Alignment
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Product
Cladding Alignment Splicer
95EA
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OFS-95EA optical fiber fusion splicer is designed with high-speed image processing technology and special precision-positioning technology. It will automatically finish the whole fiber fusion process in 9 seconds by fast mode, and splice loss is lower than 0.02dB for single mode fiber. 3.5-inch LCD, dual CMOS monitors, X and Y axis separately display or simultaneously display, thus different fusion stages can be showed clearly. It is compatible with ITU-T SM/MM/DS/NZDS/ED fiber, and is equipped with 4-in-1 holders and SOC adapter.
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Product
Multiphoton FLIM System
DCS-120 MP
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*Multiphoton FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*Excitation by Ti:Sa Laser*Two Non-Descanned Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage*Laser Control via SPCM Software
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Product
Headlight Alignment Testing Technology
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Maschinenbau Haldenwang GmbH & Co. KG.
See and be seen: The headlight adjustment test technology provides the user with information about the horizontal and vertical adjustment of vehicle headlights and their intensity. With the help of the headlight alignment test technology, the headlights can be adjusted, taking legal or manufacturer-specific requirements into account.
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Product
High-Speed & High-Precision Alignment for Display Metrology
LMK Position
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TechnoTeam Bildverarbeitung GmbH
The LMK Position is a photometric robotic system combining LMK-based machine vision with the high precision and flexible movements of a 6-axis Denso VS industrial robot and, optionally, a JETI specbos spectroradiometer. It allows effective and cost-efficient accompanying measurements during research and development tasks and rapid small-series product testing of all kinds of display systems.
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Product
Automated Laser Beam Quality Measurement System
Beamage-M2
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Large Apertures: The only M2 system on the market equipped with a complete set of 50mm optics. Also, the sensor is 11.3 x 11.3 mm. Simple Alignment: Two beam-steering mirrors are included for quick and easy alignment of your laser into the system. The internal mirrors are factory-aligned and the pre-set height also simplifies the alignment.Available Fall '17
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Product
UFP series High Sensitivity Fiber Optic Alignment Stages
UFP
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Model: UFP1A-LFeatures:• The linear stage has both coarse adjustment and fine adjustment, sensitivity is much better than 0.5um• The rotation stage sensitivity is much better than 23.4" • High stability
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Product
TCoE Setup
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Alignment of the QA strategy to your business goals is critical to ensure that the QA enterprise is able to deliver on the dynamic expectations of the business. While the quality of your applications is an essential metric for the QA enterprise, it also needs to focus on continuous improvement and to be ready for future technologies. At TestingXperts, we help you transform your QA to a next-gen organization by setting up a Testing Center of Excellence (TCoE).
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Product
Mask Alignment Systems
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EVG’s inventions, such as the world’s first bottom-side alignment system in 1985, have pioneered and set the industry standards in both top and double-sided lithography, aligned wafer bonding and nanoimprint lithography. EVG contributes in these areas through continuous development of mask aligner product generations to augment this core lithography technology.
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Product
ADAS Tools
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This 12.7-inch wireless touchscreen tablet comes replete with all the functionality expected in an advanced diagnostic and service tablet including the ability read and erase codes, view Freeze Frame and view and graph Live Data, perform Active Tests and perform coding and adaptions, plus it includes ADAS calibration and Wheel Alignment software.
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Product
Optical Fusion Slicers
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ShinewayTech Optical Fusion Splicers - Ribbon, Clad Alignment & Core Alignment Splicers.
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Product
Belt Alignment
Belt Hog
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The Acoem USA Belt Hog uses the pulley groove as the reference, allowing you to achieve a precise belt alignment which reduces wear, bearing failures and vibrations.
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Product
3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Product
Automotive Radar Test ∙ Evaluation
XRE
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KEYCOM develops and manufactures various radar systems to measure and evaluate such functionalities of mass-produced millimeter and microwave radars including in-vehicle radars as transmission power, frequency, antenna beam alignment, distance accuracy, bearing accuracy and receiving accuracy.KEYCOM’s product line includes the Radar Test System (RTS) that measures radar distance accuracy and transmission power, and the Rader Alignment System (RAS) that assists you to adjust the mounting position of the in-vehicle radar.
