Burn-In Sockets
See Also: Test Sockets, Burn-In, BGA Test Sockets
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-512-FL
The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Advanced Burn-in and Test System for packaged parts
ABTS-Li
High power logic individual temperature control
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4-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC964-512-FL
The IPC964-512-FL is a 4-slot fanless barebone system with modular design and optimized expandability. The rugged industrial PC supports the high-performance 7th/6th generation Intel® Core™ and Celeron® processors with the Intel® Q170 chipset. The IPC964-512-FL features dual DDR4-2133 SO-DIMM slots with up to 32GB memory. For easy cabling and maintenance, the IP40-rated embedded system features a wide choice of front-accessible I/O interfaces, including two Gigabit LAN ports, four USB 3.0 ports, one VGA, one HDMI, one audio (Mic-in/Line-out), and three optional I/O modules - a 4-port isolated RS-232/422/485 module, an isolated 8-in/8-out DIO module, and a 2-port isolated RS-232/422/485 and 4-in/4-out DIO module. The compact industrial PC also provides four flexible PCI/PCIe expansion slots with three different combinations of expansion kits: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; and two PCI. Additionally, it has a full-size PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections, and comes with two easy-swappable 2.5” HDD trays for storage. To fit various industrial environments, the rugged modular industrial PC supports 24VDC (uMin=19V/uMax=30V) power input with a lockable terminal block-type connector and a wide operating temperature range of -10°C to +60°C.
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Burn-In Boards
Meets burn-in requirements, including extreme temperatures or continual handling. 2 or more layers of polyimide. 200 C maximum temperature. Gold-plated connectors.
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Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
510109359
Module Accessory Kit, 26 4-40x .750" Socket Head Cap Screws
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Surface Mount Ball & Socket Test Point
SMOX
SMOX is a unique select on test terminal which provides accurate line tests in PCB assembly. Supplied loose or on tape and reel for ease of assembly, its unique retention mechanism enhances reliability through low stress contact.
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Fanless Embedded System With LGA1150 Socket 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H81, 2 HDMI/ VGA/ DisplayPort, 2 GbE LANs, USB 3.0, CFast™ And PCI Express Mini Card
eBOX635-881-FL
The eBOX635-881-FL supports the 4th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® processor with Intel® H81 chipset. The super light yet compact eBOX635-881-FL comes packaged in an IP40-rated aluminum and cold-rolled steel enclosure and is designed to operate at temperatures ranging from -20°C to +50°C for use in the extremely environments. The fanless embedded system supports six jumper-less RS-232/422/484 and sixteen DI/DO ports along with three display outputs of two HDMI, DisplayPort and VGA for applications used in transportation, POS, kiosk, industrial control automation and medical equipment. Two PCI Express Mini Card slots are added to the system for greater expansion capability. One SIM slot is also available for 3G/4G, GPS, Wi-Fi and Bluetooth applications, allowing for more efficient networking options.
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Memory Burn-In Tester
H5620/H5620ES
As Server and Mobile applications have mainly led the Memory and market has also entered a super cycle that has completely withdrawn from the previous silicon cycle.Memory capacitance will continue to rise as the application of data processing and mobile communication occurs—however, revenue will not grow as ASP goes down. Suppliers need to reduce test costs and increase profits.H5620 contributes to reduction of test cost by integrating the test process of DRAM Burn-in and Core Test. This hybrid memory test solution solves the challenge of reducing test costs while increasing test efficiency in the expanding DRAM market.
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3.5" Embedded SBC With LGA1151 Socket For 7th/6th Gen Intel® Core™ I7/i5/i3 Processor, LVDS, VGA, HDMI, 2 GbE LANs And Audio
CAPA500
The CAPA500 features the LGA1151 socket 7th generation Intel® Core™ processor family (codename: Kaby Lake) with 35W TDP (thermal design power), as well as the Intel® H110 chipset (Q170 optional). The CAPA500 supports one 260-pin DDR4-2400 SO-DIMM with a memory capacity up to 16GB for extensive storage. The compact 3.5-inch embedded motherboard also offers display outputs through HDMI, VGA and LVDS for triple independent display applications. Moreover, the compact-sized embedded board runs on +12 VDC power, supporting auto power-on. It can operate at a wide range of temperatures from -20°C to 60°C under active thermal control. The 146 mm x 104 mm embedded SBC is suitable for IoT/M2M-related, industrial control, self-service terminal, digital signage, POS, kiosk and many other applications where high-speed processing and graphics performance under limited space is required.
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Fanless Embedded System With Socket G2 Intel® Core™ I7/i5/i3 & Celeron® Processor And 4 GbE LANs
eBOX660-872-FL
A high-performance fanless embedded system with 3rd Generation Intel® Core™ processor (Ivy Bridge), the eBOX660-872-FL, is presented by Axiomtek earnestly. It incorporates the 3rd Generation Intel® Core™ processor (i7/ i5/ i3) or Intel® Celeron® processor with Intel® HM76 Express chipset, propelling computing with better processing. With the great graphics computing capability and dual view support, this fanless embedded box computer is especially suited for automatic optical inspection, digital signage (DS), digital surveillance, gaming, automation control and POS/Kiosk. In addition, this application-ready compact rugged platform also targets for nearly any field of industrial embedded applications like embedded controller, factory automation and more fields.
