Flash Memory
retains data absent of power. Also known as: Flash Device
-
Product
M.2 PCIe NVMe RunCore Embedded PCIe3 NVMe “Elite Series” SSD
-
RunCore Innovation Technology Co. Ltd.
M.2 PCIe3 NVMe Solid State Drive (SSD) is a high capacity solid-state flash memory product that complies with the PCIe Gen 3 standard and is functionally compatible with a PCIe protocol.
-
Product
Universal Programmers
-
Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
-
Product
JTAG Debugger Software
JSCAN
-
JSCAN lets you view and control JTAG pins in real-time without having to touch your board! With a simple click of your mouse, you can set pins HIGH or LOW and observe the results right on your PC.J-SCAN works independently of any logic inside the JTAG device, you do not need any special firmware, code or logic installed. View and control pins in real-time, program FLASH memories, create test macros, for system test, easy to use graphical interface and affordable.
-
Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
-
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
-
32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
-
SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
-
Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
-
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
-
Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
-
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
Test & Programming Software
ScanExpress
-
The ScanExpress Family of boundary-scan software offers a fully integrated development environment that includes boundary-scan and at-speed functional test program generation, test program execution with advanced pin level diagnostics, interactive boundary-scan debugging, and in-System Programming (ISP) of devices such as Flash memory, serial EEPROMs, CPLDd, and FPGAs.
-
Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
-
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
-
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
PCIe3 AIC (NVMe) RunCore Consumer SSD “Sprinter Series”
-
RunCore Innovation Technology Co. Ltd.
Add In Card PCIe3 NVMe Solid State Drive (SSD) is a high capacity solid-state flash memory product that complies with the PCIe Gen 3 standard and is functionally compatible with a PCIe protocol.
-
Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
-
Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
-
Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
-
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
-
Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
-
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
-
Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
-
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
-
Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
-
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
-
Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
-
8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
-
Product
Multifunctional Meter
AEM-DR
-
Provide high accuracy measurement, display and remote communication of single phase & three phase parameters (V, A, P, Q, S, PF, Hz, Kwh). Multicircuit design and relay output modular expansion design decrease the overall cost and make the functionality more flexible. All monitored data is available via a RS485 serial , for the needs in energy management, alarming, and remote controlling. Embedded flash memory for Data-Logging can avoid any data missing once the communication is interrupted. Moreover, its ultra compact size DIN-rail mounting makes itself mountable in virtually any panel, enclosure or indoor Cabinet.
-
Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
-
SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
-
Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
-
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
-
Product
Wide Temperature Server DIMM
SQR-RD4M
-
Original Hynix IC chip adopted, Wide operating temperature support -25~85oC, Data transfer rate up to 3200 MT/s.
-
Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
Timing, Logic & Memory
-
Offering an extensive portfolio of products for programmable clocks, clock generation and distribution, standard logic and memory (Flash, EEPROM and SRAM) across various applications.
-
Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
-
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
-
Product
FPGA-Based Ultra-Fast Flash Programmer
XJFlash
-
XJFlash is an FPGA-based advanced and innovative method that uses JTAG for high-speed in-system programming (ISP) of flash memories – all serial and parallel flash devices are supported. The most common use of XJFlash is programming the SPI/QSPI NOR flash used to configure an FPGA.
-
Product
Micron 8G DDR4 3200 288PIN 1GbX8 REG 1.2V
96D4-8G3200ER-MI
-
DDR4-3200 Registered ECC DIMM, 1.2V power consumption, Supports ECC error detection and correction. Data bus inversion (DBI) for data bus, Low-power auto self refresh (LPASR).
-
Product
Flash Meters
SF 100
-
Flash meters for measurement of illuminance time response of rapid changing light sources (flashes, rotating beacons).
-
Product
Flash In Disk-IDE
FID Series
-
Axiomtek's FID (Flash in Disk-ATA) series is a high performance 2.5 flash disk and fully compatible with IDE standard which make it an ideal replacement for conventional IDE HDD without any driver or system modification. This 2.5 IDE flash disk is provided with huge capacities up to 256GB to meet diverse needs of data storage. With the features of high capacity storage, data integrity, anti-vibration and low power consumption, the FID series is surely a solid solution for expanding an industrial computers memory.
-
Product
Memory
-
Renesas offers MIL-STD-883-compliant CMOS random access memory (RAM) and CMOS programmable read-only memory (PROM) devices that are that are qualified to QML Class Q military standards.
