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3D
three dimensions.
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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3D Cameras
*Visual assessment of distance, level or volume*Time-of-flight measurement principle*Illumination, measurement and evaluation in one unit*Output of distance and grey values*Integration by means of intuitive parameter setting software
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CAD Drafting Services In USA
CAD design service providers for architectural, electrical, mechanical, plumbing, and structural drafting jobs are available to support your CAD drawing requirements. We provide impressive 3D outputs in combination with 2D orthographic projections and detailed shop drawings to felicitate your pre-construction operations.
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Vision Systems
Embedded vision systems, also referred to as compact vision systems, offer an alternative to Smart cameras and computer-based systems. The ADLINK EOS series is a complete embedded system that offers image acquisition, processing, archiving, and display capabilities. It is equipped with a multi-core CPU, ideal for applications requiring high computing power and multi-camera imaging, such as 3D vision and robotics guidance. Featuring rich I/O connectivity with factory-floor networks, including RS-232/422/485, USB, and isolated digital I/O, as well as onboard storage, ADLINK’s embedded vision system is ready to deploy. A system monitoring feature, feeding back temperature and voltage data, combines with a watchdog timer to maximize robustness and reliability of the ADLINK EOS series in mission critical applications.
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Measurement Systems
MicroMeasure3D
Sciences et Techniques Industrielles de la Lumière
STIL MicroMeasure3D, PORTICO3D and MAESTRO3D are measurement systems designed to achieve true 3D metrology of each point for the most demanding applications adapted to Industry 4.0 standards.
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Solid Optical 3D Measurement Instrument
IF-SensorR25
The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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Surface Analysis
Bruker Nano Surfaces provides industry-leading surface analysis instruments for the research and production environment. Our broad range of 2D and 3D surface profiler solutions supply the specific information needed to answer R&D, QA/QC, and surface measurement questions with speed, accuracy, and ease. Bruker’s AFMs are enabling scientists around the world to make discoveries and advance their understanding of materials and biological systems. Our tribometers and mechanical testers deliver practical data used to help improve development of materials and tribological systems.
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3D Automated Optical Inspection Systems (3D-AOI)
3Di Series
Saki’s 3Di Series applies cutting edge technologies to improve production efficiency and enhance production quality across the entire assembly line.
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3D Bundle
Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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Non-contact 3D Optical Profilers
LuphoScan platforms are interferometric, scanning metrology systems. They are designed to perform ultra precision non-contact 3D form measurements mainly of rotationally symmetric surfaces such as aspheric lenses.
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Reverse Engineering Services
The term “reverse engineering” can be a little confusing. It is sometimes used for things like software and electronic circuits. When 3D scanning companies use the term, they are referring to the process of re-creating design drawings by taking measurements and/or scans of the part itself. It is a 2-step process: 1) capture a 3D scan of the object, and 2) Create a 3D CAD model of the object
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G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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Full 3D Inline Metrological & Imaging AOI
Metrological Full 3D AOI is achieved by measuring all 3 dimensions (X, Y and Height) to detect every measurable solder and component defect pre-reflow and/or post reflow soldering.
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Desktop 3D AOI Series
MV-3 OMNI
- Exclusive 15MP / 25MP CoaXPress Camera System- OMNI-VISION® 3D Digital Tri-Frequency Moiré Technology- Leading-Edge 12 Projection Blue DLP Technology- Precision Compound Telecentric Camera Lens- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Programmable Z-Axis Multi-Focus System- INTELLI-PRO® Automatic Programming Software- Multi-Functional AOI-SPI Fusion Technology- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Optical Coordinate Measuring System
MaxSHOT 3D
Creaform’s MaxSHOT 3D lineup is a game changer for product development, manufacturing, quality control and inspection teams that need the highest measurement accuracy and repeatability as much for large‑scale projects than parts from 2 to 10 m. Imagine achieving accuracy better than 0.015mm/m! Thanks to its sophisticated user guidance technology and easy‑to‑use software, the MaxSHOT 3D is ideal for users of all levels—even non‑metrology experts—so that you gain peace of mind knowing your measurements are always right on the dot and you increase process efficiency. If you consistently work on large‑scale projects, the MaxSHOT 3D is your go-to solution to slash budget-busting measurement mistakes, improve product quality, increase process efficiency—and minimize overall operating costs.
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Affordable 3D Scanner
Metron E
Professional desktop 3D scanner for generating digital 3D models from physical objects at an affordable price. Metron E 3D scanner is the perfect solution if you are looking for a practical desktop 3D scanner. It’s effective at getting the job done to make you more productive.
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Multimedia HDMI Test Instrument
881E/882E
The Teledyne LeCroy quantumdata 881E/882E-HDMI Video Generator model is packed with features for video and audio testing of HDMI 1.4a sink devices. The HDMI transmitter provides 12-bit/component deep color and HDMI 3D testing features. An analog option with 250 MHz analog output and composite analog for NTSC and PAL testing is available as well with the HDMI transmitter only configuration.
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PDS Slope Protection Software
A number of special features are implemented in Teledyne PDS for underwater slope protection purposes.Guidance features are used to position a work vessel and monitor the laying of slope protection material. 3D images and 3D views display all movements of the vessel, crane, and the slope protection system.
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Multibeam Profiler Sonar
MB1350-N
At 1.35 MHz, the MB1350 delivers 3D profile data at levels more akin to a laser line scanner than today' low frequency bathymentry systems. Mountable on Boats, ROVs, UUVs, and Tripods, BlueView's MB1350 is the right tool to take your operation into the next generation of 3D bottom and structure mapping.
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*Coordinate Measuring Machine
PRISMO ultra
PRISMO ultra uses uncompromising precision technology and was developed for measurements that require extremely high accuracy. PRISMO ultra incorporates a well-balanced combination of cutting-edge accuracy, speed, rigidity, and cost performance. This 3D coordinate measuring machine is best suited for research and development of high-precision parts and calibration inspection of reference gages.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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Area Scan 3D Camera
3D-A5000 Series
Cognex’s 3D-A5000 series is an area scan 3D camera designed to capture high-resolution 3D images. It features 3D LightBurst technology which rapidly acquires images to maximize throughput. High-resolution 3D images combined with industry-leading Cognex 3D vision tools enable reliable and accurate solutions to applications such as assembly verification, in-line measurement, and robotic guidance.
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INnLline Metrology Automated & Robotized Solutions
Automation projects
Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
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Open eVision 3D Studio
Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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PDS Excavator Monitoring System
It shows a real time overview of the excavator in navigation, profile, and 3D views; displaying the dredge tool, pontoon/vessel, design depths, and color-coded digital terrain model (DTM). The navigation view highlights the high and low spots and is updated in real time, recording the progress of the dredging work. The recording follows the shape of the dredge tool and is visible immediately in all views. Up/down indicators show the operator the exact distance to the seafloor and design depth continuously. 3D design models allow the use of complex designs. The monitoring system can also be used for a remote presentation on the bridge of the vessel and it is possible to draw the vessel in the views of the excavator as well.
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High Performance 9 kHz - 1200 MHz SDR
CloudSDR
The CloudSDR''s remote mode also offers a variable width spectrum analyzer with adjustable spans up to 10 MHz wide. The spectrum information update rate can be adjusted up to 10 Hz or turned off to limit the bandwidth utilization. In addition, the built-in squelch can be used to limit data transmission when no signals are present. Wideband spectrum analyzer mode offers 56 MHz wide spectral captures in both 2D, 3D and waterfall formats.
