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Chucks
Hold DUTs in place.
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TLP Probe Arm Kit
TPA-95
High Power Pulse Instruments GmbH
*Flexible pulse force, pulse sense combined TLP probe arm kit based on TPA-95L and TPA-95R*Compatible with typical standard micropositioner mechanical interfaces*4.7 kΩ pulse sense voltage divider, which results in a voltage transfer ratio of (4700 + 50)/50 = 95 : 1 into 50 Ω*Variable probe pitch configuration*1 m flexible 50 Ω cables with SMA connector for pulse sense*0.1 m flexible 50 Ω cables with SMA connector for pulse force*Tungsten probe tips*Can be used for chuck backside grounded TLP measurements
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Torque Gauges
Digital torque gauges are designed for clockwise and counter-clockwise torque testing. The Jacob’s chuck is a versatile attachment and can be used for a variety of applications.
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Probe Card Analyzers
PB6800
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tip geometries to be captured and accurately measured. Probilt’s PB6800 large measurement chuck allows probe arrays as big as 300 mm in diameter to be touched down without overhanging the chuck surface.
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Tabletop Front & Backside Mask Aligner
Model 200IR
The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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Optical Fiber Identifier
OrienTek Optical Technology Ltd.
Optocal Fiber Identifier Economical Solution for Integrated Fiber Preparation Tool Demand● 4 easy-change chucks for:bare fiber, patch cords & ribbon fiber● Identifies 3 common test tones● Identifies dominant traffic direction, audible alarm● Approximate core power reading● Low false detection & insertion loss● Very easy to operate● Battery low indication
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Hot Chucks
Materials Development Corporation
Probe stations to suit all measurement requirementswhether production, engineering or research. See individual data sheets for more details.
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Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
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Probe Station
EPS1000
Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided. - Maximum pcs of manipulators can be installed on the base unit of probe
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Spring Stiffness Testing Machine
STB Series
Jinan Testing Equipment IE Corporation
STB Computer Control Spring Stiffness Testing Machine Under Axial and Lateral Load is to measure the displacement stiffness of spring under both axial and lateral load, complying with the standard EN13298 Railway applications - Suspension components - Helical suspension springs, steel. The Spring Stiffness Testing Machine measures both axial and lateral stiffness of spring, displacement for both lateral and axial, both loads, offset angle etc. The Spring Stiffness Testing Machine is an ideal testing equipment for spring of chuck and train.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Metal Foil Chucks
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Tabletop Mask Aligner
Model 200
The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Heavy Duty RV Tire Pressure Gauge
DURABLE BUILD: Superior quality steel and components are protected by a rugged rubber guard; Tough, anti-slip grip holds up to any job; Built tough to measure from 0-230 PSI with accurate readingSPECIALIZED CHUCK: Extended chuck tip to form a great seal with no air leakage; Dual-head air chuck painlessly reaches all your vehicles' valves from any angle; Durable rubber hose and an extended head chuck make it easier to get a good fit on awkward valves
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Probing Solutions
ES62X-CMPS
The ES62X-CMPS compact manual probe station is a rugged wafer probing solution designed for high reliability, compact size and low investment cost. It enables manual wafer level measurements up to 300 mm wafers. The probing station can also be used for TLP, HMM, HBM, LV-Surge, RF, S-parameter and DC-measurements. Micro positioners with vacuum as well as magnetic base can be attached. The chuck has a vacuum interface for the wafer and is electrically isolated. Multiple 4 mm connectors can be used to connect a voltage potential to the wafer backside.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Voltage Voltmeter
Voltstik
The Voltstik is a distribution voltage voltmeter designed for use on lines and in substations. This meter is employed onto a line by using a hot stick and universal chuck adapter. It is capable of measuring voltage phase to phase, and phase to ground. This high impedance instrument is an excellent choice for solving multiple problems associated with operating a medium voltage system. Its key applications are defined under three groups, safety confirmation of the voltage present, troubleshooting voltage problems, and phasing.
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Probe Station
EPS300
Reasonable price and compact design. - Sellectable chuck size : 4inch, 6inch, 8inch when ordering probe station. - Hot chuck can be installed. Temp range: RT ~ 300°C - Hot and cool chuck from 0 °C ~ 300 °C can be provided.
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ECHO VS System with Image Enhancement
Echo VS
The ECHO VS system adds our Image Enhancement Suite to the ECHO platform to provide industry-leading image quality and defect identification capabilities. It’s our most accurate ultrasonic NDT equipment for development labs and for production environments that require the highest precision. The Echo system can be fitted with an optional chuck for manual wafer inspection.
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C-V Plotters
Materials Development Corporation
MDC will tailor your CSM/Win Semiconductor Measurement System for your exact requirements. Choose the best capacitance meter, output device, and probe station for your needs. All CSM/Win C-V plotters feature the latest Dell Computers. The computer and capacitance meters are rackmounted in one compact enclosure. When ordered with a hot chuck or probe station, MDC can deliver a turnkey system of unparalleled performance.
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Fully Automatic MRAM Probe System
*This system can measure MRAM characteristics automatically.*Generates strong and constant magnetic fields. (Max 1.5T, the highest in the industry)*Performs high speed sweep of magnetic field by using non-magnetic materials wafer chuck. (Max 4Hz, ±1T, the highest in the industry)
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Coordinate Measuring Machines
ScopeCheck® V
Precise measurement of cylindrical workpieces (tools, shafts etc.) using application-specific sensors in a production environmentHeavy duty granite base with CNC air bearing rotary axisIntegrated vertical rotary axis for rapid measurement of diameters, planes, holes, and cutting and clearance angles with optical and tactile sensorsAll industry standard tool holders and chuck systems are available on the rotary axisUnique design allows easy integration of additional sensors for increased flexibilityProtected enclosure for measurement on the production floor
