System-on Chip
A complete computer "System on a Chip".
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Product
Anti-Surge High Power Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Anti-Surge High Power Thick Film Chip Resistors by Panasonic
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Product
32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Metal Foil Llow Resistance Chip Resistor
MFR (Metal foil)
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*Low Resistance / TCR / EMF 9only FOR MnCu) / Inductance*Excellent long term stability*RoHS compliant and halogen free.*Lead free.* High precision current sensing and voltage division.
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Product
Current Sensing Chip Resistors
CS
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*3W rating in 1W size, 1225 package*High purity alumina substrate for high power dissipation*Long side terminations with higher power rating
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Product
Metal Foil Low Resistance Chip Resistor
MFF
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*Low Resistance / TCR / EMF / Inductance*Excellent long term stabilityRoHS compliant and halogen free.*Lead free.*High precision current sensing and voltage division.
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Product
4G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L4GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
10G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
10G DFB Laser Diode Chips by GLSN
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Product
ISDN Chip Set
Emutel Symphony
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Emutel Symphony is a convenient and flexible Basic Rate ISDN, Primary Rate ISDN and Analog PSTN network simulator. With support for S, U, E1, T1 and PSTN analog interfaces you can use the Emutel Symphony to test and develop a full range of ISDN(E1/T BRIS BRIU) and PSTN analog (FXS) equipment.
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Product
Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic offers a wide range of Chip Resistors including conventional Thick Film Chip Resistors, Specialized Resistors such as Thin Film, Current Sense, Anti-Sulfur, Anti-Surge and Metal Film Chip Resistors.Panasonic’s standard Thick Film Chip Resistors are offered in cases sizes from 01005 to 2512.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L4GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
32GB SO-DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-SD4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
8G DDR5-4800 288Pin 1GX16 1.1V Unbuffered Samsung Chip
AQD-D5V8GN48-SC
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
4G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L4GE16-SG
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DDR3-1600 ECC, 240-Pin, Samsung Chip.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L8GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8,Samsung Chip,
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Anti-Sulfurated High Power Wide Terminal Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
6 Chip Detection and Burn Channels
CD1
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The CD1 provides 6 Chip Detect and Fuzz Burn interface(s). A Chip Detector (CD) is a magnetic-electrical device that provides a reliable method of detecting impending failure of bearings and gears.
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Product
2.5G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
2.5G DFB Laser Diode Chips by GLSN
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Product
Metal Glazed High Voltage Chip Resistors, Anti-Sulfuration
SMG Series
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*Flameproof UL94VO molded package, resistance to sulfuration, heat and humidity.*Special design for automatic surface mounting.*Metal-glaze elements provide high stable performance against environmental conditions and overload.Excellent mechanical strength & electrical stability.*Reducing assembly costs.
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-D3L8GN16-SG1
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DDR3 1600Mhz Unbuffered DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V16GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
32GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V32GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
4G SO-DDR3-1600 204Pin 512MX8 1.35V ECC Samsung Chip
AQD-SD3L4GE16-SG
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DDR3-1600 ECC SO-DIMM, 204-Pin, 512MX8, Samsung Chip.
