SoC
A complete computer "System on a Chip".
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Product
SoC Verification
TrekSoC
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TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Product
SoC Test System
T2000
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SoC devices require small-lot high-mix manufacturing methods in the present era of rapid generation change. Semiconductor makers struggle with requirements to replace their testers on a 2-3 year cycle. The T2000 addresses their needs by enabling rapid response to market needs with minimum capital investment.
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Product
SoC Tester
UltraFLEXplus
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The UltraFLEXplus combines new instrument and software capability with a revolutionary tester infrastructure that provides a step-function improvement in throughput and engineering efficiency – all while leveraging the cumulative test IP developed over the UltraFLEX’s 15 year history .
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Product
COM Express® Compact Size Type 2 Module with Intel Atom® E3800 Series or Intel® Celeron® Processor SoC (formerly codename: Bay Trail)
cExpress-BT2
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The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
SoC Integration At RTL
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Before logic synthesis, STAR enables full implementation capabilities towards IP and connectivity insertion with a real-time monitoring of the integration progress. This enables SoC creation in minutes and maximize design reuse from existing projects.
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
COM-HPC Server Type Size E Module with Ampere® Altra® SoC
COM-HPC-ALT
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ADLINK’s COM-HPC Ampere Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Ampere Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.
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Product
High Soeed CMOS System on Chip (SoC) Line Scan Image Sensor
LS4k
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The LS4k is a high speed CMOS System on Chip (SoC) line scan image sensor optimized for applications requiring short exposure times and high accuracy line rates. It incorporates on chip two pixel arrays consisting of 2 rows with 4,096 7µm pitch pixels and 4 rows with 2,048 14µm pitch pixels respectively, a high accuracy (12-bit) high speed (84MHz) analog-to-digital conversion (ADC), and sophisticated on chip optical calibration for PRNU, DSNU, and lens shading correction.
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
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The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
SMARC V1.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC,1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN, MIPI And PCAM
SCM120-120-EVK
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*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Open GL ES2.0*Linux3.0.35/Android 4.3*Audio
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Product
Intel® Xeon™ SoC, PCIe Gen3 And 10GbE (XAUI), 6U VPX
VPX752
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The VPX752 is a processor module (VITA 46) for general purpose processing in demanding applications. Based on the Intel 5th generation Xeon-D processor, the efficient SoC design has low power consumption and integrated PCH technology.
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Product
SMARC
ROM-5820
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The Advantech ROM-5820 stands as a state-of-the-art SMARC 2.1 Computer-on-Module, incorporating the robust NXP i.MX95 System-on-Chip (SOC). This SOC features an impressive configuration, with up to six Arm Cortex-A55 cores, accompanied by a dedicated Cortex-M7 and M33 real-time processor, and an added Neural Network accelerator. The ROM-5820 provides extensive connectivity options, including USB 2.0, USB 3.2 Gen1By1, 10 Gigabit Ethernet, MIPI-CSI, PCI Express, as well as both a dual-channel LVDS and a 4-lane MIPI-DSI Display interface. These remarkable features position the ROM-5820 as an exceptional choice for a wide variety of embedded applications.
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Product
3U OpenVPX FMC Carrier
VF361
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Sundance Multiprocessor Technology Ltd.
The VF361 is a 3U OpenVPX module that leverages on the ALTERA Arria ® V SoC FPGA, ARM Cortex-A9, and Texas Instruments Keystone Multicore DSP technology to provide a high bandwidth processing platform, ideally suited for computation and bandwidth intensive applications such as RADAR, networking, SIGINT, EW, SDR and Video.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
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The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
Automatic Phishing Mitigation Module
IronTraps
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Phishing Forensics, automatically executed by IronScales servers upon reports of suspicious email, includes analysis of the number and skill ranking of the responders, Multi AV, Sandbox Scan, and other proprietary analyses which determine the mitigation response.Automatic Mitigation Response at the Gateway and Endpoints may consist of enterprise-wide quarantine, disabling of links and attachments, removal of email etc., as pre-configured by the SOC team.Intrusion Signature is generated with each attack to the endpoints and to the SIEM.Optional 1-Click Response An immediate directive triggered manually by the SOC team to the IronScales servers.
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Product
Pico-ITX SBC With Intel® Pentium® N3710 & Celeron® N3060 Processor, HDMI (VGA)/LVDS, LAN And Audio
PICO300
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The PICO300, an extreme-compact fanless pico-ITX motherboard, is built with the Intel® Pentium® N3710 or Celeron® N3060 processor (codename: Braswell SoC). One SO-DIMM socket is provided to support up to 8GB of DDR3L-1600 memory. The PICO300 is supported in dual display configurations along with one 18/24-bit single/dual-channel LVDS and a choice of VGA or HDMI. Furthermore, the tiny 2.5” pico-ITX embedded board features Intel® integrated Gfx graphic engine to build excellent media and graphics performance capability. In addition, the compact size of the pico-ITX form factor also makes the PICO300 suitable for space-constrained embedded applications. It runs fanless operation, and supports -20°C to +60°C operating temperature. Combined all features as above, the PICO300 is ideal for any media editing, imaging, graphics and video intensive applications that be applied for a wide array of industrial IoT industries.
