Particle Size
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Product
0.1 Micron Portable Particle Counter
3950
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This revolutionary 0.1-0.3 micron 2-channel semiconductor particle counter comes in one of the lightest form-factors available today; clocking in at only 7.5lbs (3.4kg). It is designed for high-end contamination control environments, such as semiconductor manufacturing facilities and cleanrooms, and can be used for standalone operation or integrated into an existing monitoring system to accommodate a vast array of applications.
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
6U cPCI / PXI / PXIe 6021 Full Size Chassis
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The WIENER 6021 crate series can be outfitted with cPCI, PXI or PXIe backplanes to provide high performance chassis with highly reliable low-noise power supplies for these bus standards. Typical applications are data acquisition, beam line control and test instrumentation.
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Product
Particle Solutions
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Brookhaven Instruments Corporation
ultimodal Size Distribution which has been refined to give a more accurate graphical image of the particles being measuredHealth Mode post-measurement analysis for DLS, ELS, and PALSStatistical Process Control seamlessly integratedParticle Solutions 3.2, a robust suite of software that integrates five measuring technologies in one package: DLS, ELS, PALS, ASEC and Rhe.
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Product
SMARC® 2.1 Short Size Module With NXP I.MX95
LEC-IMX95
Computer on Module
ADLINK LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS., is the latest SMARC revision 2.1 compliant module. It combines power-efficient high-performance compute, immersive Arm® Mali™-powered 3D graphics, innovative NXP NPU accelerator for machine learning, and high-speed data processing with safety and security features.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
Computer on Module
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Magnetic Particle Inspection
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Shanghai Xianda Denshijiki Industry Co.,Ltd
Using the "leakage magnetic flux" phenomenon generated from the scratches, the magnetic powder (or fluorescent magnetic powder) of the ferromagnetic material scattered on the surface by magnetizing the specimen is adsorbed to the scratch. Observe this and detect scratches.
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Product
Remote Particle Sensors
3718-A And 3719-A
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Kanomax Remote Particle Sensors with analog output are designed to fit into your existing monitoring system, or they can be used as a stand-alone unit to monitor a critical area when connected to an alarm or controller. With two models available, these 2-channel remote particle sensors are capable of Modbus communication via RS485 interface. 0.1 cfm and 1.0 cfm flow rate models are available, along with flexible 4-20mA analog output with the 1.0 cfm unit (only).
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Product
Remote Sensor Airborne Particle Counter
CI-3100 Trident Series
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Remote Sensor Airborne Particle Counter1 CFM With Internal Vacuum Pump For Continuous Monitoring. Long-Term Accuracy & Unsurpassed Repeatability of Measurement. 10,080 Sample Data Buffer.
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Product
Large Cryogenic Mill that Accomodates Sample Sizes from 0.1 to 100 Grams
Shaqer 1500
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The ShaQer™ offers high throughput and improved pesticide extraction for QuEChERS Sample Prep! It agitates up to six samples simultaneously compared to just two samples processed by hand. The vigorous clamp movement results in thorough extraction of pesticide residue in fruit and vegetables. Every sample is handled in the same manner ensuring consistency and eliminating variations that can occur in manual sample prep. It also accommodates a variety of tube sizes and shapes. CE Approved.
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Product
High-Energy Ball Mill for Sample Sizes from 0.2 - 10 Grams
Mixer/Mill 8000M*
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High-energy ball mill that accommodates sample sizes ranging from 0.2 - 10 grams. Ideal for grinding dry, brittle samples, mechanical alloying, slurry grinding, blending powders, and mixing emulsions. CE Approved.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
Computer on Module
The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
Computer on Module
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
Computer on Module
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
Computer on Module
- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
Pocket Sized Dial Thermometer w/ 5 Inch Stem
T220/3
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UEi Test & Measurement Instruments
Farenheit scale thermometer with 1 3/4 inch dial and 5 inch stem with a 0˚ to 220˚F range
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Product
Ultrafine OEM Particle Sensors
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Naneos Particle Solutions gmbh
OEM sensors can be used to be built in proprietary systems. If you have e.g. a laboratory setup with your own flow, power supply and data aquisition, you can implement a custom sensor into your system. We provide different sensors for different applications, concentrations and flow ranges.
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Product
Small, High-Energy Ball Mill for Sample Sizes 0.2 - 1.5 Grams
Mixer/Mill 5100*
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Small high-energy ball mill that accommodates sample sizes ranging from 0.2 - 1.5 grams. Ideal for grinding and pulverizing brittle samples, slurry grinding, and mixing powders.
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Product
Qseven® Standard Size Module With Intel® 6th Gen. Atom® X6000 Processors (Formerly Elkhart Lake)
Q7-EL
Computer on Module
The ADLINK Q7-EL is a Qseven module that supports Intel Atom® x6000 (x6425RE, x6414RE, x6413E) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high-speed interfaces. With mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the smallest COM standards currently available. Q7-EL modules support up 16GB LPDDR4 memory, up to 256GB eMMC storage and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM Express Basic Size Type 2 Module with Mobile 7th Gen Intel® Xeon® and Core™ Processors (formerly codename: Kaby Lake)
Express-KL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Swing Mill for Sample Sizes 2 - 100 Grams
Disc Grinder 8500
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Ring & Puck mill that accommodates sample sizes ranging from 2 - 100 grams. Ideal for pulverizing dry, brittle samples and slurry grinding.
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
Computer on Module
The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
Particle Impact Detection System 10
BW-LPD-DAQ4000HD
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This system is capable of vibration testing up to 10 pounds and detecting defects that produce noise, such as loose screws, particles, etc. Right from the start of PIND testing, B&W patented the first MIL-STD compliant system outperforming the competition by over 30% better detection rate as tested by the NBS (now National Institute of Science and Technology) in a well known 1978 study (NBSIR 78-1590 NASA).
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Product
Magnetic Particle Flaw Inspection System
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This model can perform every kinds of magnetic particle flaw inspection in our unit. circular magnetization longitudial magnetization continuous magnetization, residual magnetization threading bar magnetization current induction magnetization, AC magnetization AC demagnetization DC magnetization, DC demagnetization.
