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Wafer Probes
I/O pad contactor held by probe card or flying.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probers, Wafer Inspection
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Semi-Automated Probe Stations
SPS 2600, SPS 2800, and SPS 12000 Series
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
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Wafer Testing
Trio Vertical
SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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WAFERMAP
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram.
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Probe Card
T90™ Series
The 90 mm tile was designed for mounting on a standard 4.5″ probe card holder for multi-site wafer level reliability testing. The 1.6 mm (0.062″) thick rails allow the chassis to slip into planarity adjustable probe card holders for most analytical probe stations.
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MPI Manual Probe Systems
MPI Advanced Semiconductor Test
manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150, 200 and 300mm.
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Optoelectronics and Photonics
SemiProbe has developed probe stations for a wide variety of optoelectronic and photonic device applications, including light emitting diodes (LEDs), vertical cavity surface emitting lasers (VCSEL) and photo diodes. Testing and handling small, fragile, thin wafers with thousands of die on them poses unique challenges that require innovative solutions.
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Quick Silicon Discriminator
HS-QSD
HS-QSD Quick Silicon Discriminator is specially designed for silicon sorting，it can quickly test the silicon type, heavy-dopedt, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Probe Needles for Wafer Sort and Test Applications
Advanced Probing Systems, Inc.
APS is the global leader in the manufacture of probe needles used in cantilevered probe cards. All probe needles used in wafer sort are manufactured according to customer specifications using stringent in-process quality assurance procedures.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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High Power Devices
SemiProbe configures our PS4L Adaptive Architecture into the Voltarus (TM) family of probe stations to fulfill the unique requirements of testing high power devices at wafer level prior to packaging. Voltarus probe stations are available in manual, semiautomatic, and fully automatic configurations that can test and characterize power devices up to 10 KV or 200 Amps (pulsed).
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Multisite Probe Card
T300 ButtonTile™
The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
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Probecard testers
MANAGER
Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Advanced Probe Card / V type
VC Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card*No limitation by Pad layout*Large probe area (Suitable for 200mm wafer 1-shot)*Small scrub mark*Suitable for High/Low Temperature Test
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Wafer Probe Heads
WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Portable Wafer Probe Station
PS-5026B
High Power Pulse Instruments GmbH
The PS-5026B is a rugged portable wafer probing solution which has been designed for high reliability, compact size and minimum cost.
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Non-contact Sheet Resistance/resistivity Measurement Instrument With PC
NC-10 (NC-20)
*Easy operation and data processing by PC*No damage measurement by non-contact eddy current method*Replaceable probes by meas. range (*Second or more probe is for the option)*1 point measurement of center position*5 types of model for each measuring range*Temperature correction for silicon wafer function
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Semiconductor Metrology Systems
MTI Instruments'' semiconductor wafer metrology tools consist of a complete line of wafer measurement systems for virtually any material including Silicon wafer (Si), Gallium Arsenide wafer (GaAs), Germanium wafer (Ge) and Indium Phosphide wafer (InP). From manual to semi-automated wafer inspection systems, the Proforma line of wafer metrology inspection tools is ideal for wafer thickness, wafer bow, wafer warp, resistivity, site and global flatness measurement. Our proprietary push/pull capacitance probes provide outstanding accuracy throughout their large measurement range, allowing measurement of highly warped wafers and stacked wafers. MTII''s solar metrology tools include off line manual systems for wafer thickness and Total Thickness Variation (TTV), as well as, in-process measurement systems capable of measuring wafer thickness, TTV and wafer bow at the speed of 5 wafers/second.
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Probe Card
VC20E Series
The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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MPI SiPH Probe Systems
MPI Advanced Semiconductor Test
MPI designed dedicated SiPH upgrades for its well known 200 and 300 mm probe systems, which includes:*Various options of high-precision fiber alignment systems for ultra-fast scanning routines*Multiple measurement capabilities for O-O, O-E, E-O and E-E device configuration*Integrated Z-sensing for detecting the fiber to wafer contact point*Crash protection when using two optical fiber arms*Wide temperature range from -50°C to 200°C*Optional dark box for testing in light tight environment*Extensive software package for supporting easy integration to operator’s test executive*Probe system compatibility: TS2000-IFE, TS2000-SE, TS3000, TS3000-SE, TS3500 and TS3500-SE
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Non-Contact Mapping Life Time System
MWR-2S-3
The device is designed for express non-destructive contactless local measurement of non-equilibrium charge carrier effective lifetime in silicon substrates, epi-wafers and solar cells at different stages of manufacturing cycle. It can be used for incoming and outcoming inspection of silicon ingots and wafers, tuning and periodic inspection of semiconductor and solar cell technology quality. Lifetime determination is based on measuring photoconductivity decay after pulselight photo-exciting with usage of reflected microwave as a probe.
