Solder Ball
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Product
Soldering Inspection Video Microscope
MS-1000
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The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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Product
Grypper G35 / G40
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*Package-size PCB footprint: Since the PCB footprint of Grypper is identical to the package, only one PCB design is required, enabling a seamless transition from test and validation through production and reducing overall cost of test*Low insertion force: Unique contact design reduces the insertion force required to insert and retain higher-ball-count packages safely and securely within the test socket*Oxide cutting wipe action: The contact design wipes the side of the solder ball during insertion, breaking through solder oxides ensuring a good electrical connection between contact and solder ball*Signal integrity: A short signal path achieves low inductance and low insertion loss, providing a nearly invisible electrical connection*Test socket has solder balls attached: The G40 contacts have solder balls reflowed onto the contacts to ensure reliable solder volume at the PCB to test socket solder interface.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Grypper "Y"
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Ironwood Electronics Grypper Y contact is design to work with BGA devices with solder balls/bumps with no equator or small exposure where the standard Grypper cannot reliably hold on to the solder ball. The Y shape, working with the sliding lid, allows reliable contact and ensures device retention in high vibration application. Lower forces, <25 grams, makes insertion easier too and the less aggressive contacting allows 40+ insertions of the same device. The Sliding Lid can be configured to include heat sinking. The Y contact designs cover BGA devices from 0.35mm pitch and larger and the short electrical length has superior electrical performance.
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Product
Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Product
Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
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Used to solder Mini Coax Solder Sleeve contacts.
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Product
Socket Accessories (SMT Options)
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The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Product
Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA
910121178
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Tool, Soldering Fixture, Micro Coaxial, Receiver and ITA.
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Product
Silver Ball Matrix Sockets
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SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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Product
Solder Wettability Tester
5200ZC
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The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Product
SparkFun Solder-able Breadboard
Large
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This is the Large SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our full-size breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Solder Wettability Tester
5200 Advanced
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This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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Product
Solder Wettability Tester
5200TN
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Amid the rapid progress in miniaturization of electronic components in high-density mounting, a long-established company that has been manufacturing solder wettability testers for about 40 years has developed a solder wettability tester compatible with the latest micro electronic components. and is the top model in the history of solder checkers with improved operability. * Wetting stress is proportional to the circumference of
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Product
SparkFun Solder-able Breadboard
Mini
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This is the Mini SparkFun Solder-able Breadboard. A bare PCB that is the exact size as our mini modular breadboards with the same connections to pins. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
Ball Pressure Test Device
ZBP-T
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Made up by the related item according to IEC60695, IEC884-1, GB/T5169.21-2006, GB4706.1-2005, GB2099.1-2008, etc. • R = 2.5mm Pressure: 20N • Base with thermocouple hole • Material: 304 stainless steel
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Product
Ball Pressure Test Apparatus
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The Ball Pressure Apparatus is designed to perform test specified in IS Standard where resistance of insulating material to elevated operating temperature is to be determined. It is used to test insulation materials used in Electrical Appliances, Electrical wiring accessories, luminaries, motors, connectors, etc. It is a precision engineered test instrument for use by safety and compliance testing laboratories.
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Product
3D Solder Paste Inspection
aSPIre 3
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Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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Product
Reflow / Wave Solder Process Dashboard
Vantage
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Real-time dashboard for all reflow ovens in the factory. Accessible from all authorized PCs and mobile devices anywhere. KIC Vantage is a factory level Industry 4.0 smart factory system for reflow and cure data management and analytics. It truly does give you the best vantage, gaining insight into your reflow and cure processes throughout the factory.
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Product
SparkFun Solder-able Breadboard
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This is the SparkFun Solderable Breadboard. A bare PCB that is the exact size as our regular breadboard with the same connections to pins and power rails. This board is especially useful for preserving a prototype or experiment you just created on a solderless breadboard by soldering all the pieces in place.
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Product
9-Pin D-Type Female, Solder Bucket, HV
40-960-009-F-HV
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9-Pin Female D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
37-Pin D-Type Female Solder Pin HV
40-960-037-F-HV
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This connector is designed to allow users to directly terminate cables with soldered connections.
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Product
Wave Soldering Machines
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Shenzhen Leadsmt Technology Co.,Ltd
A bulk soldering process used for the manufacturing of printed circuit boards.
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Product
9-Pin D-Type Male, Solder Bucket, HV
40-960-009-M-HV
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9-Pin Male D-Type Connector, High Voltage, Solder Bucket - With Backshell
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Product
High Speed Solder Paste Inspection
VisionPro HSi
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The VisionPro HSi offers high speed solder paste inspection. Utilizing the most advanced high resolution staging and sensor technologies, the VisionPro HSi provides the accuracy and reliability needed to compliment your overall screen print process improvement strategy.
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Product
Ball Rebound Tester
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Hildebrand Prüf- und Meßtechnik GmbH
The ball rebound tester is used to determine the resilience of foam materials in accordance with DIN EN ISO 8307 and ASTM D 3574.
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Product
Replacement Solder tip lead set for D420/D620
Dx20-SI
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- Choice of 4 GHz or 6 GHz bandwidth models- Up to 5 Vpk-pk dynamic range with low noise- ±3 V offset range- Low loading and high impedance for minimal signal disturbance- Ideal for DDR2, DDR3, LPDDR2- Deluxe soft carrying case- Innovative QuickLink architecture- Wide variety of tips and leads-- Solder-In Lead-- Optional Positioner (Browser) Tip-- Quick Connect Lead-- Square Pin Lead-- HiTemp Solder-In Lead
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Product
Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
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The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Product
37-Pin D-Type Male Solder Bucket
92-960-037-M
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Accessory allows a user to create their own PCB based termination solution mounted directly on the front of the product or on the end of a cable. Interfacing PCBs should be designed with suitable clearances for the voltage the application requires. 37-Pin Female connectors can be directly mated to a corresponding Pickering Switching Module while Male versions can be used to interface to a Female cable assembly termination.
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Product
1040g Steel Impact Ball Drop Impact Test Ball
CX-B104
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Shenzhen Chuangxin Instruments Co., Ltd.
1040g Steel impact ball drop impact test ball
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Product
SQFlash 153 Ball EMMC Series
SQF-MM5 M9x
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Compliant with JEDEC eMMC 5.1 standard, Support -40~85℃ True Wide Temperature. Support HS400 High Speed Mode, Support secure erase, write Protection and trim commands. Automotive AEC-Q100 Grade3 or Grade2 product available, sTLC high endurance selection.
