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SMT
"Surface Mount Technology" printed circuit board testing. AKA: Surface Mount Technology
See Also: QFN
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Integral Intelligent Flame Detector
FS-100
FS-100 utilizes SMT technology which integrates a photoelectric sensor, a microprocessor, and a Human-Computer Interface (HCI) and an output interface together, sending out various outputs including an ON/OFF flame signal, a fault signal, a 4-20mA signal, and an RS-485 output (meets the MODBUS standard) via the quick connector.
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TO-5 Package, Through-Hole or SMT Mounted, Non-Latching DPDT, DC-1GHz
Part No.s HR412V, HRS412V
TO-5 package, through-hole or SMT mounted, non-latching DPDT, DC-1GHzAvailable options include:HR412V High vibration, non-latching, through-hole mounted, DPDTHRS412V High vibration, non-latching, SMT J-lead mounted, DPDTResistive: 1 Amp/28Vdc Inductive: 200 mA/28Vdc (320 mH) Lamp: 100 mA/28Vdc
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3D AOI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Flip-Flop Electronics
Analog Devices supplies a range of D type and T type flip flop products. Members of this portfolio can support data transmission rates up to 43 Gbps and clock frequencies as high as 43 GHz. All of our flip flop products are RoHS compliant and available in 3 × 3 or 4 × 4 SMT packages.
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6 GHz Non-Latching DPDT
Part No.s GRF300, GRF303
TO-5 hermetically sealed package, SMT straight-lead mounted, non -latching, DPDT, with high insertion loss repeatabilityBandwidth: DC - 6GHzSignal Integrity up to 18GbpsAvailable options include:GRF300D - transient protection diodeGRF300DD - transient and reverse polarity protection diodesGRF303 - low power coilGRF303D - low power coil, transient protection diodeGRF303DD low power coil, transient and reverse polarity protection diodesResistive: 1A /28Vdc
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PCB Manufacturing
Printed circuit board assembly is the process of soldering or assembly of electronic components to a printed circuit board or PCB. Star Engineering is a full-service manufacturer of printed circuit board assemblies, providing complete solutions for all types of requirements. Being a skilled custom cable assembly manufacturer, our services include designing, testing, prototyping and manufacturing followed by complete support. We provide both surface mount (SMT assemblies) and through hole PCB apart from any custom requirements of your processes.
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Fine Pitch Stencil Printer
MC110
MC110 SMT stencil printer offers quick and easy setup via tooling hole or edge mounting for both single and double-sided boards. Exceptional build quality, with a heavy-duty cast aluminum base, ensures stability and repeatability.
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Mission Critical, Fault Tolerant Power Supplies
Series HSF
- Hot-swappable plug-in power supplies.- Designed to be combined in an N+1 fault-tolerant power system.- Front panel voltage adjustment trimmer for adjustment of output voltage.- Built-in forced current sharing and or-ing diodes.- May also be used independently as a multi-output power supply.- Designed to be sustainable - new models are backward compatible with existing racks.- Available in 1U and 3U sizes. Mounts in 19-, 23-, and 24-inch equipment racks.- All models include power factor correction (PFC).- Full service customized DC power distribution systems can match power supply output(s) with your load(s).- I/O connections via 24 pin connector that plugs into rack adapter. External connections are made via rack adapter.- Surface mount technology permits minimum mounting space.- Entire RA 19 racks populated with HSF power supplies can be connected in parallel, parallel-redundant or series.- HSF are CE Marked per per the LVD, EMC and RoHS 2 Directives. See applicable Declaration of Conformity.- Compliant with UL 8750, Standard for LED Equipment,- Watch video of NEBS GR-63-CORE earthquake and office vibration testing.