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Test Contactor/Probe Head
cBoa
cBoa™ test contactors and probe heads are the solutions for contacting high-frequency devices for package test or final test at wafer. The robust design and materials of the cBoa probe withstand the rigors of high-volume test by providing longer life and higher yield. The homogeneous DUT side plunger provides longer run times between cleaning and increased probe life.The cBoa features a stainless-steel spring for tri-temp testing and performs in operating temperatures of -55°C to +155°C and bandwidth of up to 35 GHz @ -1 dB.
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Silicon Resistivity, PN type & Alarm Tester
HS-PSRT
It use Four Probe to test the resistivity and P/N type of wafers、ingots and all type of silicon materials.It can be used by Solar and Semiconductor industry.
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Probe Series
VEGA Series
MPI VEGA Prober series is ready to meet the diverse test and material handling requirements of the Laser Diode (VCSEL, EEL) and optical module markets. MPI VEGA probers are based on a highly flexible and reliable platform, enabling the test of a wide variety of device types (Wafer, Package & Singulated Die) over temperatures with the ability to handle thin/warped wafers. Multiple probing schemes are also supported with the ability to probe small pads with well-controlled needle force.
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Microcontactor
Microcontactor is the products using a new structure precision probe developed by NHK Spring. They are used to test the electrical characteristics of semiconductor wafers and packages. Products are manufactured in our own factory and can be custom-designed to meet our customer needs.
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Super Silicon Resistivity and Type Tester
HS-3FC II
Super Silicon Resistivity and Type Tester is specially designed for silicon sorting，it can quickly test the silicon type, heavy-doped, resistivity and current, and can be widely used in all kinds of silicon sorting, like granular polysilicon material, break semiconduct silicon wafer, chunk material, top and tail material and so on. Furthermore, it integrates two probes, three probes and four probes. With the three probes, it could show type and heavy type simultaneously, strongly improved the sorting efficiency.
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Low-leakage Switch Matrix Family
Conducting all the parametric measurements necessary for the numerous test structures on a semiconductor wafer can be a time-consuming and expensive process. With the cost of end-user devices continuing to drop, even laboratory characterization environments must reduce the cost of test. Until now engineers and scientists working on current and future semiconductor process technologies were faced with a difficult choice: either use a semiconductor parameter analyzer with positioners on a wafer prober, which limits the ability to perform automated test, or use a switching matrix and probe card, which reduced the analyzer's measurement resolution. Utilizing a switching matrix with a semi-automatic or fully-automatic wafer prober enables characterization tests to be automated, eliminating the need to have an operator manually reposition the probes each time a new module needs to be tested. This reduces both test time and cost. Due to the many price/performance points available, Keysight's switching matrix solutions provide the flexibility to choose exactly what your testing needs require, without overspending.
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Mercury Probes
Materials Development Corporation
MERCURY PROBES are precision instruments that enable rapid, convenient, and non-destructive measurements of semiconductor samples by probing wafers with mercury to form contacts of well-defined area.
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Metrology Systems
VIEW offers a full line of optical metrology systems for wafer, photomask, slider, MEMS, semiconductor package, HDD suspension, probe card, and micro-component process measurements.
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Surface & Volume Low Resistivity Meter for Conductive Materials
Loresta GP
The Loresta GX Meter is an intelligent, multi purpose low resistivity meter equipped with software that calculates resistivity correction factors. A variety of 4 pin probes are available for use with the Loresta GX. The instrument is typically used in Product Engineering, R&D, and Quality Control. Applications include measurement of conductive paint, conductive plastics, conductive rubber, conductive film, silicon wafers, antistatic materials, EMI shield materials, conductive fiber, conductive ceramics, etc.
