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receive conductors.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Pin-Line™ Collet Socket with Wire Wrap Pins
Series 0503
Pin-Line Collet Sockets with Wire Wrap Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with wire wrap or solder tail pins. Consult Data Sheet No. 12013 for solder tail pins. Break feature allows strips to be cut to the number of positions desired.
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Module Accessory Kit, Quantity 26, 4-40 x .56" Socket Head Cap Screws
510109619
Used with modules: 510104120, 510104123, 510104150, 510104307, 510104319, 510108125, 510108126, 510108245, 510108263, 510108281, 510170101, 510170102 and 510171101.
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M-Module Carrier for VMEbus (6U)
i4000
The i4000 is a 6U form factor M-module carrier for the VMEbus and forms the basis of a flexible I/O system. It offers the user a means of integrating a mix of M-modules in a VMEbus system. Four M-module mounting sockets are provided by this carrier.The interrupt controller on the i4000 has an interrupt vector register for each M-module interface.
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Interface Board, Compact, 8:1 Ethernet RJ45
40-965-907
Compact converter card for 40-736 Data Communications Multiplexer. Adapts the 78-Pin D-type connector on the front of the module to 9 RJ45 sockets. Allows the multiplexing of up to 8 Ethernet signals with speeds up to 1G bit.
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Voltage Testers
The non-contact voltage tester detects live conductors on cable connections, cable drums, sockets, switches, junction boxes etc. Due to capacitive measurement procedures, no current flow is required and interruptions can be indicated quickly and accurately.
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HV Test System up to 20000 Volt
Insulated test booth with large space for test items. 2 banana sockets for AC connection and 4 banana sockets for the DC connection of the DUTs. IC’s are tested in a long-term test. These are checked in an oil bath so that there are no air gaps to reduce the insulation. Maximum voltage 20 kV. Therefore, insulation tests must be carried out. Ensuring the standard-compliant test. For the safety of the operating personnel, the test cell is electrically locked while the high voltage measurement is active.
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JTAG External Modules (JEM) DIMM/SODIMM Socket Cluster Test
The primary function of the JTAG External Modules (JEM) for the DIMM/SODIMM Socket Cluster Test is to provide test access to off-board signals that otherwise could not be accessed by a JTAG test system and to strengthen the memory-independent JTAG testing for the assembly correctness of the almost full spectrum of the modern socket types, particularly (according to JEDEC_Std.21-C):
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Fanless Embedded System With Intel® Celeron® N3350 & Pentium® N4200, 2 HDMI, 2 GbE LAN And 6 USB
eBOX100-312-FL
The eBOX100-312-FL comes with ultra-slim size, low power consumption and fundamental features. The fanless embedded system is powered by the Intel® Celeron® processor N3350 or /Pentium® processor N4200 (codename: Apollo Lake). It is equipped with one 204-pin DDR3L-1600 SO-DIMM socket with up to 8GB system memory. In order to provide excellent multimedia performance, the embedded box computer comes with two HDMI ports for dual-view display with up to 4K resolution. To enhance wireless communication capabilities, this compact embedded system provides two PCI Express Mini Card slots, one SIM card slot, and four antenna connectors. With its compact size and basic functions, the entry-level eBOX100-312-FL is suitable for smart retail and light industries.
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Electrical Button Life Span Tester
IEC60884
Shenzhen Autostrong Instrument Co., Ltd.
Plugs and the sockets life tester is designed according to the corresponding provisions of the GB2099-96,GB16915-97 and IEC60884-1,used to detect the mechanical life test of the household and similar purposes of the plugs and the sockets products.
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Production Programmers
eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Meter Qualification Boards
WECO 8020, 8030
WECO Meter Qualification Boards by Radian Research enable extensive functional testing of single-phase and three-phase revenue grade electricity meters. Unlike Warm-up Boards and Load Boards that are limited to just powering the meter or applying a fixed current, WECO Meter Qualification Boards can test a variety of communications, disconnect and safety features. The WECO 8020 and 8030 have varying capabilities based on your requirements. They feature an innovative open socket design exclusive to RADIAN that ensures optimum operator safety. Capability, versatility and safety combine to make WECO Meter Qualification Boards THE logical choice.
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12V Electrical Continuity Tester
1924
Peaceful Thriving Enterprise Co Ltd
*Check on 12V systems. *Quickly check continuity of dead circuit, sockets, door bells, motors, switches, fuses and other high voltage appliances.