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Product
Confocal FLIM System
DCS-120
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*FLIM Upgrade for Existing Conventional Microscope*Two Fully Parallel TCSPC FLIM Channels*Compact bh Simple-Tau or Power-Tau System*Scanning by Fast Galvanometer Mirrors*Channel Seperation by Dichroic or Polarising Beamsplitters*Individually Selectable Pinholes and Filters*One or Two BDL-SMN or BDS-SM ps Diode Lasers*Two Fully Confocal Detection Channels*Two HPM-100-40 GaAsP Hybrid Detectors*Optional: Two HPM-100-06 Hybrid Detectors, IRF Width < 20 ps FWHM*Optional: HPM-100-50 Hybrid Detectors for NIR FLIM*Optional: Multi-Wavelength FLIM*Excellent Time Resolution: Electrical IRF Width 6.5 ps FWHM*Time Channel Width Down to 813 fs*Megapixel FLIM, Up to 2048 x 2048 Pixels at 256 Time Channels*Simultaneous FLIM/PLIM*Wideband Version, Compatible with Tuneable Lasers*Electronic Pinhole Alignment*Z-Stack FLIM Acquisition with Zeiss Axio Observer Z1*Optional: Spatial Mosaic FLIM via Motorized Sample Stage
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Product
Bi-Directional Alignment Laser
LA-01MB-AK
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These bi-directional alignment lasers allow Quick & Easy adjustment of optical experiments and optical sets.
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Product
High-Dynamic-Range Polarimeters
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*Three Wavelength Ranges Available**400 nm - 700 nm**600 nm - 1080 nm**900 nm - 1700 nm*Rotating-Wave-Plate-Based Measurement*High Dynamic Range of 70 dB*Excellent Azimuth and Ellipticity Accuracy of ±0.25°*Sampling Rate up to 400 Samples/s*Beam Terminates Inside the Module*Ø3.0 mm Free-Space Beam Input or FC/PC Fiber Input *Fully Featured Software Includes Alignment Tool and Extinction Ratio Measurement Tool
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Product
Fiber Fusion Splicer
KL-300T
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Hangzhou Softel Optic Co., Ltd.
*Core to core alignment by PAS technology (PAS:Profile Alignment System)*Fiber core can be display clearly*Single X or Y view and X & Y view simultaneously*Auto check quality of cleaved end face*Display fiber cleaved and offset angle*Display core and clad offset*5.6 inch TFT color LCD monitor with clear digital image display*USB & VGA interface*Software upgrade via USB interface
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Product
Core Alignment Splicer
Model：95S
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OFS-95S fiber optic fusion splicer is designed as a highly flexible instrument with 6-motor precise micron levelcontrol and splice loss lower than 0.02dB for G.652 fiber. Equipped with removable universal fiber holders (250μm/900μm/patchcord/FTTx indoor fiber etc.), SOC holder and internal thermometer / barometer, OFS-95S can be deployed anywhere. Fast 5s startup, 9s splicing and automatic heating features enable the splicer an efficient tool for large volume splicing operation during fiber installation and maintenance.
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Product
Radar Systems / Millimeter Wave Radar / Micro Wave Radar
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KEYCOM develops various radars for versatile applications based on its knowledge and expertise on millimeter wave and microwave technologies. KEYCOM’s product line of radars includes Radar Test Systems (RTS) to evaluate distance accuracy or output, Radar Alignment Systems (RAS) to help you adjust the alignment of radars, and Radar Cross Section (RCS) measurement systems to measure RCS of such radar targets as aircraft, ships and automobiles.
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Product
CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Product
MLA 300 Maskless Aligner
MLA 300
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The MLA 300 Maskless Aligner is engineered for high-volume production, delivering exceptional flexibility and precision in the realm of industrial lithography. This innovative tool supports wafers up to 300 x 300 mm and is capable of dynamically adjusting to surface variations, effectively eliminating the need for costly and time-consuming mask production. By employing direct data exposure instead of traditional masks, the MLA 300 provides advanced solutions for complex lithography challenges, including those encountered in advanced packaging, sensor calibration, and MEMS fabrication. With its high throughput of up to 18,000 mm²/min and resolution down to 1.5 μm, it streamlines workflows and integrates seamlessly with manufacturing execution systems (MES), making it the preferred choice for a broad range of applications like microfluidic devices and other cutting-edge technologies.
