-
product
Auto Macro Wafer Defect Inspection
EagleView
EagleView automated macro defect semiconductor wafer inspection system provides industry leading throughput, defect detection accuracy, and wafer classification for semiconductor manufacturing. EagleView systems have inspected over 100 million semiconductor wafers worldwide. The EagleView macro defect inspection tool resolves many of the problems and pitfalls of manual and micro wafer inspection by automating and standardizing semiconductor wafer inspection processes while creating complete images of every wafer in the cassette. Unlike manual micro defect wafer inspection, EagleView’s automated wafer inspection is always consistent, tireless, reliable, and fast. EagleView helps find macro defects while there’s still time to take corrective action.
-
product
High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
-
product
Wafer Analyzer
RAMANdrive
RAMANdrive is the specialized Raman microscope for wafer analysis equipped with our dedicated 300 mm stage. RAMANdrive gives you an ultra-fast, highest resolution analysis of the whole wafer with unique stability and accuracy
-
product
High Parallel Test Handlers
High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
-
product
Tri-Temp Pick-and-Place Handler
MT9510 XP / x16
MT9510 XP™/ MT9510 x16™ test handler provides full temperature control during test in extreme environmental conditions from -55˚C to +175˚C. A variety of options, upgrades and retrofits are available to configure the product to customer applications such as; automotive battery management systems (BMS) for electric (EV) and hybrid electric vehicles (HEV) and precision power regulators.
-
product
Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
-
product
LED Tester For Chip And Wafer
Electrical Testing: Forward：VF,DVF,VFDReverse：VZ,IROptical Testing: can test LOP in cd/mcd/W/mW/lm... from different optical componentsWavelength λp,λd,λc,hw,purity,(x,y),CCT,CRIFour-wire measurement and contact resistance in case of deviation.Auto polarity identification and preheat function.Compatible mechanical interface.Optional ESD static test system or polycrystalline test system
-
product
High Speed Gravity Handler
MT9928 xm
This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
-
product
Pick And Place Test Handlers
Cohu offers a broad range of IC pick-and-place test handling solutions for the automotive, mobile, and computing markets. Our commitment is to provide world-class innovative products that incorporate thermal, vision and factory 4.0 automation options to meet your existing and future IC handling needs.
-
product
Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
-
product
Wafer Lifetime Measurement with Photoluminescence Detector
WCT-120PL
Measure the calibrated carrier-recombination lifetime of a silicon wafer using both the standard method and the photoluminescence meth
-
product
Wafer Back Side Cooling System
GR-300 Series
The GR-300 Series can control gases used to cool the back side of wafers that are fixed in position by an electrostatic chuck system.The stability and accuracy of the GR-300 makes it ideal for controlling the flow of Helium and Argon in wafer cooling systems.
-
product
Full Wafer Contact Test System
Fox 1
Unique cartridge technology uses full-wafer contactors combined with parallel test electronics to achieve single touch, full-wafer test
-
product
CCD Device Handlers
Exatron has been in a unique position to supply handling systems for the new CCD device market. Manufacturers of CCD devices came to Exatron when these devices were new, looking for custom handling applications, and Exatron responded by modifying its Model 3000B, 3000BL, 5000, 5080, and 8000 systems to accommodate CCD devices.
-
product
Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
-
product
Universal Off-Line Handler
OLS Series
Developed as an economical and versatile solution, it adapts to any offline test application - ICT (In Circuit Test), ISP (Flashing) or FCT (functional). The design of this solution allows the quick and ergonomic change of fixtures , with a change time of less than 3 minutes.
-
product
Wafer Defect observing instrument
HS-WDI
Application■Semiconductor wafer■Solar wafer■Solar Cell■Thin-film Cell
-
product
Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
-
product
Tri-Temp Octal Sites Handler
3160-C
Chroma 3160-C is a productive pick & place system for high volume multi-site IC testing.
-
product
Wafer Inspection Machine
IV-W2000
The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
-
product
Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
-
product
Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
-
product
Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
-
product
Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
-
product
Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
-
product
Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
-
product
High Performance Strip Handler
Rasco Jaguar
Jaguar is designed for high-volume production testing of ICs on a strip format or in device carrier. It is fully automotive qualified for tri-temperature test and the ideal solution for high parallel testing of small packages at short test times, but also for Power and Sensor devices. Due to the integrated vision alignment and high precision linear motors, Jaguar provides high yield and excellent OEE.
-
product
Non-contact Inline P/N Checker Module For Solar Wafer
PN-100BI
*Principle: Photovoltaic effect with the laser diode*Suitable for production line and tranceportation system*Connect to host PC by LAN to send measurement command and data
-
product
MEMS Handler
4664-IH
The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
-
product
Solar Wafer Transfer Tool
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises Solar Wafer Transfer Tool
