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X-Ray Inspection System
MXI Ruby XL
Designed for the largest PCBs, Ruby XL allows 96 x 67 cm (37.9” x 26.4”) areas to be inspected non-destructively, with feature resolution up to 0.5 µm.
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Anritsu DualX Inspection Systems
The new DualX inspection system from Anritsu offers unsurpassed detection of high-density foreign material, including small bone fragments. Built on Anritsu's groundbreaking, field-proven original model, the DualX gives you the best detection capability available in the industry, along with a significantly lower total cost of ownership (TCO).
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Cleanliness Inspection System / Microscope
CIX90
The OLYMPUS CIX90 technical cleanliness inspection system is a dedicated, turnkey solution for manufacturers who maintain high quality standards for the cleanliness of manufactured components. The OLYMPUS CIX90 system makes it easy to quickly acquire, process, and document technical cleanliness inspection data to comply with international standards. The system is intuitively designed to guide users through each step of the process so that even novice inspectors can acquire important cleanliness data quickly and easily.
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Inline Wafer Electrical quality Inspection
ILS-W2
the Ultimate Wafer Electrical Quality Inspection Unit for Wafer Inspection Systems
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Smart Factory Inspection System
API, recognizing manufacturing industry’s increasing demand for part measurement automation, with a higher degree of accuracy, has developed its Smart Factory Inspection System with true 6 Degrees of Freedom (6DoF) real-time 3D robotic measurement incorporating its proven metrology technology and calibration components.SFIS can be delivered as a customized integrated solution or as a standard production inspection cell.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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Automotive Tester
An automotive tester can be used to inspect one or more aspects of an automobile. For example, a borescope automotive tester is an automotive inspection camera used by auto body mechanics to see inside car, truck and other vehicle engines before removing any engine parts. Other kinds of automotive tester devices are used to adjust belt tension, test the electronic ignition starter, search for air conditioning leaks, measure the force required to press a brake pedal, determine the antifreeze concentration, or check the paint thickness over collision repairs.PCE Instruments (PCE) offers a wide variety of automotive tester products. These diagnostic support tools help professional automobile mechanics identify a number of vehicle repair needs. PCE's automotive tester products can aid in the diagnosis of many different mechanical and electrical system issues, including but not limited to locating the cause of an engine misfire, testing fuel injector resistance, pinpointing an engine coolant leak, or detecting car cylinder head problems. It's no wonder so many auto repair technicians choose to stock theirs shops and garages with PCE automotive tester products.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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3D Metrological Software
InnovMetric PolyWorks
Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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Automated Optical Inspection System
506
We are proud to introduce the latest member of our model 505 AOI product family, the 506. This system was developed to provide a high coverage, easy to program AOI system for the larger backplanes / backpanels being produced today.
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Non-Destructive Test Resonant Inspection System
RAM-AUTO
Resonant Acoustic Method is designed to help deliver fully inspected parts, economically and on time. Every component has a unique resonant signature or pattern that reflects its composition.
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Ground Grid Tester
GGT Series
The GGT500 ground grid integrity tester is designed for inspection of the substation ground grid. It can also be used as a portable micro-ohmmeter with Both Sides Grounded and Remote Control functionalities. It is intended to inspection the conditions of a grounding system beneath substations, testing of medium- and high-voltage circuit breakers, disconnecting switches, high-current bus bar joints, cable splices, and different high-current links.In the United States when inspecting the quality of the grounding systems beneath a substation, the proper procedure is to inject 300 A DC during a time period of 60 s. This is what the GGT500 will do, and in that time period, the current path and voltage drop are checked. Also acting as a micro-ohmmeter, the GGT500 can test low resistance values by producing high test currents of up to 500 A.The instrument is placed in an unbreakable, plastic case with IP67 protective rating (with closed lid). Although very portable and lightweight, micro-ohmmeters have very high output power capabilities. High output voltage enables a wider measurement range at higher test currents, as well as the use of thinner/longer test cables. GGT500 ground grid integrity tester generates a true DC ripple-free (less than 1 % ripple) current with automatically regulated test ramps. This significantly decreases magnetic transients and ensures great accuracy.When used for testing in Both Sides Grounded conditions, a special current clamp powered from the ground grid integrity tester is used for measuring a current through groundings. If even a higher safety level is required, the remote control feature enables the operator to perform measurements from a distant location, away from the instrument and test object.
