Image Processors
algorithmically enhances image characterization.
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Product
Single And Dual 32k Digital MCA & Pulse Processor
Hexagon Family
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Hexagon is a high precision 32k MCA available in single and dual input channel versions. This compact, high performance desktop MCA includes features such as an input stage for signal conditioning, a fast analog-to-digital converter (ADC), digital signal processing algorithms, High Voltage and Preamplifier outputs for detector bias and preamp power. Hexagon is ideally suited for applications using high energy resolution semiconductor detectors such as HPGe, Silicon, CZT as well as scintillation detectors such as NaI and LaBr3. It can manage both positive and negative signals from resistive feedback or transistor reset preamplifier detectors as well as signals coming from PMT anodes.
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Product
High Performance InGaAs Camera Module with High Image Resolution
XSW 640 Series
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The XSW 640 modules are offered with frame rate of up to 100 Hz. The module comes with either a CameraLink, GigE Vision or QTE Samtec interface and features low weight and power.
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Product
Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
Computer on Module
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
15" Fanless Panel PC With Intel® Atom™ X6425E Processor
PPC-415 EHL
Panel PC
15" XGA TFT LCD with resistive (default) or projected capacitive (by request) touchscreenIntel® Atom™ x6425E quad-core, 2.0 GHz processorFanless, slim designSupports 1 x 2.5" SATA and 1 x M.2 B key slot for expansion1 x PCI/PCIe x1 expansion slotWide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)Wide range DC support (9 ~ 32 VDC)1 x isolated RS-422/485 with automatic flow controlDual 2.5GBASE-T Ethernet supports Time-Sensitive Network (TSN) technology
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Product
OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
Computer on Module
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
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Product
Audio Processors
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ST’s analog and digital audio processors are suitable for a wide range of applications and offer best-in-class performances in terms of audio quality and features.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
4-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor (up To 3.3 GHz), Intel® Q87 Chipset, And Front-access I/O And PCIe/PCI Slots
IPC934-230-FL
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To provide excellent computing capability, the high performance IPC934-230-FL industrial PC is equipped with the newest 4th generation Intel® Core™ i7/i5/i3 or Celeron® processor in 22nm process and Intel® Q87 Express chipset. Total four PCI/PCIe expansion slots allow installation of a variety of off-the-shelf PCI/PCIe cards for configurable applications. The rugged Intel® Hasewell fanless industrial computer is an ideal fit for automatic optical inspection, digital signage appliance, POS/kiosk, embedded controller, factory automation and many more applications.The 4-slot industrial PC is guaranteed to operate reliable in temperature ranging from -10°C to +50°C and is equipped with a 10~30 VDC 150W wide range power supply for mission-critical environments. It supports an easy-to-install fan module to dissipate heat generated within the system when high power consumption PCI/PCIe cards are installed. The all-in-one industrial embedded computer provides rich I/O connectors include two 2.5” SATA HDD, one CFast™ socket, four COM ports (one RS-232/422/485, three RS-232), two USB 3.0 ports, four USB 2.0 ports, dual Gigabit Ethernet, PS/2 ports, one DIO, audio and DVI-I. Moreover, the IPC934-230-FL supports various power protection including OVP (Over voltage protection), OTP (over temperature protection), OPP (over power protection) and SCP (over circuit protection) for more system safety.
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Product
Core I7 Processor AMC With PinoutPlus, PCIe
AMC728C
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The AMC728C is a Processor AMC (PrAMC) in a double module, mid-size AdvancedMC (AMC) form factor based on the Intel next generation Core i7 Processor (Haswell) with QM87 PCH. The module follows AMC.1 (PCIe), AMC.2 (GbE) and AMC.3 (storage) specifications.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, LVDS And LAN
PICO511
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The PICO511 is an extremely compact Pico-ITX motherboard featuring the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U (codename: Kaby Lake). The feature-rich 2.5-inch embedded board is building flexible I/O interfaces through board to board connectors, wide temperature range in a small-form factor motherboard to fit different needs of many demanding applications in various industries. The PICO511 is perfect for system integrators who require an extremely compact embedded motherboard with great processing power and expansion capabilities. Its compact size form factor has ensured that it can fit into a variety of space constricting environments. In addition, the Intel® Kaby Lake-based motherboard was designed to withstand extreme temperatures, ranging from -20°C to +70°C (0°F to +158°F).
