Integration
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Integration testing
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Integration testing primarily focuses on verifying data communication among different modules of the software project. Integration tests determine the effectiveness and performance of different software modules when they are connected to each other.
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Custom Integration
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K&L Microwave provides a variety of custom integrations built to customers' electrical, mechanical, and environmental specifications. Designs are based on standard products integrated into complex assemblies to offer turn-key solutions to advanced filtering requirements. The list below contains part numbers meeting existing industry and customer specifications, as well as product families.
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ATE Integration
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Want to improve the overall test coverage of your assembled boards? It’s easy. Simply combine or integrate your JTAG Technologies boundary-scan tools with your existing automatic test equipment (ATE). We work with any vendor of in-circuit testers (ICT), flying probes (FPT) or functional testers (FT).We offer solutions for most of the available automatic test equipment systems, in addition we can support you with customized integrations for your existing automatic test equipment (ATE).
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Passive Component Integration - MATRIQ
Passive Component Integration
The Passive is a highly customizable benchtop accessory that can integrate the passive components of your choice for convenient storage and integration into your test set up.We can customize the Passive module with a wide range of passive components: WDM couplers, splitters, circulators, band-pass filters, PM beamsplitters, MUX, DeMUX and more.Our spec sheet contains a selection of popular configurations.Please contact us to discuss your specific requirements at sales@quantifiphotonics.com.
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Systems Integration
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Libra delivers customized manufacturing solutions for high complexity system integration requirements. No matter the industry, we most likely have experience in it across our 85 years of delivering solutions. We have expertise in large complex electro mechanical assemblies, both at the final product level as well as subassembly levels. From advanced robotics to intricate semiconductor capital equipment requirements, we combine system level capabilities with vertical capabilities and know how, that allows us to understand the technical underpinnings of your product. Our well equipped clean room facility allows us to deliver to the cleanliness standards that your product requires.
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Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Full Custom Integration
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SKY Computers is a leading provider of fully configured subsystems for demanding signal and image processing. Based on open standards, SKY's SMART systems deliver high-performance and high application availability with a secure, "intelligent," and adaptable design that includes both hardware and software resources.
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Integration
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Aegis Industrial Software Corp.
MES cannot exist as an information island. Other systems such as ERP, time and attendance, PLM and factory and warehouse equipment all benefit from MES data and vice versa. To ensure efficient connection to the enterprise, FactoryLogix offers the most integratable architecture and options available. Business system integration via an Service-based API, programmatic data export for basic integrations, and standards-based machine data acquisition to connect the factory assets to the system.
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Integration of Inline Test Systems
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The test system and adapter can also be integrated in inline test systems. Additional communication can take place via interfaces (e.g. RS232, DLL). We have already created numerous integrations for different manufacturers.
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Components for System Integration
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Bh offers a wide range of accessories to improve your photon counting experiment such as experimental control modules, optomechanics or implantable fiber probes for in-vivo applications. For PMTs and MCPs we offer different preamplifiers and a variety of routing devices for multi-detector operation. For a perfect SYNC signal, trigger modules and a SYG are available.
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Passive Component Integration
Passive Component Integration
Integrate passive optical components of your choice such as WDM couplers, splitters, band-pass filters, PM beamsplitters and circulators. PXIe and benchtop models support SMF, MMF and PMF.
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Passive Component Integration - PXIe
Passive Series
Passive Component Integration
The Passive PXIe module is a highly customizable PXIe module that can integrate the passive components of your choice.We can customize the Passive module with a wide range of passive components: WDM couplers, splitters, circulators, band-pass filters, PM beamsplitters, MUX, DeMUX and more.Our spec sheet contains a selection of popular configurations.Please contact us to discuss your specific requirements at sales@quantifiphotonics.com.
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In-Circuit Tester Integration
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The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
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Test Systems Integration
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Highly flexible test solutions that are cost effective offering basic tests that easily adapts to high product volumes and complicated tests. Mobile computer based test stations provide a wide variety of test solutions at efficient costs.
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ESI(Electronics Systems Integration Unit)
MS 2004
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The ESI subsystem provides platform interfaces like Gyro and on board Radar Blanking. This unit receives Analog and Digital GYRO inputs from ship and pre- trigger pulses from on board radars of the ship. This unit measures and provides the ship heading data to VARUNA ESM system. It also provides Heading, Roll and Pitch data to the ECM system. This unit also generates band wise composite ESM Rx. Blanking gates and provides all the required interfaces to ESM receiver, ECM System and System Controller units.
