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Dimensional Metrology
Stand-Alone Metrology Family
Nova Measuring Instruments Inc.
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Pure Boron Foils
MICROMATTER™ boron foils are also produced by laser plasma ablation; however, the deposition process is much more complex and time consuming than that for diamond-like carbon. Accordingly, only thin films, mainly designed for beam stripping of heavy ions in electrostatic accelerators, are available. All films are generally delivered on glass substrates coated with a release agent.
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Plasma CVD & Reactive Ion Etching System
MODEL DRIE-1100-LL-ECR
The Tek-Vac DRIE-1100-LL-ECR series systems are designed for both high-density plasma chemical vapor deposition and reactive ion etching of sub-micron integrated circuits, optical devices and RF microwave electron devices.
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Process Sense™ NDIR End Point Detector For Chamber Clean
The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring
IR-400
The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. This reduction in cleaning gas usage leads to a reduction in chamber damage and increases the life times of all the systems components.
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Process Particles Suspensions
Process Particles™ Suspensions are used as particle material standards. They represent real-world contaminant particles encountered in semiconductor device fabrication processing. Deposition of these particles on wafers and reticles enables characterization of the material-dependent response of a surface inspection system when accurate particle size or particle sphericity are of secondary importance. They consist of broad size distributions of irregularly shaped solid particles suspended in ultra-pure water (UPW). Each bottle contains a suspension volume of 100 mL.
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Ozone Generators & Systems
MKS offers a wide range of ozone generators and modular delivery systems which produce ultra-pure, reliable ozone gas. In the clean semiconductor environment, Ozone reacts with a wide range of precursor gases resulting in the creation of Al2O3, ZrO2, HfO2, and La2O3 metal oxides to enable thin film deposition processes like Atomic Layer Deposition (ALD) and Etch (ALE). MKS’ generator uses Grade 6 gas, enabling the creation of higher film density improving product yield. Photovoltaic and Display manufacturing leverage semiconductor best practices and utilize ozone to create enhanced thin film barriers, improving product performance and reliability.
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Physical Vapor Deposition Systems
Physical Vapor Deposition Systems offer maximum flexibility for a wide range of thin film deposition applications with advanced process capabilities, unsurpassed uniformity and multiple deposition modes.
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Digital mammography system
AMULET
The new format FPD has a proprietary panel structure with a double layer of amorphous selenium that has high X-ray absorption properties, and was developed by combining Fujifilm''s "Device Development Technology" and "Vacuum Deposition Technology." The first layer efficiently converts X-rays into electrical signals, while the second layer employs the unique "Direct Optical Switching Technology," that captures higher resolution and lower noise image electrical signals rather than using electrical switches such as conventional TFTs. By achieving both "50µm fine pixel size (higher resolution) and low noise," the AMULET system can show microcalcifications and tumors in greater detail, both significant indicators for early diagnosis of breast cancer.
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Ozone Gas Delivery Systems
MKS ozone gas delivery systems provide field-proven, high concentration, ultra-clean ozone generation for advanced thin film applications such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Tetraethyl Orthosilicate (TEOS)/Ozone CVD (HDSACVD), contaminant removal and oxide growth. Gas delivery models have integrated ozone concentration monitoring, flow control, and power distribution. Additional system options include safety monitoring, status indicators and ozone destruction capability.
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kSA RateRat Pro
kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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Excitation Sources
SPECS Surface Nano Analysis GmbH
o our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.
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Particle Deposition Systems
MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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kSA BandiT
The kSA BandiT is a non-contact, non-invasive, real-time, absolute wafer and thin-film temperature monitor used during thin-film deposition and thermal processing.
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GHW Series 13.56 MHz, 1.25, 2.5, And 5.0 KW High-Reliability RF Plasma Generators
The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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A Highly Versatile R&D Bell Jar Thin Film Coating System.
MODEL VES-3000
TEK-VAC's VES-3000 coater station model offers a modular concept for thin film deposition. Common PVD techniques which can be employed in this compact unit include thermal and electron beam evaporation. A 2KVA SCR controlled filament evaporation power supply is provided. Optional ion deposition and magnetron sputtering devices can be incorporated in the system.
