Solder Ball
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Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1L18-2-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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2 Inch 535g Steel Impact Ball For Impact Test
CX-B2
Shenzhen Chuangxin Instruments Co., Ltd.
2 inch 535g steel impact ball for impact test
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1H-7-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Standard 1.02 (29.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-62H-4-S
Current Rating (Amps): 3Average Probe Resistance (mOhm): 15Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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9-Pin D-type Female, Solder Bucket, HV
92-960-009-F-HV
9-Pin Female D-type Connector, High Voltage, Solder Bucket - Without Backshell
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Alternate 2.39 (68.00) - 6.00 (170.00) High Performance Bias Ball Probe
POGO-1H-6
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1T24-7-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1Z1-7
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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1040g Steel Impact Ball Drop Impact Test Ball
CX-B104
Shenzhen Chuangxin Instruments Co., Ltd.
1040g Steel impact ball drop impact test ball
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High 1.73 (49.00) - 8.00 (227.00) High Performance Bias Ball Probe
POGO-1Z1-8-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Ultra High 2.84 (81.00) - 10.00 (283.00) High Performance Bias Ball Probe
POGO-1L-10-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1J-7-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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SparkFun Solder-able Breadboard
Large
This is the Large SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our full-size breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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37-Pin D-Type Male Solder Pin HV
40-960-037-M-HV
This connector is designed to allow users to directly terminate cables with soldered connections.
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POGO-62 High Performance Bias Ball Probe
POGO-62
Current Rating (Amps): 3Average Probe Resistance (mOhm): 15Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Standard 1.02 (29.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-62J-4-S
Current Rating (Amps): 3Average Probe Resistance (mOhm): 15Test Center (mil): 50Test Center (mm): 1.27Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 500,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1V-7
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Ultra High 2.84 (81.00) - 10.00 (283.00) High Performance Bias Ball Probe
POGO-1I-10-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1L-2
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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High 1.73 (49.00) - 8.00 (227.00) High Performance Bias Ball Probe
POGO-1L18-8-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Light 0.83 (24.00) - 2.00 (57.00) High Performance Bias Ball Probe
POGO-1P-2-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Alternate 2.39 (68.00) - 6.00 (170.00) High Performance Bias Ball Probe
POGO-1J-6
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Elevated 1.68 (48.00) - 7.00 (198.00) High Performance Bias Ball Probe
POGO-1H-7
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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IEC60950 Ball Drop Impact Test Apparatus
Shenzhen Chuangxin Instruments Co., Ltd.
It is mainly used for mechanical strength testing equipment enclosure, test equipment enclosure should be able to ensure that the structure can be expected to withstand the operation does not produce within the provisions of the standard risk for damage to the outer surface of the enclosure will touch dangerous parts of the apparatus.
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Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1Z1-4
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1I-4-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Standard 0.62 (18.00) - 4.00 (114.00) High Performance Bias Ball Probe
POGO-1UN-4
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Alternate 2.39 (68.00) - 6.00 (170.00) High Performance Bias Ball Probe
POGO-1V-6-S
Current Rating (Amps): 6Average Probe Resistance (mOhm): 10Test Center (mil): 75Test Center (mm): 1.91Full Travel (mil): 250Full Travel (mm): 6.35Recommended Travel (mil): 167Recommended Travel (mm): 4.24Mechanical Life (no of cycles): 1,000,000Overall Length (mil): 1,300Overall Length (mm): 33.02
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