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18 GHz Latching SPDT
Part No.s GRF121A, GR121AR
Extended-Centigrid hermetically sealed package, SMT straight-lead mounted, magnetic-latching SPDT, with ungrounded contacts, and a common coil negativeBandwidth: DC - 18GHz Signal Integrity: 40Gbps Available options include:GRF121AR - common coil positiveResistive: 0.25A /28Vdc
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Large Board Stencil Printer
MC1200
Manncorp's MC1200 SMT large board stencil printer fills application requirements of large-board assemblers with print areas ranging from two feet to nearly four feet in length, making them ideal for LED, backplane and multi-panel assemblies. These big-board printers, priced at one-half to as much as two-thirds less than competing large-board printers, are ideal replacements for slower and less accurate manual printers.
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Optical Power Meter Series
*High performance detector*Stable and reliable*High sensitivity*Multi-wave test*Relative and absolute power display*SMT, lightweight*Power supply by battery
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8 GHz Non-Latching DPDT
Part No. SGRF312
TO-5 hermetically sealed package, SMT J-lead mounted, non-latching, DPDT, with high insertion loss repeatabilityBandwidth: DC - 8GHzResistive: 1A /28Vdc
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6 GHz Non-Latching DPDT
Part No.s GRF100, GRF103
Centigrid hermetically sealed package, SMT straight-lead mounted, non-latching DPDT, with high insertion loss repeatability Bandwidth: DC - 6GHzAvailable options include:GRF103 - low power coil
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BAW Devices
Teledyne’s Bulk Acoustic Wave (BAW) Product Line has been producing BAW delay devices since the early 1960’s. Over the years, Teledyne Microwave Solutions (TMS) has constantly improved BAW technology and is currently the world’s only supplier of microwave bulk acoustic wave delay devices. Markets for BAW devices include instrumentation and radar altimeters and are available in connectorized, pin and surface mount configurations.
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SMT & THRU HOLE LOADED BOARD TEST PROBES
SERIES 33
ElectricalMAXIMUM CURRENT:3 amps continuousat working travel, non-inductiveRESISTANCE: At 35 mA test current,20 mOHMS meanMaterials and FinishesPLUNGER: Heat treated berylliumcopper, 24Kt gold plated over nickelBARREL: Nickel silver with preciousmetal clad ID.SPRING: Music wire, silver plated
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Smart Load Manager
Nippen Electrical Instruments Co.
This is flush mounting micro controller based instrument with multilayer PCB having SMT components offering accuracy and reliability along with reduction in EMI and EMC interference. These are specially designed to simultaneously measure, display and communicate several electrical parameters. This meter is an Ideal data source for effective Energy management, SCADA, PLC, BMS etc to measure as many as 36 parameters on 23 display pages, which are true RMS. The readings are displayed on 3 line bright Red 7 segment LED, each row/ line having 4 14.2mm high LEDS.
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2.5 GHz Non-Latching DPDT
GRF172
Centigrid hermetically sealed package, SMT straight-lead mounted, non-latching DPDT Bandwidth: DC - 2.5GHzAvailable options include:GRF172D - transient protection diode
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4-zone Full Convection SMT Reflow Oven
CR4000C
At just over 6 1/2 feet long, the CR4000C full-convection reflow oven fits production areas where floor space is tight without sacrificing performance. High-mass heating panels and high-speed blowers allow the oven to reach temperatures up to 300˚C for lead-free reflow.
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High Flexible Inline AXI Platform
AXI X# Series
The X#-platform series is an inline automated X-ray system which covers a wide range of AXI applications. It is a flexible platform with very versatile fields of use depending on the application requirements. The inspectable applications range from component level inspection for wire bonds, large SMT boards, high-power electronic modules up to fully assembled modules.
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Surface-Mount Noise Sources
Mercury’s family of surface-mount noise sources provides exceptional performance in a compact and easy to integrate package. These products are ideal for applications such built-in test and dithering circuits where the system requirements drive a need for compact, surface mount technology.
