Image Processors
algorithmically enhances image characterization.
-
Product
6U CompactPCI 9th/8th Gen Intel® Core™ I3/i5/i7 Processor Blade
cPCI-6640 Series
Processor Blade
The ADLINK cPCI-6640 is a 6U CompactPCI® processor blade featuring an 8th/9th Gen Intel® Core™ (formerly Coffee Lake-H) with Mobile Intel® CM246 Chipset. Dual SO-DIMM slots provide up to 64GB of DDR4-2666 dual-channel memory (2x 32GB modules). ECC memory is also available when paired with a supporting CPU.
-
Product
3U CompactPCI Quad-Core Intel Atom® Processor Blade
cPCI-3620
Processor Blade
The ADLINK cPCI-3620 Series is a 3U CompactPCI® processor blade featuring a quad-core 4th generation Intel® Atom SOC and soldered DDR3L-1333 ECC memory up to 4GB.
-
Product
Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade
aTCA-9300
Processor Blade
The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.
-
Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
Processor Blade
The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
-
Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
Processor Blade
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
-
Product
Rugged SOSA-Aligned 3U VPX NVIDIA GPGPU Blade
VPX3-MXM-RTX5000
Processor Blade
The VPX3-MXM/RTX5000 is a 3U VPX general-purpose GPU (GPGPU) blade based on the NVIDIA RTX5000, supporting 16GB GDDR6 graphics memory with 4x DisplayPort or 4x HDMI output. The VPX3-MXM/RTX5000 brings a new level of performance to visual graphics and computing applications, fully integrating hardware acceleration for both graphics and computing code, enabling hardware acceleration for a wider class of applications than ever before.
-
Product
AdvancedTCA Processor Blade
Processor Blade
Offer high-density processing power, faster data throughput, and intelligent system management.
-
Product
6U CompactPCI Intel® 6th Gen. Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3399
Processor Blade
- Supports 6th Generation Intel® Core™ i3/i5/i7 processors and Intel® CM236 PCH with embedded graphic (up to 3 independent displays)- Up to 32GB (DDR4-2133) memory (max 16GB on board, socket SO-DIMM x1, max 16GB)- Optimized dual-slot SBC with 2.5" SATA-III HDD/SSD, 2240 or 2280 M.2 socket, on-board Nandflash (optional)- Two SATA ports, two USB 3.0, six USB 2.0 ports, two DP ports, two COM ports, one PS/2, one Audio, one VGA and PCIe x8 interfaces to the Rear Transition Module (RTM)- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.0 R3.0, PICMG2.9 R1.0 compliant
-
Product
6U VPX Dual Nodes Blade With Intel® Xeon® W-11865MRE
VPX6200
Processor Blade
- Dual nodes, redundancy architecture- Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) per node- M.2 2242 slot per node (upgradeable to 1TB by option)- VITA 46/48/65 compliant for quick deployment- Supports Windows 10 IoT Enterprise LTSC 21H2 and Linux (kernel 5.13 and higher)
-
Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
Processor Blade
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
-
Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
Processor Blade
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
-
Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
Processor Blade
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
-
Product
6U CompactPCI Processor Blades
Processor Blade
A comprehensive line of 6 U CompactPCI computers to the embedded board market.
-
Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
Processor Blade
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
-
Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3640 Series
Processor Blade
- Low power quad-core Intel Atom® x6413E Processor (formerly Elkhart Lake)- Up to 32GB DDR4-2400-3200MT/s ECC soldered memory- Optional onboard SSD support- Flexibility in IO selection- Extended temperature -40 to 85 degree C supported
-
Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
Processor Blade
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
-
Product
3U CompactPCI Serial Intel® Xeon® W Processor Blade
cPCI-A3535 Series
Processor Blade
- Intel® Xeon® W-11555MRE 6-Core processor- Max. 64GB DDR4-3200 by 2x SODIMMs- 80GB 3D Nand flash SSD in SLC mode- USB 3.2, USB-C and RJ-45 iAMT front panel service ports- 2x M12 2.5GbE front panel ports for on train use
-
Product
6U CompactPCI Intel® Atom® X6413E Processor Blade
cPCI-6660
Processor Blade
The cPCI-6660 Series is a 6U CompactPCI single-board computer available in single-slot (4HP) or dual-slot (8HP) width form factors, powered by the Quad-core Intel Atom® x6413E Processor. The cPCI-6660 now supports dual-channel DDR4-2400-3200MT/s memory with In-Band ECC (IBECC) for enhanced reliability. It features a 5V power input, four 2.5GbE Ethernet ports (3x RJ-45 and 1x M12 X-coded), onboard iSLC, and offers flexible storage options, including an optional 2.5" SATA drive space or mSATA, configurable by BOM.
