Image Processors
algorithmically enhances image characterization.
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
Computer on Module
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Source Type) And 2 PCIe Mini Card Slots
IRU131-SO
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*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (source type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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Product
Imaging X-Ray Photoelectron Spectrometer
AXIS Supra+
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X-ray photoelectron spectroscopy (XPS) is unique in providing quantitative elemental and chemical state information from the uppermost 10 nm of a materials surface. The AXIS Supra+ (also known as Kratos Ultra 2+ in Japan) is a market leading X-ray photoelectron spectrometer combining state-of-the-art spectroscopic and imaging capabilities with the highest level of automation currently available. Unrivalled large area spectroscopic performance allows photoelectron spectra to be acquired from all types of materials including metals, semi-conductors and insulators. Fast, high spatial resolution XPS imaging reveals the lateral distribution of surface chemistry and aids further characterisation with selected small area analysis.
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Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
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The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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Product
Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM2-BT2
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
Qseven Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
Q7M311
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The Q7M311 has adopted the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4GB (or optionally up to 8GB) DDR3L memory onboard and 32GB eMMC flash memory (optional). With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Mini-ITX SBC With LGA1150 Socket 4th Gen Intel® Core™ Processor, Intel® H81, HDMI/VGA/LVDS, Dual LANs And USB 3.0
MANO881
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The MANO881 Mini-ITX motherboard with Intel® H81 Express chipset supports the 4th generation Intel® Core™ and Celeron® (Haswell) processors. This feature-rich Industrial SBC has two sockets for DDR3 system memory of up to 16 GB. The high-performance mini-ITX motherboard MANO881 supports one PCIe x16 slot and integrated with Intel® HD 5000 graphics supports powerful graphic processing and dual-display capability through HDMI, VGA and LVDS interfaces. The outstanding embedded board also includes rich I/O expansions which can help system integrators to develop solutions quickly at a more competitive price. The MANO881 is excellent for in-vehicle PCs, medical imaging and gaming devices, in-flight entertainment systems, industrial automation systems, and other portable devices.
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Product
PICMG 1.3 Full-size CPU Card With LGA1150 4th Gen Intel® Core™ I7/i5/i3 Processor, Intel® Q87, SATA3, USB 3.0, DVI-D, VGA, DisplayPort And Dual LAN
SHB130
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The PICMG 1.3 full-size CPU card, SHB130, designed for the new architecture 4th Generation Intel® Core™ processors (codename: Haswell/Haswell Refresh) with Intel® Q87 chipset on 22nm technology using LGA1150 socket. The outstanding SHB130 with new Intel® architecture delivers up to double the graphics performance over the previous generation. The new graphics solution has high levels of integration to enable new form factors and designs with excellent visual quality built in. In addition, The PICMG 1.3 full-size CPU card comes with two DDR3 1333/1600 MHz unbuffered ECC DIMM slots up to 16 GB of system memory and six SATA 6Gbps ports with RAID 0, 1, 5, 10. The PCI Express 2.0 available on the new Intel® Core™ processor provides flexible x16, x4 or x1 lanes for versatile applications. The high performance SHB130 with improved graphics ability is ideal for applications such as network security, storage server, POS, kiosk, medical, gaming, digital signage, and surveillance security monitoring.
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Product
Intel® Core™ I3 And Core™ 3 And Atom® X7000E/x7000RE Processor
AIMB-219 B1
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Intel® Core™ i3, Core™ 3 Processor and Atom® x7000E/x7000RE ProcessorUp to 16GB DDR5 4800MT/s with one SO-DIMMTriple independent display with 1 DP, 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMMini-ITX low profile motherboard, fanless designSupports Device-On and Embedded Software APIs
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
"All Weather" IoT Application Image Sensors
IoT Series
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Innovation combined with SmartAEC ® function , ultra-low power consumption design enables "all-weather" application terminals to achieve extremely fast startup.