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Integrated Flight Controller
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Kratos Defense & Security Solutions, Inc.
The Integrated Flight Controller (IFC) controls the entire flight functionality and maneuverability of the BQM-167 subsonic aerial target platform. The IFC accepts commands from a ground control system (such as GRDCS, SNTC, or TTCS), inputs current vehicle operating parameters from onboard sensors, and outputs control signals to the vehicle for flight control. The IFC supports multiple high performance maneuvers, such as barrel rolls, high G turns, and low altitude operation.
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Temperature Humidity Vibration Comprehensive Integrated Test Chamber
THV-1000
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Can match appropriate vibration table. Meet all kinds of the corresponding temperature, humidity, vibration, three comprehensive test requirements. Widely used in aviation, aerospace, shipbuilding, electrical, electronics, communications and other fields
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Integrated Rotating Systems
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In a radar, for instance, the integrated Rotary Joint connects the moving part of the radar with the pedestal, enabling uninterrupted transfer of multiple media. This transmission can be a combination of RF signals in waveguides or coax channels, or multiple other needed transfers like cooling media, fiber optical signals, electrical signals and air. The design of this Integrated Rotating System is conducted in cooperation with the customer, resulting in a tailor-made product with low losses, high peak performance and compact physical dimensions. EVERAXIS’s extensive experience guarantees a product that has one of the longest lifespans in the market.
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High performance multisensor
Werth StentCheck®
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High performance multisensor CMM with Integrated Werth Zoom® optic with magnification 0.7x – 6.8xRotary/Tilt Axis with high speed air bearing rotary axisRotary OnTheFly for fast measurementsContour image processing for fully automatic measurements of complex geometrical elements with sub-micron repeatabilityIntegrated goniometer (tilting axis) allows for the measurement of non-cylindrical geometriesUnique lighting design optimized for measurement of stentsTemperature compensation included
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PoE LLDP Emulation (PD) & Analysis for 802.3at & 802.3bt
802.3at and 802.3bt PD Emulation and Protocol Analysis
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Integrated PoE LLDP and Load Emulation in a Single Instrument. IEEE 802.3at and 802.3bt LLDP Compliance Analysis. Independent, Per-Port 802.3at and 802.3bt LLDP Emulations. Flexible Single and Dual Signature PD LLDP Emulations. One-Click LLDP Protocol Capture and Analysis. Pop-Up Excel Spreadsheet Reports Assess Protocol Content and Timing. Enables One-Click Emulated Power-Ups and Standard Waveforms with LLDP Power Granting PSE's. Enables 2-Pair and 4-Pair PSE Conformance Test Suties with LLDP Capable PSE's. Enables 2-Pair Multi-Port Suite with LLDP Capable PSE's. Available for PSA-3000 and PSL-3000 Platforms.
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IO-Link
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The IO-Link® interface simplifies communication to smart sensors and actuators, combining signaling with power-over-cable technology. It has become one of the key devices as industrial automation systems are growing more interconnected and intelligent to accommodate demands for centralized control and optimized production. Analog Devices implements both device PHY and master PHY interfaces (COM1/COM2/COM3). Designing with harsh industrial environments in mind, the master 4-port IO-Link power and communications interface, as well as the IO-Link transceivers featuring Integrated Step-Down Regulators and LDO with ±60V cable interface protection provide the required ruggedness. Optimum EMC performance is achieved with adjustable current limit and slew rate transmitters. Automatic wake-up request (WURQ) generation and an output supply current boosting capability for device startup are also available. Additional components integrate a 300 mA step-down (buck) regulator and a 150 mA LDO to supply all the power required for internal electronics in an connected sensor or actuator.
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BG Series Bass Amplifiers
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250 Watt Bass Combos with Built-In TonePrints and Integrated Tuner.
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500 MHz Active Differential Probe
AP033
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Fully Integrated: With the ProBus™ interface, the AP033 becomes an integral part of the oscilloscope. The probe sensitivity and offset can be controlled from the oscilloscope front panel, the probe front panel, or by using remote control commands (GPIB or RS-232). Sensitivity, offset, input capacitance, and common mode voltage range are displayed on the oscilloscope screen. When used with a LeCroy digital oscilloscope, no external power supply is required.
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Modulation Distortion Up To 26.5 GHz
S930702B
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S930702B enables fast and accurate active-device modulation distortion characterization under modulated stimulus condition up to 26.5 GHz. The wide dynamic range and vector error correction of the PNA-X result in an extremely low residual EVM of the test setup, so you can get a complete picture of your device’s performance without test system interference. S930702B can measure EVM, NPR, ACPR, and can decompose nonlinear signals and linear signals with the spectral correlation between input and output spectrum without doing demodulation. Integration with the PNA-X SCCM provides quick modulation distortion measurements while making other VNA measurements.
