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Thermal Chucks
control DUT's thermal state. Wafer
See Also: Temperature Forcing Systems, Wafer Probers, Temperature Chucks
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Electrostatic Chucks
Chucks grip for micropatterning, temperature control, or robotics ...*insulating substrates,*hard disk drive head substrates,*semiconductor wafers,*InP-coated sapphire,*metal foils,*... and many other materials.
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Thermal Controlled Chucks & Plates
TOP Cool
Mechanical Devices newest innovation in thermal testing. Each TP system contains a thermal chuck or thermal plate and a self-contained thermal control unit.The TP chuck and platforms is a breakthrough product that introduced the use of refrigerant for active cooling & heating of wafers and other components with no need of chiller, CDA, or consumable and expensive refrigerants such as liquid nitrogen and liquid carbon dioxide. It can be a perfect replacement system in the industry for uncompromising thermal and mechanical performance with a temperature ranging from -60 to +220°C.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Pyroelectric and Thermal Testing
The optional Chamber Task measures the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled within a thermal chamber, on a hot chuck or in a furnace. From these measurements the Spontaneous Polarization Pr(q) and the Dielectric Constant er(q) are computed. These are then combined to determine the Electrical Displacement D(q) as a function of the temperature q.
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Thermal Chuck Systems
C-Series
Advanced Temperature Test Systems GmbH
Looking for a chuck system that gives you the possibility to cool down to - 60C and up to + 300C. The C-Series represents a product line of air cooled thermal chuck systems for a wide temperature range
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Probe Station
ETCP1000
Installation of “Hot and cool chuck” - Sellectable chuck size : 4inch, 6inch. - Temperature variation : -193°C ~ 300°C (80K ~ 573K) - Additional requirements : Vacuum chamber, LN2 tank(Bombei), microscope, CCD camera, manipulators. - EPS500 is standard model in ETCP1000 probe station.
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High Temperature Chucks
High temperature electrostatic chucks are available for the ranges -60 to +400 deg. C, and for 350 to 600 deg. C. Different materials and constructions are used in these two ranges.
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Semi-Automatic Probe Station
P300A
The P300A probe station is the most stable, intuitive, and space efficient 300mm semi-automatic analytical probe station available today. Designed for low current, sub-micron positioning applications, the P300A comes standard with features such as single-point ground, dry/dark environment, and integrated thermal chuck plumbing.
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Ambient Temperature Vacuum Wafer Chucks
6" (152mm) Vacuum Wafer Chuck for General Purpose Ambient Temperature testing with a Stainless Steel vacuum wafer surface
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Thermal Chuck Systems
A-Series
Advanced Temperature Test Systems GmbH
The A-Series represents a productline of air cooled thermal chuck systems for a temperature range between -30C up to +400C. The basic product offers an active cooled chuck system without an external chiller for a temperature range between +25C up to +200C at a very competitive price to common Hot Chucks.
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Chamber/Pyroelectric Task
Radiant's Chamber/Pyroelectric Task sets the sample to a series of temperatures by performingGPIB control of an external thermal device. At each temperature it captures the sample’s polarization response and/or small-signalcapacitance. These are combined to calculate the pyroelectric coefficient. The Pyroelectric Task is to be used with a Radiant Test System and a Linkam Stage (-196C to 600C), Thermal Chambers, Hot Chucks, or a Furnace to automatically measure the Pulse Polarization response and Small Signal Capacitance of a Pyroelectric material that is being heated and/or cooled. Radiant's Pyroelectric measurement Task can be added to Vision at additional cost. This measurement suite fully characterizes the pyroelectric charge (polarization) response of the sample under test. The Pyroelectric Task suite controls various thermal controllers such as Quantum Design, Lake Shore, Delta Design, and many others. Detailed Listing of Thermal Controllers Registered in Vision. The Chamber/Pyroelectric Task is quoted upon request.
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Vacuum Chuck Temperature Controlled Test Stations
These test stations offer the same reliable repeatable measurement capability of our temperature monitored stations with the added dimension of temperature control.
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Thermal Chuck Systems
L-Series
Advanced Temperature Test Systems GmbH
The perfect system for high power applications with an extraordinary performance at a wide temperature range between - 65C and + 300C.Each system contains a high performant liquid-cooling unit.
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Metal Foil Chucks
Electrostatic chucks are the most reliable solution for gripping delicate, microfabricated metal foils - even in air. These chucks induce no distortion, are easily cleaned, are amazingly robust, economically priced, and exhibit uniform grip forces over their entire area.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Drill Chuck Grips
Metal rods, wires, and plates and electronic components can be tensile tested using drill chuck grips. Electronic components are tested by placing the metal legs of the components in the grips, allowing different shaped components to be tested with the same set of grips.