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Product
LASAR Post Processor, Run Time And Diagnostic Test Solution
DtifEasy Series
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DtifEasy is a full-featured tool set for importing, converting, and executing IEEE-1445 compliant digital test vectors generated by a LASAR simulation. All four IEEE-1445 file types - UUT model group, Stimulus and Response group, Fault Dictionary group, and Probe group are supported by DtifEasy; providing the user with the ability to execute go/no-go, fault dictionary, and guided probe sequences. DtifEasy supports MTS' 3U PXI GX529x series of dynamic digital instrumentation to 200 MHZ as well as the 6U PXI GX5960, 50 MHz digital instrumentation. All of these instrument families are compatible with the digital logic probe.
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Product
15" Fanless Panel PC With Intel® Celeron Quad Core J1900 Processor
PPC-3150-RJ9
Panel PC
15" TFT XGA LED Panel with resistive touchscreenEmbedded Intel Celeron processor, quad core J1900 2.0GHz onboardSystem memory up to 8GB DDR3L 1333 SDRAMSupports one internal SATA 2.5" HDDSupports one Mini PCIe socket, two Gigabit EthernetFanless and compact size with low power consumputionSupports five RS-232 and one RS-232/422/485, besides six RS-232 and two RS-422/485 are optional by requestSupports one mSATA socket
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
12/13/14th Gen Intel® Core™ Processor LGA1700 Nvidia MXM GPU Integration
AIMB-292
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12/13/14th Gen Intel® Core™ Desktop Processors, max. 24 Core, support Q670E chipsetIntegrated NVIDIA MXM GraphicsUp to 96GB DDR5 5600 MT/s with two SO-DIMMQuadruple displays with 3 DP and 1 LVDS (or eDP), up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 E-key, 4 USB 3.2 Gen2x1, 2 USB 2.0, 1 SATA IIIQualified for Edge AI SRP of WISE-DeviceOn and Embedded Software APIs
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Product
Intel® Core™ Ultra Series 2 Processors (LGA1851), Up To 24 Core. Support Q870/H810 PCH
AIMB-2710
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Intel® Core™ Ultra Series 2 Processors, Up to 24 Core. Support Q870/H810 PCHDual channel DDR5 6400MT/s, max. 96GB with two CSODIMMSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB 3.2 Gen2x1 (10Gbps), 2.5 GbERich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA and 1 USB4 Type-C12-24V DCinWindows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
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Product
Architecture P2020 Processor
VME-194B
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Curtiss-Wright Defense Solutions
The VME-194B is the next generation of VME single board computer (SBC) from Curtiss-Wright Defense Solutions. It is targeted for applications with moderate processing requirements, low power and cost effectiveness. The VME-194 VME SBC is based on NXP's high performance QorIQ P2020 SOC multi-core processor.
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Product
PPC8315 Processor AMC W/ 2.5” SATA Drive
AMC715
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The AMC715 is a Processor AMC (PrAMC) with an on board 2.5" SATA hard disk drive in a single-module, mid-size AdvancedMCTM (AMC) form factor based on the AMC.1, AMC.2 and the AMC.3 specifications. The module is ideal to be used for data flow management within a chassis. The AMC715 provides a low cost solution with an integrated high capacity disk. With a storage capacity of over 320 GB and data transfer rates of 150 Mbyte/s the AMC715 is the ideal AdvancedMCTM smart storage. The PCIe interface is configurable as Host or Agent mode. The module has 512 MB of DDR2 memory on board.
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Product
2-slot Fanless Industrial System With 4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q87, Front-access I/O, PCIe And PCI Slots
IPC932-230-FL
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The IPC932-230-FL is an expandable fanless barebone system with various front-facing I/O connectors. The powerful embedded system IPC932-230-FL supports LGA1150 socket for the 4th generation Intel® Core™ processors coupled with the Intel® Q87 Express chipset. Two 204-pin SO-DIMM sockets support up to 16 GB DDR3-1333/1600 system memory in maximum. To fulfill different application needs, the compact industrial PC provides two flexible PCI/PCIe expansion slots with two different combinations: one PCIe x1 and one PCIe x4 or one PCIe x4 and one PCI. Its DVI-I output on the front panel allows user to directly connect to a LCD panel and four COM ports and a DIO are provided for general industrial control. This all-in-one barebone system also has two easy-to-install 2.5 SATA HDD drive bays with RAID 0/1, and supports Intel® Active Management Technology 9.0 (AMT 9.0) to enhance overall device manageability.
