IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Product
FMC L-Band RF Receiver
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Sundance Multiprocessor Technology Ltd.
The Creonic L-band RF receiver FMC card allows to receive RF signals between 925 and 2,250 MHz. It is ideally suited for satellite communication with standard satellite dishes since it includes a DiSEqC driver IC for LNB controlling. The board allows to build receivers with symbol rates of up to 100 Msymbols/s. Due to the low-pin-count (LPC) FMC connector it can be used with any FMC carrier board that supports VADJ=1.8V. The card will be available from Q2/2017.
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Product
Si1145 UV / Ambient Light / Proximity Sensor
SEN-36002
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SEN-36002 is a highly integrated carrier board designed for the Si1145 UV, Ambient Light and Proximity sensor IC from Silicon Labs. This sensor has 100mLUX resolution, and has a dynamic range of 1 LUX to 128 kLUX with IR correction. This means that whether your application is indoors in poor lighting conditions or outside in full sunlight, this sensor has you covered. In addition, we added a high power LED (150mA max, 20 degree) to take full advantage of the proximity sensing capability of this IC - something you won't see on most competitive carrier boards. Integration is easy with 4 x 4-40 sized mounting holes at the corners of the PCB and signal translation to handle interface voltages from 3V to 5V. The board is interfaced via an I2C interface and function pins have been broken out to a 0.1" pin header. The INT pin is also broken out for interrupt capability.
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Product
DDR3 SODIMM
SQR-HS3I
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Original Samsung/Micron IC chips adapted, Heatsink attached. Data transfer rate: 1600 MT/s, Operating temperature: -40 °C ~ 85 °C, 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Global Design Platform
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IC Manage Global Design Platform (GDP, GDP-XL) is the semiconductor industry’s most advanced, design & IP management system.
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Product
Line Testers
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GAOTek provides a large collection of certified and feature-rich line testers for sale to the United States, Canada and Globally. These devices are mainly used for line installation, line performance testing, inspection, and maintenance of the telecommunication networks. They are particularly designed to accelerate telecom trouble shooting and with the help of latest technology they are equipped with a smart CPU, IC, and SMT. These devices have some unique features such as caller ID display and last number redial. Moreover, it can also be used for multi-line testing, wire pair checking, inspection of line insulation and test for breaks and faults.
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Product
Small IC Adapter for ZD Differential Probe Qty 2
PACC-ZD006
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Small IC adapter for ZD differential probeQty 2
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Product
Voltage Protection ICs
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ST’s voltage protection devices prevent external overvoltage (or undervoltage) peaks from damaging circuitry. They are commonly implemented on the power charging patch of portable devices to prevent USB or AC charger power failure. ST’s devices offer the advantage of very precise voltage thresholds, so that the protection is activated accurately, and without fail.
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Product
Hall Effect Proximity Switches/Sensors
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ChenYang Technologies GmbH & Co. KG
A Hall Effect proximity switch is a non-contact electronic switch, which consist of a permanent magnet or ferromagnetic part as trigger intermediary and a Hall Effect sensor IC. The Hall sensor IC detects the change of the magnet field when the permanent magnet comes in the close proximity to it and generates an electric signal. This signal is amplified and rectified to control the output signal of the switch.
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Product
Temperature Probes
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Used for immersion temperature measurement in liquids, air, gas, or wells in solid material, Omega offers a large variety of probe styles in thermocouple, RTD, thermistor, and IC technologies.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
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Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
Premium-Level Wi-Fi 6E MiniPCIe Solution Based On WCN6856/QCA2066
AIW-171HQ
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Industrial-grade temperature range (-40~85°C)Compatible with Nvidia and NXP platformsAdditional 6GHz supportDBDC(Dual band dual concurrent) supportMultiple certificates (FCC, CE, IC)
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
SparkFun USB To Serial Breakout
FT232RL
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This is the SparkFun USB to Serial Breakout for the FT232RL, a small board with a built in USB to serial UART interface. This little breakout is built around the FT232RL IC from FTDI, with an internal oscillator, EEPROM, and a 28-pin SSOP package this is a serious little chip.
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Product
Registered DIMM
SQR-RD5N
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Registered DIMM DDR5 4800/5600/6400, Data Transfer Rate: 4800/5600/6400 MT/s. Capacity : 16/32/64/128GB, 100% Screening Test. Compatible with server platform, Original IC chip adopted.
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Product
Class-D Audio Amplifiers
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Analog Devices is a leader in Class-D audio amplifiers and audio signal processing, and we deliver audiophile-level performance with our proven analog and digital technology. We offer a wide range of audio amplifiers, including industry-leading microphone preamps, microphone drivers, line drivers, and receivers. Our Class-D amplifiers, in particular, are among the lowest power and lowest distortion in the industry. Our portfolio includes Class-A, Class-B, and Class-D audio amplifier offerings, along with a breadth of power ICs. Analog Devices amplifier products have been used in many high volume consumer products where the highest audio quality is expected. The lowest power consumption also enables this performance in many battery powered applications as well.
