3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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3D Form Measurement
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Ensure that components function and can be fitted correctly with efficient form monitoring. ISRA’s 3D form measurement systems capture component geometries down to the nanometer level while ensuring the shortest cycle times.
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9-Pin D-Type Female, Solder Bucket, HV
40-960-009-F-HV
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9-Pin Female D-Type Connector, High Voltage, Solder Bucket - With Backshell
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3D AOI with Revolutionary New 3D Measurement
Zenith
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The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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Product
Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
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Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Qualicoat Powder Coating Inspection Kit
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The aim of Qualicoat is to establish the minimum standard that plant installations, coating materials and finished products which have been powder coated must meet.Within this quality label, Qualicoat identifies a range of inspection requirements to be undertaken with regards to the quality control of powder coated products.The Elcometer Qualicoat Powder Coating Inspection Kit provides the various test instrumentation required to meet the high standards of this organisation.
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Product
96-Pin 1.27mm Pitch Female Solder Pad Connector Without Backshell
C096SFX-XSP-5A
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This connector is designed to allow users to discrete wires using solder pad connections to the 96-Pin 1.27mm pitch connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
Optical Inspection
3D AOI
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In contemporary electronics manufacturing, automatic optical inspection (3D AOI) is an established component of quality control. A company purchasing a 3D AOI system wants to ensure that it is manufacturing its electronic products in the very best quality and can guarantee they will have a long service life. The Viscom systems feature superlative 3D and software attributes to deliver excellent measurement accuracy and exceptional image quality. Our 3D AOI systems are designed for simple programming and can also be flexibly adapted to new requirements, allowing them to easily accommodate fast product changeovers as well as large production quantities.
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Automatic Flight Inspection System
AT-920DG
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Airfield Technology is pleased to announce the availability ofa new product, the AT-920DG Automatic Flight InspectionSystem.The new AT-920DG system combines the unique groundbasedinspection capability of our original AT-920 with theproven DGPS positioning system and WinFIS flight inspectionsoftware from our larger, dual equipment AT-930DG system.
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Inspection Solutions
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Entire range of optical inspection systems. From the SPI machine (SPI inspection) for checking solder paste printing, to an inline AOI for THT or SMD-assembled PCBA, to AXI machine for BGA x ray inspection. And furthermore, GÖPEL electronic's AOI PCB inspection can be used for conformal coating inspection (CCI) of various protective coatings applied to boards.
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3D Laser Scanning Systems
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3D laser scanning is a construction, engineering, and architectural tool often used to document the existing conditions (as-builts) of any structure.
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Explosion Proof UV Inspection Light
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he Labino MB Hercules Ex is an extremely durable product specifically developed for use in areas where the risk of an explosion is high. Offshore Oil Rigs, Refineries, Aerospace, and Defense often require explosion proof products to ensure safety for their inspection teams. The Midbeam Hercules Ex has successfully completed extremely tough tests, including tests for thermal conditioning, Impact Tests, Drop Tests and IP tests that led to the ATEX certification (Certificate: ITS17ATEX402144X). This unique product is suitable for use in extreme weather conditions varying from 104° Fahrenheit (+ 40° Celsius) to minus 4° Fahrenheit (- 20° Celsius).
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On-site EL/PL Inspection Machine
“EPTiF”
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"EPTiF (EL/PL Test in Field)" enables you to check invisible conditions of installed solar panels during daytime by EL and PL inspections, which are adopted by a number of solar panel manufacturers, without detaching solar panels. Irradiance-independent and steady results can be obtained. This is the first in the industry.
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Product
Replacement 30" Matched Cable Set for Use with Dx10 HiTemp Solder Tip Leadset
Dx20-Cable-HiTemp
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Replacement 30" matched cable set for use with Dx20 HiTemp Solder tip leadset
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37-Pin D-Type Male Solder Pin HV
40-960-037-MHV
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This connector is designed to allow users to directly terminate cables with soldered connections.
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A Compact X-ray Inspection System, The MedaScope™ Desktop
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A compact X-ray machine weighing only 55 pounds, the MedaScope Desktop is easy to carry and can be set up rapidly. Glenbrook’s MedaScope Desktop is a portable, compact manual system for real-time, magnified x-ray screening of packaged devices including medical devices, electronics, and cables.
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X-ray Inspection System
NEO-690Z / NEO-890Z
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Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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Low to Modest Volume Clean, Inspect, Test
KI-TK034
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1310/1550 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO/APC, SC, LC connectors (EAR99 Restricted)
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Ensenso 3D Cameras
X Series
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Imaging Development Systems GmbH
The Ensenso X series is a modular and ultraflexible 3D camera system. The projector module with 100 W LED projector power is equipped with an integrated Gigabit Ethernet switch and can be combined with selected GigE uEye camera models to a customised 3D camera system.
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Non-Destructive Test Resonant Inspection System
RAM-AUTO
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Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
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Printed Circuit Board Inspection System
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NIDEC-READ offers an array of testing equipment used to conduct open/leak tests on motherboards, as well as many other printed circuit boards. They can be flexibly configured according to applications in terms of size, type, and the number of test pins required.
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Electronic Inspection Systems
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Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Measuring And Inspection Systems For Extrusion, Injection Molding & Calendering Of Plastics And Films
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Measuring and inspection systems from Micro-Epsilon are used in the plastics processing industry in order to ensure efficient production.
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Inspection Microscope/Video
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Connector end face contamination is a big problem with fiber optic cables and patch cords and it causes network issues. If you are a professional technician, you need a quality optical microscope. The magnification of connector end faces will allow you to discover any quality problems such as scratches. You need to make sure you have a clean connection with no dirt and debris. Visual inspection is fast, easy and simple. Using this test equipment can help avoid problems.
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Video Inspection Station
VIS300
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Video Inspection Stations are available with?or without on-screen measurement capabilities?and offer?an excellent way to evaluate or test small works or items in?difficult to access locations.? As todays electronic and mechanical systems keep getting smaller, it becomes impossible to test or measure these products with traditional methods. For many applications, from development to production testing, video based inspection can help maintain quality control. Many of these systems are used in labs for development or used in production for testing production samples.
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Laser Sherography NDT Sensor for Post-Production Quality Control or In-Field Component Inspections
FlawExplorer
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The FlawExplorer is a laser shearography NDT sensor designed to be used for post-production quality control applications or in-field (in-service) component inspections. Depending on the application, the sensor can be configured with thermal or vacuum (partial) excitation systems and may also be automated. It incorporates the very latest in phase-shifting technology delivering accurate and reliable measurement results through clear and sharp imaging with sub-micrometer displacement resolution.
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3D Machine Vision Process Control Solutions
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In the age of automation and robotics, manufacturers utilizing automated dispensing in their assembly lines face growing challenges to maintain process control of their manufacturing processes. To eliminate errors and optimize product quality, they increasingly need the help of machine vision based “eyes of automation”. Whether manufacturing automobiles or medical devices, they need high-speed inspection tools to confirm the accuracy of their dispensing process and the overall quality of their products.
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Conformal Coating Inspection
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Conformal coating plays a key role especially when electronic assemblies are used in products and systems that perform safety-relevant tasks. The coatings applied to the circuit board protect against environmental influences such as dirt, dust, moisture, condensation, and varying temperatures. Increasing packing densities and the trend toward miniaturization are also making conformal coatings essential. The insulating effect of the coating allows reductions in the distance between conductor paths while also boosting the performance of terminal devices.





