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Product
PCI/104-Express Type 1 Single Board Computer with 6th Gen. Intel® Core™ Processor (formerly codenamed Skylake)
CMx-SLx
Single Board Computer
The CMx-SLx is a PCI/104-Express Type 1 Single Board Computer (SBC) featuring the 64-bit 6th Gen. Intel® Core™ i3 processor (formerly "Skylake-H"), supported by the Intel® CM236 Chipset. The CMx-SLx is specifically designed for customers who need high-level processing and graphics performance in a long product life solution. The CMx-SLx Intel processor supports Intel Hyper-Threading Technology (i3-6102E = 2 cores, 4 threads) and 8 GB of soldered ECC DDR4 memory at 1866/2133 to achieve optimum overall performance.
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Product
COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s, 0 - 20mA, ±20mA) And 2 PCIe Mini Card Slots
IRU152-I
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*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*4 isolated analog input channels (16-bit, 250 kS/s, 0 - *20mA, ±20mA)*1 isolated COM port*1 isolated DIO (2-in/2-out)*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports LabVIEW versions later than 2016*Supports OPC UA
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
Computer on Module
ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
Computer on Module
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
THIN AI Motherboard 12th Gen Intel® Core™ Processor (Alder Lake), MXM GPU Integration
AIMB-288E
Motherboard
12th Gen Intel® Core™ Desktop Processors (LGA1700), with H610ESupport Intel Arc Embedded MXM GPU or NVIDIA Quadro Embedded MXM GPUUp to 64GB DDR5 4800 MT/s with two SO-DIMMTriple displays with 2 DP and 1 eDP, up to 4KAbundant Expansion: 1 M.2 M-key & 1 M.2 B-key, 4 USB 3.2 Gen2x1 & 2 USB 3.2 Gen1x1, 1 SATA IIISupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API, and WISE-DeviceOn for quick AI deployment at scale
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SFF Subsystem
Model 6350S
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- Now available in RFSoC Gen 3 with the Model 6353S- Small form factor rugged enclosure- Conduction-cooled- Ideal for integration into custom enclosures- Incorporates Xilinx® Zynq® UltraScale+™ RFSoC- 16 GB of DDR4 SDRAM- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Client Type COM-HPC Size C Module with 13th Gen Intel® Core™ Desktop Processor
COM-HPC-cRLS
Computer on Module
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior performance with fewer lanes than its predecessors, allowing for simplified designs and reduced time to market to drive various AIoT deployments.
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Product
Mini-ITX 12th/13th/14th Gen & And Series 2 Intel® Core™ Processor LGA1700
AIMB-289
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsRich expansion: M.2 B key for SSD Storage, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via DC Jack or ATX 4pin+5VSB pin headerWindows 10/11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOnTriple independent 4K displays with 1 DP1.4, 1 HDMI, and 1 LVDS
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Product
The Ease of TEAM with the Power of Orientation Imaging Microscropy (OIM)
TEAM™ Pegasus
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Introducing the new EDS and EBSD Integrated System
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Product
Thermal Imaging Sensor
3550 FC
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Condition monitoring sensor to visualize thermal patterns on multiple assets. Maintenance managers can now collect a more comprehensive variety of key-indicator data — thermal imaging, voltage, current, temperature, and power — on critical equipment to build a real-time picture of an asset's condition. With the right mix of data all in one place, managers can implement planned maintenance and decrease the frequency of preventive rounds.
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Open Pluggable Specification-Plus (OPS+) Digital Signage Player With LGA1151 Socket 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q370 And TPM 2.0
OPS700-520
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The OPS700-520 is an Open Pluggable Specification Plus (OPS+) digital signage player. The high-performance signer player is powered by the high-performance LGA1151 socket 8th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Coffee Lake S) with the Intel® Q370 chipset. This OPS+ digital signage module supports Trusted Platform Module (TPM) 2.0, Intel® Active Management Technology (Intel® AMT) 11.0 as well as Intel Unite® solution for content sharing and collaboration. It comes with two 260-pin DDR4-2400 SO-DIMM sockets that can provide system memory of up to 32GB. The Coffee Lake S-based OPS700-520 offering future-proofed flexibility and performance is among one of the most advanced and powerful digital signage players in the market.