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Open Pluggable Specification (OPS) Digital Signage Player With Socket G2 Intel® Core™ I5/i3 & Intel® HM65
OPS860-HM
The OPS860-HM Open Pluggable Specification (OPS) compliant signage player delivers high performance without the high cost of installation and maintenance. This signage player supports 2nd generation Intel® Core™ i5/i3 processors with Intel® HM65 Express chipset and has a DDR3-1333 system memory that can expand up to 4GB. The OPS860-HM connects to any OPS compliant display via a standardized JAE TX-25 plug connector, and includes HDMI/DVI, DisplayPort, UART, audio, and USB 2.0 signals. Compliant with standard OPS architecture, the OPS860-HM delivers greater interoperability and allows for easy upgrade and replacement without the need to dismantle the entire signage system.
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ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® H110, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB501
The IMB501 is powered by the LGA1151 socket 7th/6th generation Intel® Core™ i7/i5/i3, Pentium® & Celeron® processors with Intel® H110 chipset. The IMB501 utilizes two high bandwidth 288-pin DDR4-2400/2133/1866 with system memory up to 32GB to meet the needs for high memory capacity and high data transfer speed. The upcoming industrial-grade ATX motherboard offers long-term support and upgradeability that can ensure the best performance and lifespan for its extended industrial computer system. To allow flexible and rapid development of custom functions, the industrial-grade ATX motherboard comes with rich expansion options including one PCIe x16 slot, two PCIe x4 slots (only support x1 signal), four PCI slots, and one PCI Express Mini Card slot. The ATX mainboard is suitable for industrial automation, factory automation, advanced communication, gaming, entertainment, POS/kiosk, surveillance, medical, just to name a few.
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Evaluation Modules And Sockets
Figaro USA offers a wide range of evaluation modules and sockets for test use.
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USB-Mini Type B (With PCB Adapter And Socket) Test Connector
Test connector for Mini USB type B with PCB adapter and socket (5 pole) for contacting Mini USB Interfaces. Application in smaller Mini-USB devices like cameras, mobile phones, radios, hard disks etc. Comes in two versions.
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Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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Fanless Embedded System With LGA1150 Socket Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, 2 HDMI/VGA/DisplayPort, 4 GbE LANs, 6 USB 3.0, Wide Range DC-in And PCIe Mini Card
eBOX670-883-FL
The eBOX670-883-FL supports the LGA1150 socket type for 4th generation Intel® Core™ i7/i5/i3 and Celeron® processors (formally codename: Haswell) with Intel® Q87 Express chipset. Under this rich support system, the eBOX670-883-FL allows wide operating temperature ranging from -40°C to +55°C for the most endurable operation. The outstanding embedded controller comes with four 10/100/1000 Ethernet ports, Jumbo Frame (9.5K), PXE Remote Boot, Teaming, and wake-on-LAN (WOL) function to highly enhance its network connection speed. Additionally, the eBOX670-883-FL supports up to three independent hi-resolution displays or a 4K display. Undoubtedly, this rugged fanless embedded computer is the best solution for any industrial field, including host computers, cloud computing servers, multimedia applications, and automation systems.
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Custom Sockets
Plastronics socket designs range from off-the-shelf sockets ready for immediate delivery, semi-custom sockets that utilize universal components and totally custom one-of-a-kind sockets and fixtures.
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Module Accessory Kit, Quantity 26, 4-40 x .50" Socket Head Cap Screws Stainless Steel
510109495
Used with modules: 510108240.
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2U Rackmount Network Appliance Platform With Dual LGA3647 Socket Intel® Xeon® Scalable Processors, Intel® C621 (Purley) And Up To 66 LAN
NA860
The NA860 offers a perfect mixture of performance, flexibility, and durability with server-class dual LGA3647 socket Intel® Xeon® Scalable processors and Intel® C621 chipset (codename: Purley). It is robust and highly reliable for use in a wide range of network applications such as SDN, NGFW, IDS, IPS, UTM, etc. Designed with flexibility in mind, the 2U rackmount network computing system is capable of managing numerous connected computers through an integration of up to eight expandable NIC modules which support a maximum of 66 LAN ports. These NIC modules feature support for copper, fiber, bypass, 1G/10G/40G Ethernet speeds, and hardware acceleration. The NA860 comes with twelve high-capacity DDR4-2400 R-DIMM slots with up to 384GB non-buffer non-ECC/ECC memory. Moreover, there are two hot-swappable 2.5-inch SATA HDD trays, one mSATA slot and one optional 3.5-inch SATA HDD tray for sufficient storage. Two PCIe x8 expansion slots are available for add-in cards.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Test Socket Lids
For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
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Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Pin-Line™ Collet Socket with Solder Tail Pins
Series 0513
Pin-Line Collet Sockets with Solder Tail Pins. Features: Rows of socket strips may be mounted on any centers and are end-to-end or side-by-side stackable for .100 [2.54] grid or matrix patterns. Available with solder tail or wire wrap pins. Consult Data Sheet No. 12014 for wire wrap pins. Break feature allows strips to be cut to the number of positions desired.
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ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™ Processor, Intel® Q370, USB 3.1 Gen2, SATA 3.0, Dual LAN, VGA, DisplayPort++, DVI-D, And HDMI
IMB520R
The IMB520R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® Q370 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It supports three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
AMSTX-CF Series
Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
