Alignment
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX
Model 5550
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- Now available in RFSoC Gen 3 with the Model 5553- Supports Xilinx® Zynq® UltraScale+™ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- 10 GigE Interface- 40 GigE Interface- Optional VITA 67.3C optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA 49, VITA 46, VITA 48, VITA 67.3C and VITA 65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8256 3U VPX SOSA Aligned Development Chassis- Model 6001 unique QuartzXM eXpress module enables migration to other form factors- Video: Model 8256 3U VPX SOSA Aligned Development ChassisPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Synchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPX- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
FlexVNX+ 8-Slot Test And Development Platform Aligned To SOSA And VITA 90 Standards
39S08VPXZZY2VAND
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Elma’s all-new FlexVNX+ Test and Development chassis is the next generation portable test platform designed to accelerate development and test of VNX+ plug-in cards (PICs) aligned to The Open Group® SOSA™ Technical Standard and VITA 90.
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Product
3U 6-slots 25Gb Backplane Aligned To SOSA, Apertures For VITA 66/67 Modules
1SVX306AxP-xxxx
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Designed in alignment SOSA, this 3U backplane offers 6 PIC (Plug in Card) slots supporting high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Product
IPMI Controller & Software For VPX Systems Aligned With SOSA
IPMI-C-VP-S1 and 79-V48-3-IPMC-TB-S1
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Elma‘s VITA 46.11 Intelligent Platform Management Controller (IPMC) for VPX is a pre-programmed part and source-code package created to give designers a quick path to integrating VITA 46.11 system management functionality onto their board designs.
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Product
MORA Ready Development Platform: CompacFrame Integrated With SOSA Aligned PICs And Sciens Innovations Helux Core RF Tools
SE9M3PS9YIBXNLY
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The MORA-Ready Development Platform (MRDP) simplifies the process of creating RF signal processing capabilities and accelerates integration of existing applications. Featuring Sciens Innovations helux™ Core powerful software tools to accelerate RF signal generation and system development.
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Product
6-Slots 25Gb Backplane Aligned To SOSA, With VITA 67.3D Aperture In Switch Slot, With Apertures For VITA 66/67 Modules
1SVX306ACP-1X31
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6-slots 25Gb backplane aligned to SOSA, with VITA 67.3D aperture in switch slot, with apertures for VITA 66/67 modules
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Product
Type 39 CompacFrame Development Platform, 6 And 8 Slot 3U OpenVPX Aligned To SOSA
39S0xBWX94Y3VCC0
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Elma’s SOSA aligned CompacFrame is the next generation portable test platform designed to accelerate development and test of plug-in cards (PICs) aligned to the Open Group® SOSA™ Technical Standard. Accommodates up to 8-slot OpenVPX backplane.
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Product
3U 5-slots 25Gb Backplane Aligned To SOSA. AFT And VITA 48.8 Ready
1SVX306APP-1X31
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Designed in alignment SOSA, this 3U backplane offers 5 PIC (Plug in Card) slots supporting high-speed signals on all data paths and VITA 67.3 connectors and VITA 66.5 optical connectors.
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Product
725-Watt (28VDC input) DC/DC Converter, SOSA™ Aligned, 3U VPX
VPX55HS
DC Converter
NAI’s VPX55HS-31 is NAI's latest +28 VDC Input, VPX DC/DC Converter. The VPX55HS was developed in alignment of the SOSA™ Technical Standard and is capable of handling up to 725 Watts of output power. It plugs directly into a standard 3U VPX chassis with a VITA 62 1.0” power supply slot. This off-the-shelf solution for VITA 46.0 and VITA 65 systems is compatible with VPX specifications; supports all VITA standard I/O, signals, and features; and conforms to the VITA 62 mechanical and electrical requirements for modular power supplies.
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Product
3U OpenVPX™ SOSA™-Aligned Single Board Computer Intel® Xeon® W Processor (Tiger Lake)
68INT6H
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The 68INT6H is a SOSA™-aligned 3U OpenVPX Intel® Xeon® W Processor (Tiger Lake) w/ 8 Cores & 24 M Smart Cache running up to 2.6 GHz Single Board Computer that can be configured with up to two smart I/O and communications function modules (w/ NAI-XMC configuration option). Ideally suited for rugged Mil-Aero applications, the 68INT6H delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