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Double Sided PCB
Double Sided PCBs (also known as Double-Sided Plated Thru or DSPT) circuits were the gateway to higher technology applications. The advent of the plated thru hole was quickly adapted and allowed electronic designs to expand in capability and shrink in physical size. Today the double sided printed circuit board technology remains the workhorse of the assembly industry. There are near limitless applications for old and new designs. Fine line surface mount, ultra high copper build, high and low temperature, Solder coated, Silver, and Gold finishes are just a few examples of DSPT applications.
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Surface Mount Package Emulation
SMT Adapters
Ironwood’s SMT package emulation adapters are often called “surface mount feet” or “emulator bases”. These adapters provide access and interconnections to surface mount lands. Typically, the adapters are soldered to the target board in place of the IC device and provide a pluggable array of pins interface for sockets, probing adapters, package converters, and even board-to-board connections. These adapters are often utilized as a base for many of our probing adapter products. We constantly innovate to provide the most reliable, cost effective interfaces available. For example, many of our PLCC, QFP and SOIC emulation bases use our proprietary shaped solder techniques, replacing expensive, and often fragile, J-lead and Gull Wing leads. Shaped solder parts are easily fluxed and reflowed onto the target system. Our emulator bases can present either a male or female interface at 1.27mm or 1mm or 0.8mm pitch gold plated array pins for pluggable connection.
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Resister
Our ARFC type Film Flat Chip Resistor & ARFCN type Thin Film Chip Resistor Network are high precision Metal Film resistors produced with high purity. Alumina Substrate and Ni-Cr-Si Resistor Film based on high precision Etching Technology. The electrode Terminals are made with Spattering Film and Nickel-Solder Plating, and solderability is very good in all Flow, Reflow and Dipping type soldering for Hybrid IC, SMT, PCB etc. Our ARFC Metal Film Resistor & ARFCN type Thin Film Chip Resistor are being produced under the thorough quality control, and are being used widely in high precision and high reliability electronics circuit such as Measuring Instrument, Medical Instruments, Communication and other Industrial Instruments.
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To-5 Package, Through-Hole or SMT Mounted, Latching DPDT, DC-1GHz
Part No. HR422K, HRS422K
TO-5 package, through-hole or SMT mounted, latching DPDT, DC-1GHzAvailable options include:HR422K High shock, latching, through-hole mounted, DPDTHRS422K High shock latching, SMT J-lead mounted, DPDTResistive: 1 Amp/28Vdc Inductive: 200 mA/28Vdc (320 mH) Lamp: 100 mA/28Vdc
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18 GHz Non-Latching SPDT
Part No. GRF131
Extended-Centigrid Hermetically Sealed Package, SMT Straight-Lead Mounted, Non Latching SPDT Bandwidth: DC - 18GHzSignal Integrity: 40Gbps
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6 GHz Latching DPDT
Part No. GRF180
Centigrid hermetically sealed package, SMT straight-lead mounted, magnetic-latching DPDT Bandwidth: DC - 6GHzResistive: 0.25A /28Vdc
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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3D SPI
Omron’s advanced inspection systems help manufacturers meet the requirements of today’s SMT applications while improving throughput and sharpening their competitive edge.
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Circuit Card Assembly
Teledyne Advanced Electronic Solutions assembles and tests a variety of complex circuit card assemblies (CCAs) using leading edge, advanced technology assembly automation. We specialize in low-volume, high-mix assembly of highly complex CCAs.- RF, analog, high-speed and digital circuits on rigid-flex and Cu core substrates- Typical lot sizes from 3 to 300 pieces- 4 high speed, flexible SMT lines- Production processes for components from 0201 chips to large grid-array components and connectors- 100% solder paste, automated optical, and x-ray inspection- Forced air convection reflow with inert atmosphere option- Special processes for RF assemblies (filters, shields, etc)- BGA underfill, conformal coating, etc.- Selective and wave solder pin-thru-hole processes- CCA and component bonding processes