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Product
Automated Front & Backside Mask Aligner System
Model 6000
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With over 4 decades of manufacturing in the semiconductor industry, OAI meets the growing challenge of a dynamic market with an elite class of production photolithography equipment. Built on the proven OAI modular platform, the Model 6000 has front and backside alignment that is fully automated with a submicron printing capability as well as submicron top to bottom front side alignment accuracy which delivers performance that is unmatched at any price. Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000 microns), warped wafers (up to 7 mm-10mm), thin substrates (down to 100 micron thick), and thick photo resist.
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Product
Single Fiber Aligner
1100
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The 1100 Single Fiber Aligner uses patented fiber alignment concepts to produce virtually instantaneous temporary couplings for OTDR, dispersion, or any other optical fiber or component test that requires a fiber-to-fiber connection. It delivers low loss, low reflectance couplings on the first try virtually every time, without the need for test instrument feedback. As a result, temporary coupling times are minimized and manufacturing costs are reduced without compromising product quality.
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Product
Tabletop Front & Backside Mask Aligner
Model 200IR
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The OAI Model 200IR Mask Aligner is a tabletop system that requires minimal clean room space. It is a cost-effective alternative for R&D or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The Model 200IR Mask Aligner is capable of one micron resolution and alignment precision. It has an alignment module which features mask insert sets and quick-change wafer chucks that enable the use of a variety of substrates and masks without requiring tools for reconfiguration. The alignment module incorporates micrometers for X, Y, and z-axis.
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Product
3U 12-Slot Development Platform Aligned To SOSA 1.0 And CMOSS
39E12WUX98Y2VCM0-SOSA1
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3U OpenVPX development platform aligned with SOSA 1.0. It supports both SOSA and CMOSS profiles. It includes: 2 I/O intensive SBC, 7 primary payload, 1 radial clock, 2 switch and 2 power. Includes VITA 67.3 RF and optical I/O modules.
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Product
3U VPX SOSA Aligned Development Chassis
Model 8256
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- Video: AOC 2021 Mercury's Model 8256 SOSA Aligned Dev. Platform and RFM3202 Microwave Transceiver- Video: Model 8256 3U VPX SOSA Aligned Development Platform, multi-vendor operation demonstration- Video: Model 8256 3U VPX SOSA Aligned Development Chassis- Developed in alignment with the SOSA™ Technical Standard- Ideal development platform for Pentek's- Model 5550 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- Model 5553 8-Channel A/D & D/A Zynq UltraScale+ RFSoC Processor - SOSA Aligned 3U VPX- 8-slots provide space for a range of acquisition and processing boards- Optional rear panel RF and optical connections- Compatible with the Quartz product family
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Product
SOSA Aligned LVDS with Optical I/O Kintex UltraScale FPGA - XMC
Model 71813
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Supports Xilinx Kintex Ultrascale FPGAs- Supports the emerging SOSA™ Technical Standard- PCI Express (Gen. 1, 2 & 3) interface up to x8VITA 42.0 XMC compatible with switched fabric interfaces- Optional front panel optical interface- Ruggedized and conduction-cooled versions available- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Tabletop Mask Aligner
Model 200
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The OAI Model 200 Mask Aligner is a cost-effective high performance mask Aligner that has been engineered with industry proven components that have made OAI a leader in the photolithography capital equipment industry. The Model 200 is a tableop mask Aligner that requires minimal cleanroom space. It offers an economic alternative for R&D, or limited scale, pilot production. Utilizing an innovative, air bearing / vacuum chuck leveling system, the substrate is leveled quickly and gently, for parallel photo mask alignment and uniform contact across the wafer during contact exposure. The system is capable of one micron resolution and alignment precision.