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Product
3U OpenVPX Module Xilinx Zynq UltraScale
VPX3-ZU1
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Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1 is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. The Zynq UltraScale+ integrates a Quad-core ARM Cortex-A53 based Application Processing Unit (APU), a Dual-core ARM Cortex-R5 based Real-Time Processing Unit (RPU), a ARM MALI-400 based Graphic Processing Unit (GPU) and an UltraScale+ Programmable Logic (PL) in a single device. It also includes on-chip memory, external memory interfaces, and a rich set of peripheral connectivity interfaces.
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Product
SOC Battery Tester
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This sophisticated battery test equipment allows the battery tester to exercise and explore the battery’s internal profile and produce a true state of charge revealing the batteries true AHR capacity and ability to perform under load.
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Product
ATEX & CID2 Anti-Explosion Certified Robust DIN-rail Fanless Embedded System With Intel® Atom® Processor E3827 (1.75 GHz)/E3845 (1.91 GHz)
rBOX510-6COM (ATEX/C1D2)
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The rBOX510-6COM(ATEX/C1D2) robust din-rail fanless embedded system is certified with ATEX and C1D2 for use in hazardous environments where ignitable concentrations of flammable gases, vapors or liquids might exist. The embedded system supports the dual-core Intel® Atom™ processor E3827 1.75GHz SoC with the onboard 4GB DDR3L system memory. The din-rail heavy-duty embedded PC adopts an IP30-rated aluminum and steel enclosure, and can perform in wide temperatures ranging from -40°C to +70°C. To prevent ESD and over-voltage, the compact embedded box PC is equipped with four isolated RS-232/422/485 ports, two isolated 10/100/1000Mbps Ethernet ports, and one isolated DIO (8-IN/8-OUT) port. One 2.5" SATA SSD, one mSATA and one CompactFlash™ socket are available for storage. More I/O features include one USB 3.0 port, one USB 2.0 port, two COM ports, and one VGA output. In addition, box PC comes equipped with a wide range 12 - 48VDC power input with a terminal block and has overvoltage and reverse protection. The box PC provides two watchdog timers and RTC battery function. Pre-installed with Linux, Windows® 8 Embedded and Windows® 7 Embedded, the embedded system provides programmers with a friendly environment for developing application software at a lower cost. For secure mounting, the rBOX510-6COM(ATEX/C1D2) can be easily installed on a DIN-rail mount or in an enclosure box.
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Product
Semiconductor Testers
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Designing and manufacturing scalable Automated Test Equipment (ATE) targeted at testing SOC, MCU, RF PA/FEM, Sensors/MEMS and Power and Analog devices
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Product
Hybrid Verification Platform
HES-DVM
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HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, HDMI/LVDS And LAN
PICO312
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The PICO312 is a palm-sized fanless pico-ITX motherboard built with the latest 14 nm Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake SoC). One 204-pin DDR3L-1867 SO-DIMM socket supports system memory up to 8GB. The tiny 2.5” pico-ITX embedded board features Intel® Gen9 graphics engine bringing a true high definition visual experience with dual display configurations through one LVDS and HDMI. In addition, it was designed for special needs of fanless operation under temperature from -20°C to +70°C. The PICO312 features a full-sized PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors with additional signals including one PCIe x1 lane, one LPC, one DDI, four USB 3.0 ports, one SMBus and one HD audio, giving this SBC high expandability to meet all requirements.
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Product
Battery Testing
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Electric vehicles (EVs) rely on batteries as their primary source of energy storage. As battery packs require battery management systems (BMS) to operate safely and reliably, it is vital to test control algorithms for state of charge (SoC) estimation or cell balancing at an early stage.
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Product
Custom & ASSP
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Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Product
Gate-Level Design Optimization
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After logic synthesis, STAR helps reaching power, performance and area (PPA) requirements for complex SoCs is becoming a real challenge. Large design netlists are restructured and optimized to reach aggressive PPA requirements, cost-effectively.
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Product
Intel® Celeron N3160/N3060 SoC, Intel® Atom E8000 SoC, 3.5" SBC, DDR3L, VGA, HDMI, 48-Bit LVDS, 2GbE, Mini PCIe, MSATA, SUSI API
PCM-9310
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Intel® Celeron QC/DC SoC, Intel® Atom QC, DDR3L-1600MHz SODIMM up to 8GBDirectX11.1, OpenGL4.2, OpenCL1.2, 3 independent display: VGA + HDMI + LVDS/eDP*Rich I/O: 4 x COM, 2 x SATA, 2 x USB3.0, 4 x USB2.0, TPM2.0, SMBus/I2C, GPIO, full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
PC/104 OneBank Board
EMC2-ZU4EV
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Sundance Multiprocessor Technology Ltd.
The EMC²-ZU4EV is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-ZU4EV is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
(IoT) Wireless Module
SX-59HLS
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The SX-59HLS is an ultra-low power Hosted Dual Band 1x1 802.11a/b/g/n Internet-of-Things (IoT) wireless module based on the Qualcomm QCA4012-2 System-on-Chip (SoC). The SX-59HLS is a first in its class to provide enterprise security for today’s high performing networks.
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Product
SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
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*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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Product
Bluetooth PCIe Combo Module
SX-PCEAX
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The Silex’s SX-PCEAX is one of the industry’s first Tri-band Wi-Fi 6E modules. This Wi-Fi 6E module extends the benefits that Wi-Fi 6 already provides in the 2.4 and 5 GHz bands to 6 GHz and helps increase overall capacity and performance. SX-PCEAX is a tri-band IEEE 802.11 abgn/ac/ax WLAN module plus Bluetooth 5.2 BR/EDR/LE combo module based on Qualcomm’s QCA2066 SoC.