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Non Destructive Testing (NDT)
NDT covers a wide group of testing techniques used to evaluate the properties of a material, part, product, weld or system without causing damage. NDT carried out at KLL includes:Liquid Penetrant Testing (LPT) is used for the detection of surface breaking discontinuities on magnetic and non-magnetic metallic materials.Fluorescent and colour contrast penetrants are available to be used in the following methods:-Water washableSolvent removablePost emulsifiableMagnetic Particle Inspection (MT/MPI) is used for the detection of surface breaking and slightly sub-surface (up to 2mm) discontinuities.Bench type crack detectors and portable units are employed producing various waveforms (i.e. A.C, HWDC and induced magnetic flow) to give both circular and longitudinal magnetism.On-site testing is carried out using electro magnetic yokes and permanent magnets producing induced magnetic flow.Ultrasonic Flaw Detection (UT), also known as Ultrasonic Inspection, is used for the detection of volumetric discontinuities in ferrous and non-ferrous products (forgings and castings etc.), and welds in magnetic and non-magnetic materials.UT is capable of penetrating metals, dependent on the material characteristics, up to 10m in length.Some thickness and depth checks can also be carried out using ultrasound.Radiography services are available through sub-contract booked in advance. Notice is required for on-site work.Personnel are available at short notice for in-house or on-site work in the UK and overseas.All inspectors undertaking non destructive testing (LPT, MT/MPI and UT) are qualified to, and meet a minimum of, PCN Level 2.PCN Level 3 supervision is available in-house for LPT, MT/MPI, UT offering consultancy services including procedure writing and commentary, auditing of techniques and Level 3 Supervisor cover.We can assist clients in product qualification, material testing, quality assurance and audit programmes.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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CMOS Dual USB3 Cameras
CELERA
CELERA CMOS Dual USB3 cameras provides unrivaled speed, extreme flexibility and quick system integration. Its double USB3 interface, ultra-fast acquisition rate, extremely reduced dimensions and rugged design make CELERA cameras suitable far the most demanding applications: automated optical inspection, high performance sorting systems, industrial metrology, microscopy, medical diagnostics and machine vision. CELERA cameras are powered directly by the USB3 bus eliminating the need for external power adapters. USB3 provides the most cost effective and widespread interface, pushing speed performances at the top.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Reelsurance
LCi-18 RFID
Reelsurance LCi-18 RFID Label Counting and Inspection System with Tagsurance verifies the tag operation sensitivity using communications tests at several frequency and power level combinations with high resolution, stability and high speed. The system provides also accurate label counting, missing label detection and label dispensing of required quantities.
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MXI Computerized Tomography (CT) Option
The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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LED LIGHT DISTRIBUTION TESTER
Essential elements among LED inspection categories are the light quality and intensity. Accurate measuring for optical characteristic requires diverse photo-measurement technology which fits into production lines. This system extracts conditions necessary for optical measuring optical characteristics on production equipment through accurate measurement both of the quality and of intensity of LED light distribution characteristics.
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In-Line X-ray Inspection System for Secondary battery
X-eye 9000 Series
X-ray Tube100 kV / 200 µAMin. Resolution5 µmInspection Ability120ppm , 150ppm, 180ppmSystemConveyor / Index / Pick&Place 방식 LoadingDimension1,800(W) x 1,560(D) x 2,070(H)mm / 5,000kg
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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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Vision Measurement
CMM Camera System
Aberlink’s camera system offers a non-contact facility on any Aberlink CMM. A innovative design of magnetic, kinematic joint allows the probe and camera to be swapped in just seconds. This means that components can be inspected using both touch trigger and vision inspection technology on the same machine.
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3D Solder Paste Inspection (SPI)
TR7007 SII
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system's hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
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Machine Vision
What is machine vision: Image-based vision system solutions to help you meet all inspection and traceability requirements for high customer satisfaction.
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Portable 3D Scanner
ATOS Compact Scan
With the ATOS Compact Scan, GOM presents a portable 3D scanner for full-field measurement and inspection. This lightweight and compact overall solution opens up complete new application areas and offers the user various possibilities for 3D digitizing and analyses of parts, tools and systems. Even in cramped spaces or interiors, the compact solution of the ATOS series allows fast and precise measuring of surface geometries.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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Automated Metrology System
EVG®50
High-throughput, high-resolution metrology for bonded stacks and single wafers. The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG''s high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications. The tool''s application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.
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Vision Inspection Products
Vision inspection systems use a series of high-speed cameras and imaging software to detect and measure random objects as they move along a conveyor belt. Custom software and measurement algorithms can determine the size, shape, color or composite measurement of any object and convert this into standard units for quality control. Bench, over-line, and in-line systems are available and provide real-time 100% inspection and rejection of any production line.
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Surface Defect Inspection System
Wafer for inspection of surface condition of specular flat substrate, glass substrate, others φ 100 ~ φ 300 compatible