic network installation technicians to eliminate error caused by poor quality or improper cleaning.OCI-20BN-W offers excellent viewing on connector/fiber end-face and is able to feature to record and save image/video of fiber end-face; It can be connected to PC or phone by WIFI.More than 40 assorted high-precision tips designed for inspection solutionsAngled/Lengthened tips for awkward positions.Connect smart phone for testing FiberEye2 is the application on an android or IOS smart phone to capture, display and record the fiber end-face image from the Wi-Fi probe.Connect tablet/laptop for testing EFD is the analysis software on Windows tablet/laptop to have dusts, and scratches on end face inspected, analyzed, compiled and reported
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3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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Thickness and Flaw Inspection
OmniScan MX2
The result of over 10 years of proven leadership in modular NDT test platforms, the OmniScan MX has been the most successful portable and modular phased array test instrument produced by Olympus to date, with thousands of units in use throughout the world.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Automated Optical Inspection
K Series3D
K Series and K Series3D are the reference in Automated Optical Inspection (AOI), allowing 2D and 3D inspection with very low false calls rate, for both pre-reflow and post-reflow. They are the most powerful gatekeepers to guarantee high quality level for the assembled PCB.
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X5 XL800 X-Ray Inspection
Designed to be integrated into the production process at either the beginning to protect equipment or at the end to protect consumers, the X5 XL 800 is perfect for products such as meat in Euro crates or cheese in bulk boxes.
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3D vision
SICK's 3D vision series offers a wide range of powerful and flexible products designed for reliable operation in harsh industrial environments. They range from versatile high-speed cameras that deliver high quality 3D and contrast images to smart and configurable stand-alone sensors that facilitate rapid development and easy integration. Their scalability ensures a perfect fit with your 3D vision application.
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Digital Inspection Probes
DI-1000
The ergonomically designed DI-1000 is Lightel’s all digital video microscope probe. It connects directly to your PC through the computer’s USB2.0 port. Featuring easy single finger focusing, a built-in image freeze/capture button, and detectable resolution to 0.5µm, the DI-1000 package includes our free ConnectorViewTM (standard) software, providing digital zoom, image display, image capture, auto-calibration and basic analysis tools.
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3D SPI Series
MS-11e
- Exclusive15MP / 25MP CoaXPress Camera System- Dual Projection Shadow Free Moiré Technology- Precision Compound Telecentric Camera Lens- Automated Z-Height Calibration System- Automated PCB Under Board Support System- Precision PCB Warpage Compensation- Closed Loop Communication With Screen Printer- Absolute Repeatability and Reproducibility- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Replacement Solder Tip Lead Set for D410/D610
Dx10-SI
- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Lab Inspection & Testing Services
Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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Hand-held Fiber Inspection Microscopes
The WL-C series hand-held fiber microscopes use coaxial illumination to provide users with maximum detail. It easily can detect the finest scratches and contamination, making it ideal for critically inspecting polish quality.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D LaservScanners
With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
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3D Multibeam Scanning Sonar
ProScan™
Teledyne BlueView's 3D Multibeam Scanning Sonar user interface software. ProScan connects to the sonar and pan/tilt unit, configures each scan, generates full 3D point clouds, and optionally streams output to third party hydrographic software for fusion with other sensors. Data is recorded in multiple file formats: .son (raw acoustic data file for ProScan reprocessing), .txt (plain text record of all point locations and positional data) and .xyzi (industry standard xyzi data for 3D point cloud viewers, registration software, etc.). In playback mode, users can review and reprocess scans to modify sound speed, intensity threshold, multidetect and range settings as needed. ProScan coupled with Teledyne PDS MotionScan, pitch, roll heading and position sensors provides the capability to scan areas to collect 3D point clouds while correcting for motion.





