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Product
PXIe Digital Stimulus/Response with PPMU: 250 MHz, 16 Channels
M9195B
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The Keysight M9195B PXIe digital stimulus/response (PXI DSR) module is ideal for IC design validation and production test environments. The PXI DSR provides 16 bi-directional digital channels with programmable logic levels and can be configured for synchronized cyclized digital data, for parametric measurements, or for static digital IO.
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IC & Transformer
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Mornsun Guangzhou Science & Technology
MORNSUN launched the self-designed electronic integrated circuits according to the different product lines, types of the integrated circuit include AC/DC power supply control ICs, DC/DC power supply control ICs, interface ICs, start-up ICs, contactor power saving controller ICs and digital isolator ICs. MORNSUN IC chip can be widely used in industrial equipment, process control, data acquisition system, building automation, smart meter, etc. Adopting MORNSUN's AC/DC transformers and DC/DC transformers, with the use of its control ICs, can achieve wide voltage input flyback power supply design with multiple protection functions and superior EMI performance. We hope that those power transformers along with the integrated circuits & chips electronics can be an ideal fit for your application needs.
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Sensor Interfaces
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Sensor interface ICs enable a system to read out information from the input signal generated by complex sensors, providing a suitable output signal that is easy for a host system to display or process. ams sensor interfaces offer high accuracy, precision and sensitivity even when operating in harsh environments.
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Product
MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J03
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
Driver Amplifiers
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Analog Devices RF amplifiers are designed utilizing the company’s leading amplifier and RF IC expertise. Our extensive family of single-ended input/output, fixed-gain amplifiers can be used from dc to microwave and include gain blocks, low noise amplifiers, intermediate frequency amplifiers, driver amplifiers, and differential amplifiers. These devices offer high linearity, low noise figures, and various fixed-gain options, as well as low power consumption; they are all fully specified over frequency, temperature, and supply voltage for use in a variety of applications.
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Product
Stepper Motor Drivers
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ST's portfolio of STSPIN stepper motor drivers spans from relatively simple ICs with current control and phase generation to more complex solutions.
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Octal Test Site Handler
3180
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The Chroma 3180 is a productive pick & place system for high-volume multi-site IC testing.
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2-Quadrant Source/Measure Unit for Functional Test, 20 V, 1 A or 6 V, 3 A, 20 W
N6782A
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The Keysight N6782A is a source/measure unit (SMU) designed specifically for advanced functional testing of a device. The ability to modulate the output up to 100 kHz along with capability to source and sink current (2-quadrant operation) makes the N6782A a perfect fit for advanced functional test of a variety of devices such as DC/DC converters, power management units, power amplifiers, and power management ICs. The input stage of the DUT can be stimulated by the fast sourcing and waveform capabilities. While the output stage can be loaded down and measured with the electronic load capabilities, providing a total test solution.
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Product
Immunity
EFT coupling
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s used for direct-contact measurements of impulse immunity in IC pins, according to IEC 62215-3 and IEC 61000-4-4.
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Product
Octal 4 Gsps 12-bit ADC
ADF-O4012
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The DEG ADF-O4012 FMC includes eight 12-bit, 4 Gsps RF analog-to-digital converters (ADC). The ADF-O4012 features a 16-lane, 24.75 Gbps JESD204C interface, flexible clocking and triggering options. This ADF-O4012 leverages two Analog Devices AD9209 MxFE (Mixed Signal Front End) ICs, elevating the technology to a new level of integration.
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Product
Light-to-Analog Sensors (Voltage)
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Renesas' light-to-voltage silicon optical sensors combine a photodiode array, a non-linear current amplifier and a micropower op amp on a single monolithic IC. Applications for these devices include display backlight control, keypad dimming, anti-glare mirror systems, and industrial and medical light sensing applications.
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Product
ICAP/4 Professional
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If the industry's highest-performing and most affordable analog, mixed-signal, mixed-systems and IC simulation solution is on your list of tool requirements, then ICAP/4 Professional is your choice. This full-featured offering is at the apex of today's most comprehensive simulation solutions.
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Product
OX 775 WDM Node
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Sharp Vision WDM Node accepts output for Pon EDFA with 3 wavelengths. They separate 1550nm (CATV) into RF output. PON output (1310/1490nm) is provided.- Double IC – 4 Output- Sensitivity : - 12 dBm- AGC : - 8dBm to + 2dBm- Output Level : 106 dB- Frequency : 40 ~ 900 MHz
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Product
Molded Interconnect Subtrate
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A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