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Pulsed-DC Systems
Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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Thin-film deposition
Plasma Source
SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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Copper PCB
The Amitron process is capable of producing 20 plus ounces of finished copper and reliably spray coat a protective and consistent solder mask with imaged nomenclature. Amitron utilizes a unique process referred to as "Laminated Deposition". This combination of processes allows extreme copper thickness requirements to become very practical and cost effective. The process utilizes heavy base copper that when placed in our plating and etching systems will deliver consistent and reliable high power circuits.
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In-Situ Spectroscopic Ellipsometer for Real-Time Thin Film Monitoring
UVISEL Plus In-Situ
The UVISEL Plus in-situ spectroscopic ellipsometer can be easily mounted on process chambers (PECVD, MOCVD, sputter, evaporation, ALD, MBE) for the real-time control of thin film deposition or etch processes.The UVISEL Plus in-situ provides the unique combinations of very high speed, sensitivity, dynamic range and accuracy making the instrument able to control deposition / etch at the atomic layer thickness level, even for rapid processes.
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High Power Microwave Plasma Source
The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Remote Plasma Sources For Process Applications
MKS remote plasma sources deliver high density reactive radicals improving on-wafer cleaning and deposition throughput. Solutions consist of a fully integrated, self-contained unit designed for quick on-chamber installation providing fast, reliable plasma ignition of O2, Hydrogen and Nitrogen gases in a customer configurable package. All solutions are equipped with intelligent power control and EtherCAT® diagnostics supporting Industry 4.0.
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Liquid Flow Controller
Built upon field proven technology, the Turbo™ Liquid Flow Controller (LFC) 2950 was engineered to pair with MSP Turbo II™ Vaporizers to provide a reliable, high-performance liquid vapor delivery solution for semiconductor thin film deposition processes (including CVD, PECVD, ALD, and MOCVD). The diagram below shows how the LFC fits into the liquid vaporization system MSP offers.
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Parylene Deposition Equipment
SCS offers Parylene deposition systems that range from a portable laboratory unit to production models for high-volume manufacturing applications. SCS Parylene deposition systems are designed for accurate and repeatable operation, featuring closed-loop monomer pressure control, which ensures deposition of the polymer film at a precise rate. Whether researching new coating applications or developing structures out of Parylene in the laboratory, or coating components in a production environment, SCS leads the industry with its state-of-the-art Parylene deposition systems.
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PLD Systems
Pulsed Laser Deposition
Is a versatile thin film deposition technique. A pulsed laser (~20 ns pulse width) rapidly evaporates a target material forming a thin film that retains target composition. This unique ability of stoichiometeric transfer of target composition into the film was realized first by the research team led by Dr. Venkatesan at Bell Communications Research, NJ, USA, nearly 30 years ago while depositing high temperature superconducting (YBa2Cu3O7) thin films. Since then, PLD has become the preferred deposition technique where ever thin films of complex material compositions are considered. Another unique feature of PLD is its ability for rapid prototyping of materials. The energy source (pulsed laser) being outside the deposition chamber, facilitates a large dynamic range of operating pressures (10-10 Torr to 500 Torr) during material synthesis. By controlling the deposition pressure and substrate temperature and using relatively small target sizes, a variety of atomically controlled nano-structures and interfaces can be prepared with unique functionalities.
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Custom Sensing And Imaging Solutions
Micro Magnetics has a proven track record of excellence in designing and developing new products and solutions based on our knowledge of magnetic devices and materials. We offer specialized solutions to meet our customers? unique needs. These solutions include single magnetic sensors, sensor arrays, custom electronics and packaging solutions, sensor processing (polishing, dicing, and lapping), and custom film and device deposition.
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High Temperature Absolute Pressure Transducers
Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Differential Quartz Crystal Microbalance
Dike
During an experiment to detect an affinity reaction on biological material, a molecule of interest is attached to the quartz crystal of the measurement channel, this deposition can be achieved by direct binding or by capture through another protein, the result of this process is to make the quartz sensitive to the molecule to be detected.
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
