IC
circuitry in a chip.
See Also: Integrated Circuit, Chip, Digital IC Testers, IC Test, IC Clips, IC Probes
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Product
Packaging Manufacturing
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KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Semiconductor & Electronic Systems Test and Diagnostics Services
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Reliability Test and Diagnostic services are offered to a wide range of customers that are active as Fabless Semiconductor or Integrated Device Manufacturers, automotive electronics supplier, Telecom and ICT application specialists, Industrial and Medical electronic system manufacturers or in Aerospace and Space applications. Independent high tech test and diagnostic service laboratory. IC and electronic module qualification. ESD and Latch Up testing. Design assessment by HALT/HASS. Failure and construction analysis.
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ESD & Latch-Up Test Service
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MASER Engineering has automatic test equipment for the most common ESD test pulse models. MIL - JEDEC - ESDA - IEC standards. IC level Human Body Model. IC level Machine Model. IC level Charged Device Model. System level IEC 61000 HBM. AEC-Q100 Field Induced Gate Leakage test. Static Latch-Up test. Dynamic Latch-Up test.
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Smartcard Interfaces
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ST offers complete analog interfaces for asynchronous 1.8 V, 3 V and 5 V smartcards. They can be placed between the card and the microcontroller with only a few external components to perform all supply protection and control functions. Main targeted applications are smartcard readers for set-top boxes, IC card readers for banking, identification and pay TV.
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Product
ESD Latch Up Tester
1100-ESD
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Tokyo Electronics Trading Co., Ltd.
The Model 1100-ESD can easily and accurately perform ESD tests (HBM, MM) on ICs up to 64 pins. Also, all common pin combinations required by the standard can be realized.
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Product
Multi Output Regulated DC Power Supply
LQ6324T
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- Low cost general purpose laboratory bench unit.- Fully protected against overload and short circuit.- Three independent outputs electrically isolated from each other.- 5V/5A with over voltage crowbar protection for digital ICs.- Electrically floating outputs up to 500V DC w.r.t. ground.- Compact modular construction.- Precise regulation, low ripple and noise for both constant voltage and constant current operation.- Quality components and conservating ratings for high reliability and long life.
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Product
Module Sockets
Ardent Optical Engine
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The scalability of SP connector technology is enabling the next generation of optical device IC manufactures to allow for solder-less high speed optical Electrical Module replace-ability. These connectors offer high speed input data rates in cost effective and real-estate friendly form factors.
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Product
Immunity
ESD coupling
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is used for conducted coupling of Langer ESD pulses (200ps rise time) into ICs.
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Product
X-Band Silicon Radar Quad Core IC
AWS-0104
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The AWS-0104 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and single beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain during transmit mode, 21dB gain in receive mode, +15 dBm output power during transmit, and 3.4 dB NF during receive. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 QFN for easy installation in planar phased array antennas.
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Product
IC-PPC-VMEb, 6U VME Single Board Computer
IC-PPC-VMEb
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The IC-PPC-VMEb is a QorIQ T2081 based 6U VME Single Board Computer with embedded L2 switch and user-programmable FPGA. SWaP-optimized, with more computing power and backward compatibility with existing designs and flexible interface combinations.
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Product
Micro probes 1 MHz up to 6 GHz
MFA 01 set
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The micro probes are used to measure magnetic fields and they have a high resolution. They measure magnetic fields up to 6 GHz, e.g. at signal conductors (150µm), SMD components (0603-0201) or IC pins. The MFA micro probes are guided by hand. An amplifier stage is integrated into the probe head. The amplifier stage (9V, 100mA) is powered via the Bias tee BT 706. It has an impedance of 50 Ohm. The micro probes are connected via the Bias tee BT 706 to a spectrum analyzer or an oscilloscope. Langer EMV-Technik GmbH includes correction lines in the delivery. With the help of the correction lines the probe output voltage is converted either into the respective magnetic field or to the current which is running through the conductor.