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Product
Imaging Modules
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Imaging modules are cameras with integrated optics , lighting and electronics.
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Product
Rugged IP67-rated Fanless Embedded System With Intel® Atom® Processor E3845, VGA, 2 GbE LAN, 2 USB, 2 COM And 9 To 36 VDC
eBOX800-841-FL
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The eBOX800-841-FL is a fanless embedded system with IP67 protection for mission-critical market. The rugged embedded system is designed for fanless operation at temperatures from -30°C to 60°C. Its 9-36V wide range DC input with various power protection, M12 lockable connectors and N-jack waterproof antenna connectors meet the performance needs for industrial Internet of Things (IIoT) applications. The eBOX800-841-FL is powered by the onboard quad-core Intel® Atom™ E3845 processor (formally codename: Bay Trail). This hardened embedded box PC comes with one DDR3L SO-DIMM slot with system memory up to 8 GB. Additionally, one 2.5" SATA HDD, one mSATA and one CFast™ are available to maintain sufficient storage.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
3.5" Embedded SBC With Intel® Celeron® Processor N2807, LVDS/VGA/HDMI, LAN And Audio
CAPA848
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*Intel® Celeron® processor N2807 (1.58 GHz)*1 DDR3L-1333 SO-DIMM, up to 8GB*4 USB 2.0 ports*4 COM ports*2 PCI Express Mini Card slots and 1 SIM slot*1 Gigabit Ethernet port*LVDS/VGA/HDMI with dual-view supported
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Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
2U Rackmount Network Appliance Platform With Dual LGA2011 Socket Intel® Xeon® E5-2600 V3/v4 Family Processors, Intel® C612 And Up To 42 LAN
NA850
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The NA850 offers cutting edge performance for networking applications with dual high performance 12-core Intel® Xeon® E5-2600 V3 series processors and Intel® C612 chipset, 16 high bandwidth DDR4 memory slots and two hot swappable 3.5” SATA HDD bays. For greater flexible and easy maintenance, the NA850 can be fitted with up to five Ethernet modules, supporting up to 42 Gigabit LAN ports or 20 10GbE LAN ports. Two PCIe x16 standard expansion slots are available for optional network security cards. The superior network appliance platform also supports the Intel® Data Plane Development Kit (Intel® DPDK), a set of software libraries that can improve packet processing performance by up to ten times. It could achieve over 80 Mbps on a single Intel Xeon processor and double with a dual-processor configuration. With its friendly design and high capacity, this powerful network appliance is suited for IDS/IPS, VPN, content filtering, UTM, network security applications, and cloud computing solutions.
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Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
Processor Blade
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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Product
PXIe-8821, 2.6 GHz Dual Core Processor PXI Controller
787895-33
Controller
PXIe, 2.6 GHz Dual Core Processor PXI Controller - The PXIe‑8821 is an Intel Core i3‑based embedded controller for PXI systems. You use it to create a compact and/or portable PC-based platform for industrial control, data acquisition, and test and measurement applications. The PXIe‑8821 includes a 10/100/1000 BASE‑TX (Gigabit) Ethernet port, two Hi‑Speed USB ports, two USB 3.0 ports, as well as an integrated hard drive, serial port, and other peripheral I/O.
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Product
Mini-ITX SBC With LGA1151 Socket 6th/7th Gen Intel® Core™ Processor, Intel® H110/Q170, HDMI/DisplayPort/VGA/LVDS/eDP, Dual LANs And USB 3.0
MANO500
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The MANO500 is based on the new 14nm 7th/6th generation Intel® Core™ i7/i5/i3 and Pentium® processors in the LGA1151 package. Featuring the new Intel® H110 Express chipset with DDR4 2133MHz memory support, this motherboard is built to perform. Its three SATA 6G ports, four USB 3.0 ports, and two RS-232/422/485 ports provide robust storage and I/O options. Users also can increase board functionality with PCIe x16 slot and PCI Express Mini Card slot. The high quality MANO500 allows the connection of up to four display interfaces via HDMI, VGA, DisplayPort, and LVDS/ Embedded DisplayPort (eDP), making it an ideal solution for gaming, workstation, digital signage, medical and other IoT&M2M applications.
