COM-HPC
ADLINK Technology Inc. (ADLINK)
The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new COM-HPC computer-on-module specification that will address the needs of the very high end of the industrial edge computing market.
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
COM-HPC Client Type Modules
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The COM-HPC specification currently defines three client modules: Size A (95mm x 120mm), Size B (120mm x 120mm) and Size C (160mm x 120mm). The largest of the server modules, Size C (160mm x 120mm), offers up to four on-board SO-DIMM sockets. The power input is a single 12-volt supply that can deliver up to 251 watts of power, and there are 49x lanes PCIe Gen5 in total.
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Product
COM-HPC Mini Type Modules
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The COM-HPC specification add mini type at dimension of 95mm x 70mm in Rev 1.2. It addresses a need seen for a smaller form factor, lower power envelope and lower cost at single 400-pin connector. A single power rail input with 8 to 20-volt range deliver up to 107 watts of power and there are 16x lanes PCIe Gen5 in total.