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Product
Temporary Bonding Systems
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Temporary bonding is an essential process to offer mechanical support for thin or to-be-thinned wafers, important for 3D ICs, power devices and FoWLP wafers, as well as for handling fragile substrates like compound semiconductors. A device wafer is bonded to a carrier wafer with the help of an intermediate temporary bonding adhesive, allowing the typically fragile device wafer to be processed with additional mechanical support. After the critical processes, the wafer stack is debonded. EVG’s outstanding bonding know-how is reflected in its temporary bonding equipment, which has been provided by the company since 2001.
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X-Band Silicon Radar Quad Core IC
AWS-0103
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The AWS-0103 is a highly integrated silicon quad core IC intended for radar and 5G phased array applications. The device supports four radiating elements, single beam transmit, and dual beam receive and includes all requisite beam steering controls for 6 bit phase and gain control. The device provides 21 dB gain and +15 dBm output power during transmit mode and 7 dB gain and +7 dBm IIP3 during receive mode. Additional features include gain compensation over temperature, temperature reporting, and fast beam switching using eight on-chip beam weight storage registers. The device features ESD protection on all pins, operates from a +1.8V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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Product
uSD Logger Shield
IFB-11001
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This micro SD logger shield enables time-stamped logging of any signals measured by your Arduino project! Whether sensor shields, breakout boards or datalink connections, this shield will get your logger project up and running quickly. We've included an MCP79410 Real-Time-Clock module for flexible supply voltage timekeeping, which includes an on-board battery holder for a CR1220 battery (included, and is installed). In addition, the micro SD card is interfaced through a high-speed translator IC and supplied with a high-current LDO to meet the demands of the SD standard. Each pin of the Arduino has an offset pin attached for easy wiring to the massive 13x9 pin prototyping area, including the pins connected to the ICSP header! Whether you're using a Mega, Due or Uno, this board has your interfacing needs covered! Finally, the micro SD holder is a push to lock, push to unlock type, which makes it really easy to both install and uninstall your card.
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End-of-Line IC & MEMS Tester
igentic® 841t
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Integrated circuit (IC) and micro electro-mechanical system (MEMS) device manufacturers need to address the challenges of today's global market including increased functionality, speed and complexity while delivering components at reduced costs. Sterner Automation's igentic® 841t automated test systems meet these demanding requirements by providing a flexible platform for comprehensive end-of-line IC and MEMS device handling, testing, grading and packaging. The resulting improvements in quality assurance and process efficiency will maximize customer satisfaction and profitability.
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Product
SparkFun FTDI Basic Breakout
3.3V
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This is a basic breakout board for the FTDI FT232RL USB to serial IC. The pinout of this board matches the FTDI cable to work with official Arduino and cloned 3.3V Arduino boards. It can also be used for general serial applications. The major difference with this board is that it brings out the DTR pin as opposed to the RTS pin of the FTDI cable. The DTR pin allows an Arduino target to auto-reset when a new Sketch is downloaded. This is a really nice feature to have and allows a sketch to be downloaded without having to hit the reset button. This board will auto reset any Arduino board that has the reset pin brought out to a 6-pin connector.
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Product
Ion Chromatography
Metrohm IC Driver 2.1 for Empower®
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Software drivers for integrating Metrohm IC instruments in "Empower® 3" made by Waters. One license per computer authorizes the operation of IC systems under "Empower® 3".
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Product
ESD Tester
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Tokyo Electronics Trading Co., Ltd.
Is performed to test the susceptibility of ICs and electronic devices to ESD.
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Product
PathWave IC-CAP Simulation and Analysis
W7010E
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The W7010E PathWave IC-CAP Simulation and Analysis add-on enables simulation, tuning, and optimization of device behavior using Keysight's PathWave Advanced Design System (ADS) or the provided SPICE3 simulator or by linking directly to supported external simulators.
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Product
Steering Diodes
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ProTek's low capacitance Steering Diode Arrays provide high-speed data line and I/O port protection from transients caused by Electrostatic Discharge (ESD), Electrical Fast Transients (EFT), Tertiary Lightning and other induced voltages. Steering diodes divert the transient to the power-bus or ground and away from sensitive IC components.