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3.5 Inch SBC with 7th Gen Core i7 CPU and PCIe/104
VENUS
Based on the “Kaby Lake” 7th generation Core i7 processor, Venus offers high CPU performance in a small form factor rugged SBC with modest power consumption. It incorporates a full suite of rugged features such as soldered memory, latching connectors, a thicker PCB, and true -40/+85ºC operating temperature, making it suitable for the most demanding vehicle applications. High I/O density, multiple expansion sockets, rugged design, modest power consumption of 14W, and wide temperature operation combine to make Venus an extremely attractive option for applications requiring high CPU performance or ruggedness.
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Low Noise Test Leads For N1413 With B2980 Series, 3m
N1425B
The N1425B is designed to operate specifically with the B2985B/87B. It can hold DUTs with large terminals being used with the N1426C. The N1426A with the N1425B is available for measurements of small DUTs such as PC boards or IC sockets. The N1426B with the N1425B enables the construction of simple custom-made test leads. The N1413A High Resistance Meter Fixture Adapter is also required to connect the N1425B to the B2985B/87B.
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PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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7-way Flat (Spade) Pin vehicle side Circuit Tester
7893
Innovative Products of America
The 7-way Flat Pin Trailer Circuit Tester quickly and easily tests trailer circuits on most light to medium duty trucks and campers. Just plug the plug tester into the trailer plug socket and activate the lights, brakes, turn signal etc.
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Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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GFCI Socket Tester
TEL5
Standard Electric Works Co., Ltd
● Fast, easy wiring check.● Easy to read light indication.● Confirm the correct wiring of AC socket.● Test GFCI for correct wiring & operation.● Detect 5 wiring faults.● GFCI circuit trips to confirm the tester is working.● The testing current for GFCI is about 8mA.
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COM Express Type 6 Compact Module With 5th/4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor
CEM881
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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High DC Breaking Capacity, 4 C/O, 10 A
D-BV Relay
Rugged plug-in relays for extreme reliable, long endurance applications in harsh environment. Proven reliable operation in switching high DC voltage / inductive loads and low currents. Compact design, choice of many options and a wide range of sockets makes the D-BV relay an easy and flexible solution to use.
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Strip-Line™ Socket with Bifurcated Contact Wire Wrap Pins
Series 0501
Strip-line Sockets with Bifurcated Contact Wire Wrap Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in wire wrap or solder tail pins. Consult Data Sheet No. 12008 for solder tail pins.
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COM-HPC Server Type Modules
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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PLCC-to-DIP Adaptor
Series 652000/653000
PLCC to DIP Adapter. Converts PLCC packaged ICs to DIP footprints. Ideal for prototyping and testing/evaluation. Available with PLCC sockets or PLCC pads on top side. Consult factory for panelized form or for mounting of consigned ICs.
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3.5" Embedded SBC With AMD G-Series APU, AMD A50M, LVDS/DisplayPort/VGA, Dual LANs And Audio
CAPA110
Axiomtek's CAPA110, a high-end graphics 3.5" embedded board is equipped with the latest AMD G-series APU dual core T56N 1.65GHz and AMD FCH A50M chipset, which is a wonderful choice for graphics-intensive applications such as high-end medical imaging, digital signage, kiosks/POI, thin clients, and gaming machines. One SO-DIMM socket on the CAPA110 supports up to 4GB of DDR3 1333 memory. The integrated Radeon™ HD6320 graphics controller delivers unprecedented high definition visual experience and offers outstanding 3D performance with DirectX 11 supported. Dual display capability is supported via the VGA and DisplayPort connections on the coastline, as well as onboard 18-bit/24-bit LVDS interface. Besides, the CAPA110 provides high-bandwidth expansion capability with one PCI Express Mini card for custom system configurations. Moreover, the system only requires +12V DC power input.
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Safety Relay, 4 Contacts, 10A
D-BW
The D-relays series are designed for demanding industrial applications such as power utilities and petrochemical industries. The construction of the relay and choice of materials makes the D-relay suitable to withstand corrosive atmosphere, low and high temperatures and vibrating environments. No external retaining clip needed as integrated ‘snap-lock’ will hold relay into socket under all circumstances and mounting directions All relays are equipped with a LED and suppression diode.
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Hybrid Socket
CSP/Ballnest
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