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3.0 GS/sec Ultra Wideband RF/IF Rugged Rackmount Recorder
Talon RTR 2745
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- Two 3.0 GHz 14-bit A/Ds- Two 2.8 GHz 16-bit D/As- Real-time record/playback rates up to 6.4 GB/sec- Integrated DDCs and DUCs- Capable of capturing RF signal frequencies up to 3 GHz- Captures and reproduces IF bandwidths up to 560 MHz- Captures baseband bandwidths up to 1.5 GHz- 4U 19-inch rugged rackmount PC server chassis- Windows® Professional workstation with high performance Intel® Core™ i7 processor- Designed to operate under conditions of shock and vibration- Removable SSD drives- Up to 61 terabytes of storage in integrated NTFS RAID disk array- Selectable RAID levels of 0, 1, 5, 6, 10 and 50- SystemFlow® GUI with signal viewer analysis tool- C-callable API for integration of recorder into application- Optional GPS time and position stamping
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Si1145 UV / Ambient Light / Proximity Sensor
SEN-36002
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SEN-36002 is a highly integrated carrier board designed for the Si1145 UV, Ambient Light and Proximity sensor IC from Silicon Labs. This sensor has 100mLUX resolution, and has a dynamic range of 1 LUX to 128 kLUX with IR correction. This means that whether your application is indoors in poor lighting conditions or outside in full sunlight, this sensor has you covered. In addition, we added a high power LED (150mA max, 20 degree) to take full advantage of the proximity sensing capability of this IC - something you won't see on most competitive carrier boards. Integration is easy with 4 x 4-40 sized mounting holes at the corners of the PCB and signal translation to handle interface voltages from 3V to 5V. The board is interfaced via an I2C interface and function pins have been broken out to a 0.1" pin header. The INT pin is also broken out for interrupt capability.
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Time Delay and Integration (TDI) Line Scan Camera
Piranha HS
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The Piranha HS cameras provide an alternative to traditional line scan imaging. They enable you to meet the line rates and responsivity necessary for your high performance applications and allow you to reduce the number of cameras in your system. When you use fewer cameras, you use fewer framegrabbers, lenses, computers and cables. The Piranha HS family delivers the lowest price/pixel TDI system solution ever offered by Teledyne DALSA. Lighting costs can also be reduced. With TDI imaging, you can use LED lights, helping you to optimize system up-time and productivity.
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Integration Test
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We test the interfaces between the functions and modules and the time dependence between the different functions to ensure that they meet the specification determines by the Classification Tree Method (CTM)
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Automatic Wire Test Set
AWTS
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The Automatic Wire Test Set (AWTS) is automated test equipment that aids wiring diagnostics of electrical and electronic devices. The Test Control Unit (TCU) uses resistance measurements, capacitance measurements, and AC/DC voltage measurements to perform continuity, insulation, and isolation tests. The AWTS Laptop CPU, hereafter referred to as CPU, controls the AWTS. The Eclypse Language Integrated Test Environment (ELITE) is application software that controls the TCU. The majority of the hardware for a test is contained in the TCU. The 128pin connector on the TCU front panel provides 128 energizable test points. Switch Modules (SM) can be connected in sequence or daisy chained to the TCU and provide an additional 1024 test points; 128 of those are energizable.
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COM Express Type 6 Basic Module With Intel® Xeon® E3/7th Gen Intel® Core™ I7/i5/i3 Processors And Intel® CM238/QM175/HM175
CEM510
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The CEM510 is based on the Intel® Xeon® E3 and 7th generation Intel® Core™ i7/i5/i3 processors with Intel® CM238/QM175/HM175 chipset. The 125 x 95 mm system-on-module was designed for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, and gaming machines. The embedded module is equipped with dual 260-pin DDR4-2133 SO-DIMM slots with up to 32GB system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of various harsh conditions. For evaluation and development purposes, Axiomtek also has the CEB94011, a carrier board designed to operate with the CEM510 for additional I/O and expansions interfaces. Integrated with Intel® Gen 9 graphics, and with the support of DX12.0, OCL 2.0 and OGL 4.3, the module presents excellent graphics performance with resolution up to 4K (3840 x 2160 @ 30 Hz). Three independent displays are supported through LVDS and three DDI ports supporting HDMI, DisplayPort, and DVI (one DDI supporting optional VGA).
