Semiconductor
active or passive elements connected as an electronic circuit using a crystalline subtance, eg. silicon or germanium.
See Also: iJTAG
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Product
PXI-2535, 544-Crosspoint, 1-Wire PXI Matrix Switch Module
778572-35
Matrix Switch Module
544-Crosspoint, 1-Wire PXI Matrix Switch Module—The PXI‑2535 is a high-density 4x136 PXI matrix switch module that is ideal for routing low-power DC signals in validation test systems of mass produced devices such as semiconductor chips and printed circuit boards (PCBs). Featuring field-effect transistor (FET) relays, the PXI‑2535 offers unlimited mechanical lifetime and switching speeds up to 50,000 crosspoints/s. It also features onboard relay counting for relay monitoring and deterministic operation with hardware triggers to improve test throughput.
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Product
Amplifiers
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We have designed and manufactured amplifiers using all major semiconductor materials, LDMOS, GaN, GaAs, and InP, to produce narrow, wideband, and pulse, receive and transmit amplifiers from 1 MHz to 220 GHz and power levels from mW to over 10 kW.
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Product
Semiconductor CharacterizationSystem
Keithley 4200
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Materials Development Corporation
The MDC CSM/Win-4200 System integrates the extraordinary power of the CSM/Win softwarewith the power of the new Keithley 4200-SCS. Measure capacitance, voltage, and current down to sub-femtoamp levels.
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Product
Elemental Analyzers for Carbon, Sulfur, Oxygen, Nitrogen and Hydrogen
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HORIBA Scientific provides inorganic elemental analyzers for a wide range of applications based on the inert gas fusion technique and high frequency heating combustion in oxygen stream.The EMIA Series for Carbon and Sulfur analysis and EMGA Series for oxygen, nitrogen and hydrogen analysis strongly rely on HORIBA’s experience as a pioneer in Non-Dispersive Infrared (NDIR) technology. Both EMIA and EMGA designs meet all requirements for the metallurgical industry. These instruments also help scientists working in other application fields such as semiconductor, battery materials, ceramics and more.
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Product
Millimeter-Wave Automated Accelerated Reliability Test Systems
nm-Wave AARTS System
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AARTS fully integrated, automated, turnkey system provides flexibility and accuracy in determining RF and DC performance degradation with aging to predict life expectancy for compound semiconductor devices. Our millimeter-wave Automated Accelerated Reliability Test Systems (AARTS) and fixture solutions are available in standard frequency ranges from 26.5 to 67 GHz.
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Product
64-Axis PCIe EtherCAT MainDevice Motion Controller
PCIe-8338
Motion Controller
ADLINK PCIe-8338 is a hardware-based EtherCAT motion controller able to support up to 64 synchronized axes and over 10,000 points simultaneously. The PCIe-8338 features dedicated isolated emergency stop input (EMG), and configurable isolated high-speed digital input as not only generic sensor input but also pulsar input, with up to 1MHz input frequency. Optimum jitter control is provided in minimal cycles of 250µs to optimize synchronous I/O performance for vertical automation applications in semiconductor, electronic manufacturing, and others. The PCIe-8338 provides an out-of-shell application-ready (APS) function library to generate multi-dimensional, highly synchronized, time-deterministic event-triggered motion & I/O control. A wide range of compatible 3rd party SubDevice are easily designed with ADLINK's APS function library. ADLINK's MotionCreatorPro 2 utility is fully compliant with the Microsoft Windows environment, that allows complete EtherCAT motion and I/O configuration and function evaluation as well as compiling program download functions.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Mixed Signal Test Systems
MTS1010i
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The MTS-1010i is a more economical version of the MTS-2010i & MTS-1020i testers. It has a reduced platform size and reduced power supplies. Like the other testers in the MTS family it is a highly cost effective production ATE designed for testing high-volume linear and mixed signal semiconductor devices (Op Amps, high-voltage drivers, DAC, ADC, etc.), both at the wafer sort and final test stages of the manufacturing process.
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Product
Probe Cards
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Probe cards are the key in measuring reliability in the ever-evolving testing of semiconductor integrated circuits, which are becoming faster, more compact, and more efficient. We provide a variety of probe cards tailored to customer needs and test environments, always at the highest level of quality.
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Product
Static Control Devices
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Panasonic Industrial Devices Sales Company of America
There are many production processes where electrostatic charges disturb smooth operation. To eliminate static, Ionizers are used.Whether the application is for the Semiconductor industry where the components are extremely sensitive and can even be damaged by high electric static charges or for the packaging industry, where plastic sleeves or foils tend to stick to each other, Panasonic has a solution to neutralize electrostatic charge.
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Product
TDR System
TS9001
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The system accurately analyzes the wiring quality of various leading-edge semiconductor packages such as Flip Chip BGA, wafer level packages, and 2.5D/3D ICs using terahertz technology. It is a TDR analysis system that has the world’s top-class signal quality.
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Product
Auto Macro Wafer Defect Inspection
EagleView
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EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
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Product
Total Reflection X-ray Fluorescence (TXRF) Services
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A highly surface-sensitive technique, TXRF is optimized for analyzing surface metal contamination on semiconductor wafers.
