System-on Chip
A complete computer "System on a Chip".
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Product
Chip Inductors
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Our range of various chip inductor products contain the very latest in wire-wound technology and Ceramic or Ferrite Core, thus providing the ultimate in performance demanded by today’s Wireless products. The Inductors provide high Q and SRFs in an industry standard size and footprint.
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Product
Chip Test Adapter
RAMCHECK Sync
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The RAMCHECK Sync Chip Adapter tests popular TSOP SDRAM memory chips in sizes of 16Mx16, 4Mx16, 32Mx8, 8Mx8, 64Mx4, 16Mx4 and more. Picture above shows the adapter with all optional sockets for 54, 50 and 44-pin.
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Product
High Precision Thick Film Chip Resistors
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Panasonic Industrial Devices Sales Company of America
An AEC-Q200 Compliant SeriesPanasonic components specified as AEC-Q200 Compliant are consistently designed into automotive systems. However, today’s Design Engineers are specifying AEC-Q200 components to meet the high-quality standards of devices beyond automotive applications.
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Product
8 Bit IO Port Chip
PCF 8574
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The Philips PCF 8574 is an easy to use 8 bit IO port chip. An advantage over many more recent chips is 5V operation, that give you far more drive.
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Product
Chip Manufacturing
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KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Product
8G SO-DDR3-1600 204Pin 512MX8 1.35V Unbuffered Samsung Chip
AQD-SD3L8GN16-SG1
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DDR3 1600Mhz Unbuffered SO-DIMM, 30μ" gold plating thickness, 1.35V power consumption, Samsung original chip.
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Product
Wafer Chip Inspection System
7940
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Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
32G DDR5-4800 288Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-D5V32GN48-SB
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Samsung Original Chip, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Capacitors - Binary Chip
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Macom Technology Solutions Holdings Inc.
MACOM’s BOO and BSP Series Capacitors are designed to facilitate bread-boarding or to use where a trimming capability is required. These devices feature the same dielectric layer and bonding surfaces as our 9000 and 9100 Series chip capacitors. By connecting the pads in parallel, the capacitance values are additive, so many combinations are possible.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
Chip Inspection System
GEN3000T
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GEN3000T is an inspection system that performs automatic inspection of individual semiconductor chips.This revolutionary chip surface inspection system was achieved by combining the chip handling technology cultivated by Toray with the inspection algorithm used in the "INSPECTRA®" wafer defect inspection system.
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Product
16GB DDR5-5600 288Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-D5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Radar Core Chips
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Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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Product
Chip Inductors AECQ200 Compliant
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Bourns products include surface-mount chip inductors, power chokes, chip beads, chip bead arrays, as well as radial-leaded and axial-leaded inductors. These components are used in computer, communication, instrumentation, industrial, and medical applications.
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Product
16GB SO-DIMM DDR5-5600 262Pin 2GX8 1.1V Unbuffered Hynix Chip
AQD-SD5V16GN56-HB
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
Chips and Diodes
NC100/200/300/400 Series
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Noisecom's noise diodes are the fundamental building blocks for analog noise systems. They are sorted for performance characteristics that enhance their broadband noise output and flat spectral response. All Noisecom noise diodes can deliver symmetrical white Gaussian noise and flat output power versus frequency
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Product
Chip Resistor Networks
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Panasonic Industrial Devices Sales Company of America
Chip Resistor Networks by Panasonic
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Product
Battery Management Chip Module
Sentinel
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The first single system on chip module. Measures cell voltage, cell internal temperature and cell impedance.
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Product
8G DDR3-1600 240Pin 512MX8 1.35V ECC Samsung Chip
AQD-D3L8GE16-SG
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DDR3-1600 ECC, 240-Pin, 512MX8, Samsung Chip.
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Product
8GB DDR5-5600 288Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-D5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
32GB SO-DIMM DDR5-4800 262Pin 2GX8 1.1V Unbuffered Samsung Chip
AQD-SD5V32GN48-SB
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Samsung Original Chip, Dual 32-bit Subchannels, Increased Banks and Burst Length. DDR5 4.8GT/s, Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
16G DDR5-4800 288Pin 2GX8 1.1V Registered Samsung Chip
AQD-D5V16GR48-SB
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Samsung Original Chip, Dual 32-bit Subchannels. Increased Banks and Burst Length, DDR5 4.8GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
25G DFB Laser Diode Chips
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Guilin GLsun Science and Tech Group Co., LTD
25G DFB Laser Diode Chips by GLSN
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Product
Thin Film Chip Resistors, High Voltage Type
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Panasonic Industrial Devices Sales Company of America
Thin Film Chip Resistors, High Voltage Type by Panasonic
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Product
High Voltage Thick Film Chip Resistors
HVTK (HVR)
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*Highly reliable multilayer electrode construction*Higher component and equipment reliability*Excellent performance at high voltage*Reduced size of final equipment
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Product
Thermal Test Chip
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Thermal Engineering Associates, Inc.
Thermal Test Chips (TTC) are used in many different Applications: Package Thermal Characterization, Heat Source Simulator, Temperature Reference Platform, Transient Analysis, System Thermal Management Design, Thermal Interface Material (TIM) Measurement & Characterization, Heat Sink Measurement & Characterization.
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Product
Thin Film/Metal Film Chip SMD Chip Resistors
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Panasonic Industrial Devices Sales Company of America
Panasonic’s industry leading Thin-Film Chip Resistors features include high reliability at high temperature and high humidity as well as high accuracy, low current noise and excellent linearity. Panasonic’s High Precision Thin Film Resistors are designed for robust applications where long life is crucial in markets such as automotive, appliance or industrial. These Resistors boast a high accuracy of up to 10ppm, 0.05% making them one of the best-in-class Resistors on the market today. Panasonic Thin-Film Resistors are available in case sizes down to 0201. Compliant standards include: IEC 60115-8, JIS C 5201-8, and EIAJ RC-2133B. These Resistors are AEC-Q200 Certified.
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Product
Chip Resistor Networks/Arrays
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Panasonic Industrial Devices Sales Company of America
Panasonic’s Chip Resistor Arrays are offered in cases from 0201 to 0805. The smaller 0201 case sizes are available with flat terminations and all other case sizes are offered with either convex or concave terminations. The EXB Series Resistor Arrays are available in 2, 4, or 8 Resistors per package. These Resistor Arrays allow for an improvement of the placement efficiency. Compliance Standards include: IEC 60115-9, JIS C 5201-9, EIAJ RC-2129, AEC-Q200 and RoHS.Panasonic’s Resistor Networks are available in 8 or 15 bussed Resistors and are recommended for all pull up/down circuits.
