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Solder Paste Measurement
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Inspection
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Solder Paste Inspection Machine
3D SPI
The 6500 series is the measurement equipment provided by Jiezhi Technology for the small pads of solder paste printed on the PCB board. It will cause defects such as sharpness, offset, more tin, and less tin printing during solder paste printing. Causes defects in the later stage of production, this equipment can find problems in advance
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Printing / Squeegee Force
CmPrint
Measurement of the Force-Time Curve while Printing. The first step into the manufacturing of electronic printed circuit boards (PCBs) is printing. The solder paste is printed on the PCB using a stencil. The equal distribution of the paste pressure is crucial and affects the overall quality of the finished circuit board. An important influencing factor is the accuracy and reproducibility of the squeegee force.
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5D SPI
On Mek Solder Paset Inspection systems, items which are better inspected in 2D, such as area offset and bridging, are viewed in full colour. Using colour inspection the ISO-Spector S2 SPI can tell the difference between paste, solder mask, silk screen and other PCB features and the SPI system can intelligently give you accurate results. Volume and height measurement in 3D are combined with the 2D inspection in Real-time, to give a True colour 3D image. Other 3D SPI systems only inspect in the 3rd dimension, (Z axis) and make extrapolated assumptions about the 2D image.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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PXIe Measurement Accelerator
M9451A
The M9451A PXIe Measurement Accelerator combined with Option DPD Digital Pre-Distortion & Envelope Tracking Gateware shows what is possible when you combine state of the art FPGA's with Keysight's trusted measurement expertise and PXIe's high speed data handling. As part of Keysight's RF PA/FEM Characterization & Test, Reference Solution, this combination provides unprecedented performance for demanding envelope tracking and digital pre-distortion measurements required for testing modern power amplifiers (PAs) and front-end modules (FEMs). Hardware acceleration provides better than 20x speed improvement over Keysight's previous host-based Reference Solution, with closed/open loop digital pre-distortion (DPD) and envelope tracking (ET) measurements taking just tens of milliseconds and overall measurement times less than 70 ms.
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PXI FPGA & Measurement Accelerator
Keysight PXI FPGA & measurement accelerator provide digital-pre-distortion (DPD) and envelope tracking (ET) measurements that are embedded in high performance FPGA processing cards.
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Solder Paste
MVP Versa (3D SPI)
The first part of any SMT process is Paste. MVPs Versa and 900 Series platforms provide high accuracy paste inspection. High accuracy paste measurements are made using a choice of 10um or 5um 3D measurement systems.
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Solder Paste Analyser
SPA 1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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3D Solder Paste Inspection (SPI)
Systems designed for solder paste inspection (SPI) quickly and reliably check the solder paste deposits on the circuit board.
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3D Solder Paste Inspection system
PI Series
PI Series is a new generation 3D Solder Paste Inspection system that overcomes the limitations of traditional SPIs and satisfy all your inspection needs. The PI Series allows to easily implement Solder Paste Inspection in any PCBA line. These new generation systems are very intuitive to use, allowing non-experienced persons to get expected results.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Solder Paste Analysis
SPA1000
The SPA 1000 also introduces new process control capability by accurately measuring the suitability of the solder paste prior to its implementation on the production line. It achieves this by determining the "Open-Time" for the paste. It also performs the Slump Test and both of these methods provide a "Go/No Go" answer in less than 30 minutes to ensure minimum delay for the production line.
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Solder Impurity Checker
STA-2
Necessity for on-site lead-free solder management.Applicable for RoHS Directive. (WEEE: Directional on Waste from Electrical and Electronic Equipment, Pb mixed rate under 0.1%) Lead measurement accuracy is +/-150 PPM. Manage increases and decreases of Pb and Cu in your lead-free solder.
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Solder Wettability Tester
5200 Advanced
This is an ultra-high-sensitivity wettability tester developed to evaluate the solder wettability of ever-miniaturizing electronic components. Electronic devices, especially mobile devices, are becoming more compact and multi-functional. As the number of electronic components mounted on them increases and the pitch of connectors that connect each device increases, soldering parts are becoming increasingly miniaturized. expected to respond to further miniaturization of electronic components and miniaturization of joints in the future .