-
Product
Imaging
-
Welcome to Thorlabs; below you will find links to our imaging systems and components. The products below are not only designed specifically for imaging applications, but they can be easily integrated into our entire line of photonics products. This makes it easy to modify or build custom imaging systems. Thorlabs’ Selection of Imaging Systems consists of our Laser Scanning Microscopy systems and OCT Imaging Systems.
-
Product
In Vivo Imaging
-
Introducing two NEW systems in the IVIS® Lumina™ preclinical in vivo imaging instrument family, the IVIS Lumina S5 and the Lumina X5. The IVIS Lumina S5 2D optical imaging system combines high sensitivity optical and patented spectral unmixing capabilities in a high-throughput system. The IVIS Lumina X5 has all the features of the S5 with integrated high-resolution x-ray.
-
Product
Imaging Modules
-
Teledyne e2v has developed compact MIPI modules which feature our own high performance CMOS image sensors inside a pre-focused, industrial-grade scanning optic. As a turnkey sensor/optics for imaging systems, these modules offers customers significant reduction in development time and cost savings. Only a few screws are needed to mount the module, with simple connection to the image processing system through an FPC cable connector. Software development efforts can also be reduced by using some limited API-layer Linux software drivers. This enables the module to be seamlessly interfaced to popular ISP platforms.
-
Product
Imaging & Analysis
-
Microscopes offered by Buehler generally fall into the categories of stereo microscopes, upright microscopes, or inverted microscopes. Inverted microscopes are commonly referred to as metallurgical microscopes. Microscopes may offer episcopic (reflected light) observation, diascopic (transmitted light) observation, or both possibilities. Illumination may be delivered in bright field mode (BF) or dark field mode (DF), and several techniques such as differential interference contrast (DIC) and polarized light microscopy make use of the nature of light to reveal specific pieces of information when studying materials.
-
Product
Imaging Photometer
L-Series
-
RayClouds Photoelectric Technology Co.,Ltd.
L-Series Imaging Photometer is equipped with CMOS detector, cooperated with ProICM professional analysis software to detect the luminance parameters of the two-dimensional imaging screen. Professionally complete the data analysis of the measured parameters to help the tester improve the luminance quality of the finished product and ensure the comfortable use experience of end users.
-
Product
Passive Imaging & Radiometers
PMMW
-
A low attenuation atmospheric window from 80-110 GHz (W Band) makes this band an ideal candidate for PMMW systems. Passive imagers operate by detecting naturally emitted thermal (black body) radiation from an object. Products available up to 345 GHz.
-
Product
Imaging Photometers and Colorimeters
-
Instrument Systems Optische Messtechnik GmbH
The use of imaging photometers and colorimeters for fast recording of photometric and colorimetric quantities with spatial resolution has attracted increasing interest. Compared with measuring instruments without spatial resolution, such as spectrometers, this technology offers the following advantages:
-
Product
Imaging Devices
-
High quality imaging devices with double or simple telecentric objectives offering exceptional spatial resolution with high FOV. Dedicated to high quality measurements whatever your display size.
-
Product
Infrared Imaging Products
-
We currently offer the SLA32, a 2×16 staggered element silicon-based thermopile array. and the SLA64, a 1x64 element silicon-based thermopile array. . Additionally, development is continuing on future imaging products with integrated electronics. Please contact us with your specific requirements.
-
Product
Multi-Band Imaging
-
Bodkin Design & Engineering, llc
A multi-band camera provides high-resolution, co-registered visible and infrared imagery through a common aperture telescope, unlike conventional visible or infrared cameras that provide image data in limited wavelength bands. Bodkin Design has created the Omnispotter multi spectral camera to enable the user to better discriminate targets from both background and decoys by blending color images with information from the IR band. The images obtained from this system penetrate darkness, camouflage, smoke and clutter better then either visible or IR images could alone.
-
Product
2D Image Sensor
Lince11M
-
Lince 11M has been specifically designed as a high-speed CMOS image sensor that also allows customers to decrease the cost of ownership. The digital circuits of the sensor output images at 715fps in 4K resolution, or 1400fps when windowing in full HD resolution. To facilitate access to affordable optics, Lince11M is compatible with APS-C format in 4K resolution.
-
Product
hyperspectral imaging sensor
Hyper-Cam
-
The Hyper-Cam is a lightweight and compact hyperspectral imaging sensor which uses Fourier Transform Infrared (FT-IR) technology. This advanced high-performance spectrometer allows to detect and identify substances either gases or solids from a distance of up to 5 kilometers. It provides real-time chemical imaging as well as unparalleled spatial and spectral information about the IR targets under measurement.