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Product
Rad Hard GaN FETs
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Wide band gap semiconductor technologies such as Gallim Nitride Field Effect Transistors (GaN FETs) have been gaining interest for power management and conversion in space applications. These devices feature higher breakdown voltage, lower RDS(ON) and very low gate charge enabling power management systems to operate at higher switching frequencies while still achieving higher efficiency and a smaller solution footprint. There is an additional benefit from GaN devices that make them attractive to the space market. These devices are inherently immune to total ionizing dose radiation.
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Product
5.0 MP Google Coral Camera
E-CAM50_CUCRL
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e-CAM50_CUCRL is a 5MP 4-lane MIPI CSI-2 fixed focus color camera for Google Coral development board. This camera is based on 1/2.5" AR0521 CMOS Image sensor from ON Semiconductor® with built-in Image Signal Processor (ISP). This high performance ISP helps to bring out the best image quality from the sensor and making it ideal for next generation of AI devices.
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Product
Semiconductor Test
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Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.
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Product
Analysis
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External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Product
PXI Switched Guard Reed Relay Module, 16x 2:1 Multiplexer
40-121-011
Multiplexer Module
The 40-121-011 provides 16x 2:1 multiplexers in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Product
DC Bias Injector
J2130A
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When using the network analyzer to measure impedance, such as the capacitance and ESR or a capacitor, or the DCR of an inductor, etc., it is often necessary to provide a voltage bias to the device being tested. This is true of semiconductor junction capacitances, varactors, and some ceramic capacitors (especially X5R). In these cases the impedance is a function of the DC bias on the device. The Picotest DC bias injector (J2130A) is used for this purpose during impedance measurements.
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Product
High Resolution Inline AXI Platform
AXI XS Series
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The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.
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Product
Test Software
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American Probe & Technologies, Inc.
This new series of software allows you to analyze materials or semiconductor leakage with all of the capabilities of your HP 4140B to resolutions of 1 fA @ 100VDC. Completely rewritten in Visual Basic for Windows XP operating system, it offers Virtual Front Panel Operation of 4140B for I-V & CV Analysis and allows operator to virtually control the 4140B for any instrument operation. I-V Plots with options of displaying current over time. CV Plots with high resolution plotting capability.
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Product
Semiconductor Test Equipment
IC Tester
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Equipment to determine the pass/fail of devices in the wafer inspection process and the final inspection process after packaging.
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Product
Fluorescence Spectrometers
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PicoQuant offers several fluorescence spectrometers that range from compact table-top spectrometers for teaching or daily routine work to modular high-end spectrometers with exact timing down to a few picoseconds. Samples can be liquids in standard cuvettes, solid samples or even semiconductor wafers for in-line quality control.
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Product
Vacuum Handling Systems
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RECIF Technologies history started in 1982 offering its first wafer handling solution: Vacuum handling Systems.Based on this historical technical mastery, Recif Technologies provides today a full range of single wafer manual vacuum handling solutions adapted to our customers’ and current Semiconductor industry’s’ requirements.
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Product
Semiconductor Metrology Systems
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MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Product
1/2.5" 5.0 MP Low Noise USB Camera (Color)
See3CAM_CU55
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See3CAM_CU55 is a 5.0MP USB3.1 Gen1 UVC Color Camera with S-mount (also known as M12 board lens) lens holder. It is a two-board solution containing camera sensor board based on 1/2.5" AR0521 image sensor from ON Semiconductor and USB3.1 Gen 1 Interface board. The powerful on-board Image Signal Processor (ISP) brings out the best image quality of this 2.2micron pixel 5MP AR0521 CMOS image sensor making it ideal for next generation of high resolution surveillance, biomedical instruments and biometric authentication applications.
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Product
PANELMAP
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PANELMAP is a software package used to collect, edit, analyze and visualize measured physical parameters on rectangular semiconductor panels. PANELMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Product
High-Density Precision SMU (10 PA, 30 V)
PZ2131A
Source Measure Unit
The Keysight PZ2131A is a high-channel density precision source / measure unit (SMU) having 5 channels per module and saving space for a wide range of applications requiring numerous precision power supplies. The narrow-pulse function and fast Digitizer Mode allow the PZ2131A to expand the conventional static DC measurements to emerging dynamic measurements. Its seamless current measurement ranging function eliminates the time it takes to change the range and expands the dynamic range to cover multiple measurement ranges, which reduces test duration. These capabilities make the PZ2131A suitable for applications that require numerous precision power supplies, such as semiconductor reliability tests and integrated circuit (IC) tests. The Keysight PX0107A low noise filter adapter lowers its voltage source noise level, which makes the PZ2131A suitable for noise-sensitive applications such as quantum computing as well.
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Product
MOCVD Systems
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For growing high-quality compound semiconductor films, few techniques match the precision of Metal-Organic Chemical Vapor Deposition (MOCVD). They give engineers tight control over film composition and thickness, making them essential for optoelectronics and advanced power transistors.
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Product
Low-PIM, Low-Power Filter Solutions for Monitoring Broadband Emissions
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Bandpass/Bandstop, Notch, and HighpassCompact Design for Rack Mounting of Several BandsSuitable for Monitoring Emissions from Semiconductors,TX/RX Chipsets, SAW/BAW Filters, Cell Phones,Printers, PDA’s, etc.
