Image Processors
algorithmically enhances image characterization.
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Product
Rugged SOSA-Aligned 3U VPX NVIDIA GPGPU Blade
VPX3-MXM-RTX5000
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The VPX3-MXM/RTX5000 is a 3U VPX general-purpose GPU (GPGPU) blade based on the NVIDIA RTX5000, supporting 16GB GDDR6 graphics memory with 4x DisplayPort or 4x HDMI output. The VPX3-MXM/RTX5000 brings a new level of performance to visual graphics and computing applications, fully integrating hardware acceleration for both graphics and computing code, enabling hardware acceleration for a wider class of applications than ever before.
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Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E
VPX3-TL
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ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
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6U CompactPCI Intel® 6th Gen. Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3399
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- Supports 6th Generation Intel® Core™ i3/i5/i7 processors and Intel® CM236 PCH with embedded graphic (up to 3 independent displays)- Up to 32GB (DDR4-2133) memory (max 16GB on board, socket SO-DIMM x1, max 16GB)- Optimized dual-slot SBC with 2.5" SATA-III HDD/SSD, 2240 or 2280 M.2 socket, on-board Nandflash (optional)- Two SATA ports, two USB 3.0, six USB 2.0 ports, two DP ports, two COM ports, one PS/2, one Audio, one VGA and PCIe x8 interfaces to the Rear Transition Module (RTM)- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.0 R3.0, PICMG2.9 R1.0 compliant
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6U CompactPCI Processor Blades
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A comprehensive line of 6 U CompactPCI computers to the embedded board market.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3640 Series
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- Low power quad-core Intel Atom® x6413E Processor (formerly Elkhart Lake)- Up to 32GB DDR4-2400-3200MT/s ECC soldered memory- Optional onboard SSD support- Flexibility in IO selection- Extended temperature -40 to 85 degree C supported
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Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
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The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
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Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3630
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The ADLINK cPCI-3630 Series is a 3U CompactPCI® 2.0 processor blade featuring the 64-bit Intel Atom® Processor X Series SoC (formerly Apollo Lake I) and soldered DDR3L-1600 MHz ECC memory up to 8GB.
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Product
AdvancedTCA Processor Blade
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Offer high-density processing power, faster data throughput, and intelligent system management.
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6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
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- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
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- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
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The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
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Product
2MP Wide Temperature Range Industrial Grade HDR Camera
e-CAM20_CU0230_MOD -
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e-CAM20_CU0230_MOD is a 2MP high performance, HDR Camera Module with excellent low light performance. It is based on AR0230AT CMOS Image sensor from ON Semiconductor®. It has an ability to stream seamlessly at wide temperature range (-40 to 105°C) which is suitable for Automotive application. It has S-mount (M12) lens holder which allows customers to choose and use the lens according to their requirement. e-CAM20_CU0230_MOD has a dedicated, high-performance Image Signal Processor chip (ISP) that performs the entire Auto functions (Auto White Balance, Auto Exposure control).
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Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
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CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
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3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
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MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
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3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
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The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
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Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
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- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
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Product
Terahertz Imagers
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Terahertz imagers represent a groundbreaking technological innovation in the realm of imaging, utilizing terahertz radiation to visualize and explore objects and structures that are otherwise hidden from view.
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Advanced Imaging
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From customisable, metallised detector tiles to linear arrays of detector modules, Kromek are enhancing advanced imaging technology globally with our Cadmium Zinc Telluride (CZT) based solutions in the Medical and Industry & Security sectors.
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Preclinical Imaging
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Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models.
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Image Analysis
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In today's demanding environment where quality assurance is an everyday requirement Aprotec have sought to find present day retrofit solutions that compliment fully functional older machinery.
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Fused Imagers
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Fused imagers (fusion multi-sensor imaging systems) offer increased surveillance capabilities due to fusion of classical thermal image with classical visible image. The fusion systems are typically built by combining optically images from thermal imager and classical night vision device, or by combining digitally images from thermal imager and digital night vision devices (or electronic VIS-NIR camera).
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Scientific Imaging
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The TRiCAM is a compact intensified camera for scientific and industrial applications that require low-light level imaging or ultra-short exposures through fast gating.
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Space & Science Imaging
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Teledyne e2v has been trusted to design and deliver CCD and CMOS imaging sensors and sub-systems for over 150 space missions by the world's largest space agencies, including NASA, ESA, JAXA, CNSA and most recently for the Russian-led World Space Observatory.We offer space imaging solutions, including space qualified imaging sensors, arrays and sub-systems for space science, ground astronomy and Earth observation; helping solve the mysteries of the Universe and understand climate change on Earth.
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Product
Hyperspectral Imaging Spectrometer
Hyperspectral PoliSpectra® H116
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HORIBA has developed a unique hyperspectral imaging spectrometer with an integrated scientific CMOS camera (12-16 bit) featuring HDR (95dB Dynamic Range and 1.7e- noise) and 95% Q.E peak efficiency:PoliSpectra® H116 features broad UV-NIR coverage in one acquisition (185-1050 nm) combined with the highest spectral resolution (<1 nm).
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Product
Thermal Imaging Core
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Zhejiang ULIRvisionTechnology Co., LTD
Infrared thermal imaging technology is now more and more widely used in many different areas around the world, such as the security monitoring, industrial detection, the autonomous vehicle auxiliary market, iron industry and so on. Choosing the most suitable thermal imaging core is choosing half the right Infrared thermal imager. Therefore, how to choose the highly qualified infrared thermal imaging core is very important.
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Product
Imaging
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Welcome to Thorlabs; below you will find links to our imaging systems and components. The products below are not only designed specifically for imaging applications, but they can be easily integrated into our entire line of photonics products. This makes it easy to modify or build custom imaging systems. Thorlabs’ Selection of Imaging Systems consists of our Laser Scanning Microscopy systems and OCT Imaging Systems.
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Imaging & Analysis
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Microscopes offered by Buehler generally fall into the categories of stereo microscopes, upright microscopes, or inverted microscopes. Inverted microscopes are commonly referred to as metallurgical microscopes. Microscopes may offer episcopic (reflected light) observation, diascopic (transmitted light) observation, or both possibilities. Illumination may be delivered in bright field mode (BF) or dark field mode (DF), and several techniques such as differential interference contrast (DIC) and polarized light microscopy make use of the nature of light to reveal specific pieces of information when studying materials.