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF Subsystem
Model 6353S
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- Complete RF converter and processing subsystem- Rugged and conduction-cooled- Ideal for integration into custom enclosures- Incorporates Xilinx® Zynq® UltraScale+™ Gen 3 RFSoC- 16 GB of DDR4 SDRAM- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Yocto/Android 21.5" Touch Panel Computer With ARM Cortex™-A53 Processor
TPC-121W
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arm SystemReady IR certified.NXP® ARM® Cortex™-A53 i.MX 8M Mini quad-core processor.16:9 LCD with multi-touch P-CAP and true-flat IP66-rated front panel.Up to 4 GB DDR4 RAM and 16 GB eMMC storage onboard.1 mb FRAM backup memory for unexpected power interruptions.2 x Serial port with 120Ω termination resistor that one supports the CAN 2.0B protocol and offers a programmable bit rate of up to 1 Mb/sec.Embedded browser and for rapid Web App development.Supports Linux Yocto and Android.Compatible with VESA and panel mounting.
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Product
FPGA Signal Processor
377
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The Model 377 is designed around the Texas Instruments ADS42LB69 16-bit ADC. The 250 MHz sample clock is supplied by either the on-board frequency synthesizer or an external source. The frequency synthesizer can be phase locked to the local 10 MHz TCXO or an external reference can be used to achieve system-wide phase coherence.
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Product
64 Channel Dual IF Signal Processor
DP-VME-5247
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DP-VME-5247 is a VME64x Dual IF Signal Processor . This dual channel up converter and down converter on-board real time data processing and analog output. This board is particularly suited for radar systems where the signals must be sampled at high rates and very high purity programmable signal generation. Application range encompasses IF signal processing, radar systems, communication systems, and IF data logging systems.
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Product
High-speed Confocal Imaging Platform
Dragonfly
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Dragonfly is a high-contrast multi-dimensional imaging platform capable of four key imaging modalities. At its core is a multi-point confocal for high-speed and high-sensitivity imaging. Capturing at speeds at least 10x faster than conventional confocal technology. Dragonfly is the optimal solution for live cell imaging, providing low phototoxicity and photobleaching, or perfect for fast volume acquisition of fixed samples.
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Product
Value Series Industrial ATX Motherboard For 10/11th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C46
Motherboard
ADLINK IMB-C46 ATX Motherboard: Robust Performance for Industrial Applications The ADLINK IMB-C46 ATX motherboard offers a powerful platform for diverse industrial applications, powered by Intel's reliable 10/11th Gen Core processors. Engineered with the versatile Q470 chipset, the IMB-C46 excels in delivering enhanced performance and scalability. This motherboard supports up to 128GB of DDR4 memory, providing a balance of speed and efficiency critical for process-intensive tasks in environments like smart manufacturing and industrial automation.
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Product
AMD Ryzen™ Embedded 8000 Series Processor
AIMB-2210
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High-performance Zen 4 up to 8 cores/16 threads with AMD XDNA NPU and 96 GB DDR5 SODIMMAMD Radeon RDNA3 Graphics, up to 12 CUs and Quad 4K display supportSupports PCIe x8 Gen4, 3 x M.2 expansion slots, 6 x COM, 4 x USB 3.2 Gen2x1, 4 x USB 2.0Supports 12-24V wide voltage DC-InSupport Windows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 Processor
IMB-M45H
Motherboard
ADLINK IMB-M45H ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 processor in the LGA1151 package, and the Intel H310 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe Gen3, USB 3.1 Gen1 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz memory up to 64 GB in two DIMM slots.
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