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Thermal Profiler
V-M.O.L.E.®
The V-M.O.L.E. is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings.
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Thermal Transport
The thermal transport probe measures thermal conductivity and thermoelectric power (defined by the Seeback Coefficient). Electrical and thermal contacts are made to opposite ends of the sample allowing for customisation to suit the sample requirements of the user.
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Standard Probe Station Chucks & Accessories
In this test solutions section of our website we describe the expanding line of Abet PV IV probe stations for the growing variety of solar cell types and sizes being developed around the world. This page describes a line of vacuum chucks and accessories for top/bottom, top/top, and bottom/bottom solar cells from 3 x 3 mm to 300 x 300 mm. Probe stations for multiple device on a single substrate and multifunction probe stations are described further in the sections highlighted to the left of this page.
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Thermal Tools
BMP Testing and Calibration Services Inc.
BMP Testing and Calibration Services, Inc. utilizes the latest thermal measurement equipment to analyze low to medium-conductivity materials, from ceramics, plastics, and polymers to coatings, composites, liquids, and building materials.
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Thermal Shroud
BC8-55/150C
When combined with a thermal conditioner such as the Bemco PCL3L-III or PCL3M-III, this shroud converts a 24 inch inside diameter by 30 inch high vacuum only vertical bell jar into a 19 inch inside diameter by 20 inch high thermal vacuum testing system. With a convenient clam shell door, test objects are easily loaded by simply raising the bell jar above the top of the door opening.
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Professional Thermal Camera
FLIR T560
Troubleshoot hot spots, find hidden faults, and confirm repairs quickly with the ergonomic, high-resolution FLIR T560. This 640 × 480 (307,200 pixel) thermal imaging camera has a bright 4" LCD and a 180° rotating lens platform, so you can easily and comfortably diagnose electrical or mechanical issues, even in hard-to-reach areas. Advanced on-camera measurement tools such as 1-Touch Level/Span, plus laser-assisted autofocus, ensure you’ll record accurate temperature measurements every time. With on-board FLIR Inspection Route mode, you can download and run survey plans to your camera from FLIR Thermal Studio Pro (with FLIR Route Creator plugin). Together these systems will help you record temperature data and imagery in a logical sequence for faster troubleshooting and repair. The T560 also features FLIR Ignite for automatic uploading of images directly from the camera to the cloud for easy, secure storage and sharing. The purchase of a T560 camera includes a 3-month subscription to FLIR Thermal Studio Pro and FLIR Route Creator.
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Thermal Shock Testing
Thermal shock is a very important test for determining the reliability of a product when subjected to sudden changes in temperature and how this stress source can accumulate deterioration or physical damage in performance.
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Thermal FETs
Pin-compatible with standard Power MOSFET packages and built-in over temperature protection function for body, lighting and heater applications, as well as powertrain applications and 24V battery system applications.
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Thermal Imaging Solutions
Fluke Process Instruments’ thermal imaging solutions provide 24/7 monitoring capabilities to keep your process, products and site under control. Our fixed thermal imaging cameras feature IP67 (NEMA 4) rated housing and are designed for the most demanding and harsh conditions.
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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Thermal Analysis
The TORC (Thermo-optical Oscillating Refraction Characterization) technique applies decades of know-how in optical instrumentation to thermal analysis in a novel and unique way. The technique requires minimal sample preparation at maximal tolerance for sample properties. You can determine the coefficient of thermal expansion, glass and phase transitions as well as polymerization for various samples: liquids, gels, pastes, and certain solids. For example: cured and uncured resins, adhesives, glues, etc. can easily be characterized. Both thermal and time-dependent processes can be monitored with minimal effort.
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Simultaneous Thermal Analyzer
SDT 650
TA Instruments invites you to experience the world’s finest Simultaneous DSC/TGA, the Discovery SDT 650. Discover the advanced engineering and attention to detail that provides enhancements in every aspect of performance and a new level of user experience. Available with or without an Autosampler, the Discovery SDT is sure to meet your needs and exceed your expectations.
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Thermal Testing
At E-Labs, Inc., we support thermal cycling and thermal bakeout vacuum testing requirements. During thermal cycling, the unit experiences repeated heating and cooling as it would when exposed to the harsh environment of space. During thermal bakeout, flight equipment is subjected to an outgassing reduction process so as to decrease the chance of molecular contamination of the spacecraft instrumentation.
