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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Test Handler
HA1200
The new HA1200 handler can be linked with a tester to utilize our unique active thermal control technology for testing singulated and/or partially assembled dies. This technology enables testing of powerful high-end SoCs with 100% test coverage. This helps reduce yield loss at final test, thus reducing losses of final multi-die assembled products.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Prober
Prexa
The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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High-Performance Strip Handler
MCT SH-5300
SH-5300™ high-performance strip handler for testing advanced semiconductor packages, LEDs, MEMS sensors, and traditional ICs. It can handle a vast array of strip and laminate lead-frame sizes. Capable of tri-temp testing -55˚C to +160˚C and ambient testing to +160˚C.
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Logic Test Handler
M620
- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
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Test Handler
Test Handler is an equipment that automates the final testing of semiconductor devices. It handles device transportation, controls temperature during semiconductor testing, and sorts devices based on test results.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Rotary Table Handler
6000 Series Rotary Handler
Rotary table handlers are an excellent choice for PCBA or product – level test, programming, part marking, automatic part rejecting, and vision inspection in order to satisfy manufacturing applications that require high throughput. Rotary table based systems used in production can also help reduce the impact of load and unload times for the operator, because the device-under-test (DUT) automatically moves to the next cell within the station as each DUT is loaded. Circuit Check’s 6000 series handlers are modular, scalable and flexible, supporting high-mix and high-volume production needs. A common application example is to configure a 6000 series as a rotary station to perform simultaneous PCBA bar code scanning, testing, programming and marking, in a pipe-line process which improves throughput requirements. The 6000 series handlers leverage Circuit Check’s unique quick-change fixture drop-in technologies to allow for station modularity and scalability. Production line flexibility is achieved because the 6000 series handler is software and hardware agnostic, enabling adaptability to a variety of applications, and is limited only by the number of stations.
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Manual Contactless Wafer Detector
HS-NCS-300
Manual, non-contact measurement of wafer thickness, TTV and bow. Portable and easy to set-up, the Proforma 300/G measures all wafer materials including Silicon, Gallium-Arsenide, Indium-Phosphide and wafers mounted to sapphire or tape.
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Hybrid Single Site Test Handler
3110
Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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Wafer Internal Inspection System
INSPECTRA® IR Series
An infrared internal defect inspection system has been added to the INSPECTRA® series.It is now possible to inspection with both infrared and visual light in one system.
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Tube-To-Tube Gravity Handler
Rasco SO1000
The SO1000 test handler’s mature design and high reliability it provides excellent cost of test. Highly flexible as a result of a broad range of device kits can be combined with various Sensor and MEMS applications.Featuring a fast plunger with up to four plunger heads for high speed and high throughput with index time down to 500 ms. Available in single, dual, and quad configurations.
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6TL36 Inline Handler
AM304
Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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ROV Thickness Gauges & Probe Handlers
ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Octal Test Site Handler
3180
The Chroma 3180 is a productive pick & place system for high-volume multi-site IC testing.
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Test Handlers
Cohu has 50+ years of semiconductor test expertise designing and manufacturing pick-and-place, gravity feed, test-in-strip handlers, MEMS test cells, and turret-based test handling and back-end finishing equipment for ICs, LEDs and discrete components.Our test handlers support a variety of package sizes and device types, including automotive, mobile, power, micro-electromechanical systems (MEMS) and microcontrollers, among others.
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Test Handler
JOT M5
Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Wafer Test
Based on the reliability test, CSE conducts the test of the IC chip through electrical signals to the semiconductor wafer. We provide various Test Solutions according to the needs of designers/manufacturers. by sorting out good and bad products.
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Contactless Wafer Geometry Gauge
MX 20x series
The E+H geometry gauges are based on two heavy plates mounted parallel to each other. Embedded in the plate are a set of capacitive distance sensors. The wafer will be moved manual or automatically between the plates and measured without any movement.
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MultiSite Test sockets and Wafer Level
multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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RF Solution Integrated Handler
3240-Q
The Chroma 3240-Q is a unique and innovative handler with integration of RF/Wireless isolation chamber.
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Gravity Handler
State of the art model, which features a high throughput capability, eight sites, and high and low temperature measurements, and meets all high-frequence contact requirements. Complete measures to prevent jamming and lead deformation enable high availability. This model is highly regarded by top users around the world because of its high throughput and high reliability.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