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Product
IC-3172, 1.80 GHz Intel Core i5 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784228-01
Controller
The IC‑3172 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3172 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
PathWave IC-CAP BJT Plus Extraction Package Plus
W7011E
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The W7011E PathWave IC-CAP BJT Plus Extraction Package Plus includes extraction for the Keysight HBT, VBIC, Gummel-Poon, and MEXTRAM models.
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Product
EMI Tester
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The EMI tester automatically measures the noise distribution of the electric field and the magnetic field radiated from electronic equipment with high accuracy.・ Even if PCB and IC parts have complicated bumpy shape and surface. The movable assembly can automatically trace them.・ EMI noise distribution is expressed as a variety of maps, such as 4D/3D/2D graphics and cross section view.
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68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
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68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Product
Resets And Voltage Detectors
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ST’s reset and voltage detector ICs provide basic voltage monitoring (low-voltage detect POR-LVD function) and reset timing for power-on resets. These devices offer:
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IC-ARM-VPX3a, 3U VPX LX2160A ARM-based Single Board Computer
IC-ARM-VPX3a
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Designed for applications requiring high processing and communication performance and low power, the IC-ARM-VPX3a is a highly versatile SBC for small, 3U OpenVPX systems. The IC-ARM-VPX3a is developed in alignment with the SOSA™ Technical Standard.
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Product
MAX31855 J-Type Thermocouple Sensor Breakout
SEN-30003-J
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Breakout board for the MAX31855J digital thermocouple interface ICs by Maxim. Measured temperature range is -210C-1200C with known thermal characteristics and output resolution of 0.25C. This sensor supports a larger operating range (specifically in the negative range) than its predecessors, the MAX6674 and MAX6675, though it is not pin-pin compatible. This board is interfaced with a 0.1" 2x5 pin header (8-pins used), has four vertical mini thermocouple connectors and four mounting holes for standoffs and 4-40 screws. The SEN-30003 is interfaced via 3 or 4-wire SPI with a data-ready output for specific operating modes. An LDO and a high-speed level shifter are included to allow interfacing with microcontroller devices between 3.0V and 5V (all Arduinos, Raspberry PI, etc) without sacrificing device performance (many other level shifters reduce data rates to below 500 kHz).
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PXIe-4137, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 100 fA Precision System PXI Source Measure Unit
783761-02
Source Measure Unit
PXIe, ±200 V, ±1 A DC, ±3 A Pulsed, Up to 40 W DC, 100 fA Precision System PXI Source Measure Unit - The PXIe-4137 is a high-precision, system source measure unit (SMU). It features 4-quadrant operation and sources up to 40 W of DC power and can pulse up to 500 W. Analog-to-digital converter technology helps you perform high-precision measurements with a current resolution of 100 fA or high-speed acquisitions up to 1.8 MS/s. The module also can maximize stability and measurement accuracy with SourceAdapt technology, which you can use to tune the transient response to match the characteristics of any load. The PXIe-4137 is ideal for a broad range of applications including manufacturing test, board-level test, and lab characterization with devices such as ICs, power management ICs (PMICs), and RFICs and discrete devices including LEDs and optical transceivers
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19’’ Rackmount 1/10 Gigabit Ethernet Switch
IC-SR-BOXa
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The IC-SR-BOXa is based on the Interface Concept ComEth4000e Layer 2/3 1/10 Gigabit Ethernet switch into a 19’’ rack mountable box. The IC-SR-BOXa is dedicated to industrial and military networking applications.
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Quad 6 Gsps 12-bit ADC
ADF-Q6012
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The DEG ADF-Q6012 FMC includes four 12-bit, 6 Gsps RF analog-to-digital converters (ADC). The ADF-Q6012 features a 16-lane, 24.75 Gbps JESD204C interface, flexible clocking and triggering options. This ADF-Q6012 leverages two Analog Devices AD9207 MxFE (Mixed Signal Front End) ICs, elevating the technology to a new level of integration.