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3D Solder Paste Inspection Machine (3D-SPI)
3Si Series
Saki's 3D SPI identifies critical defects and assists with process improvement.
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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Measurement
Torsiograph
Torsiograph is used for measuring the rotation non-uniformity in rotating parts of various mechanisms. Torsiograph generates virtual channels for displacement and displacement velocity. These channels are available for further analysis by ZETLAB programs, e.g. for displaying on the oscillograph.
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25-Pin D-Type Male Solder Bucket
92-960-025-M
This accessory is designed to allow users to directly terminate a cable with soldered connections to the connector. When the product is used without a backshell users should make their own cable strain relief arrangements and ensure appropriate electrical precautions are observed.
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Measurement
Vibration Meter
The input signal of the Vibration meter software, which is the output signal of the accelerometer, i.e. the vibrational acceleration signal, is filtered by means of one of four possible digital band filters. Then, based on this signal, vibrational velocity and displacement signals are calculated by means of integrating filters. Thus, the software generates three signals which are transferred to the ZETLAB data server virtual channels created by the program and having the word “Acceleration”, “Speed” or “Displacement” in their names, respectively.Signals are averaged for a selected time interval (0.1 s, 1 s, or 10 s), after which the obtained values are displayed in the dialog box elements of the Vibration meter program. It is possible to display a root-mean-square (RMS), average amplitude or peak value.
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Measurement
Frequency Meter
Frequency Meter is used for measuring the frequency of the signal coming to the input channels of ADC modules and FFT spectrum analyzers. The indicator displays the measured frequency value (frequency of periodic oscillations) and signal cycle time corresponding to the measured frequency. It is possible to change the averaging of the displayed value (0.1; 1, or 10 s) and to select a necessary channel of the ADC module, FFT spectrum analyzer or a virtual channel.
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Measurement Systems
MicroMeasure3D
Sciences et Techniques Industrielles de la Lumière
STIL MicroMeasure3D, PORTICO3D and MAESTRO3D are measurement systems designed to achieve true 3D metrology of each point for the most demanding applications adapted to Industry 4.0 standards.
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Level Measurement
As a market leader in level detection with the largest selection of agency approved level switch technologies, the K-TEK level products line has the proven technology to provide solutions for the most difficult liquids and solids level applications.
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Solder Wettability Tester
5200ZC
The current machine (5200TN) was developed as a comprehensive machine that covers solderability test standards around the world, but we have added a high cost performance machine to the lineup that has realized the request of "single function + low price", which many people who are using the successive machines of SAT2000-5000-5100 type.
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Solder Joint Inspection System
DMC developed the software to inspect the solder joints of automotive power door lock switches.
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Measurement System
2800
The 2800 Chromatic Dispersion Measurement System provides fast, accurate measurements of chromatic dispersion and length of all types of single-mode optical fibers. Easy to use Windows-based software provides all industry standard calculation techniques for the determination of zero dispersion wavelength and dispersion slope. Options are available for the measurement of Polarization Mode Dispersion (PMD) and Fiber Strain.
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Balanced Measurements
The unbalanced interface of a VNA is not very well suited for measuring balanced circuits like antennas, transmission lines or chip impedances. In fact it is nearly impossible to get a decent calibration on a balanced 2-port measurement using coax cables.
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Level Measurement
Displacer level gauge for liquids from KOBOLD Instruments operates on the Archimedes principle. The level gauge's displacer tube rests inside the tank and is connected to the measuring unit via a spring. As liquid level increases, the buoyant forces of the liquid act on the displacer tube to reduce spring tension, allowing the spring to expand. The spring connects to a magnetic actuator, and the motion of the actuator is picked up by a magnetically linked indicator to yield the tank level measurement. The displacer level gauge is calibrated at the factory for the user's specified liquid density. Special designs with higher pressure or temperature ratings, as well as those made of exotic materials, are always available on request.
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Stability Measurement
Biodiesel Rancimat
In the Biodiesel Rancimat, increased temperature and a continuous stream of air through the sample accelerate its aging. The time that passes until oxidation takes place at a high rate – the induction time or oxidation stability index (OSI) – is measured.
