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Probers
Transfer and connect test target to contactor or move probes to target.
See Also: Probing, Probing Stations, Nano Probes, Flying Probes, Wafer Probers, Interrogation
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Automated Wafer Prober for Magnetic Devices and Sensors
Hprobe design and fabricate turnkey automated testing equipment (ATE) for electrical characterization and testing of integrated circuits under magnetic field such as MRAM (Magnetic Random Access Memory) and sensors. In each phase of the technology and product development as well as during mass manufacturing, a dedicated magnetic tester is available.
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Coaxial Cable Termination Toolkit
ICFP
Ardent’s ICFP is a next generation coaxial cable termination toolkit for advanced system design de-embedding, de-bugging, and calibration. Designed for the lowest loss access to signal paths on an IC circuit footprint, this solution is a simple, cost effective alternative to expensive probers and x-y tables for Engineers who need to probe multiple signals at once.
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Adjustable Clamshell Bed of Nails Testers
AdjustaBON Family
Designed for quick test development. This fixture can be configured to probe almost any circuit board in just a few hours. Once the perfect test is developed, move this light weight fixture out to the production floor to evaluate your production line test strategy prior to buying permanently drilled test fixtures, or while waiting for your drilled fixtures to be delivered. The AdjustaBON competes with the Flying Prober. There are many advantages over the flying prober. Setup is simple and intuitive and can be much quicker than programming a flying prober. Small size provides versatile bench top operation right where you need it. Maintenance costs are insignificant in comparison. The total cost of this fixture is in many cases less than the yearly maintenance cost of a flying prober. It would be possible to buy one of these fixtures every year for the price paid just to maintain one flying prober and it is about 1/20th the purchase price
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Memory Test System
T5230
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Micro Probers
Flying Fixture
Yamaha Fine Technologies Co., Ltd.
Industry-standard testing machines for electronic circuit boards achieving high productivity and contact accuracy simultaneously. The pass rate and throughput greatly affect the productivity in the electrical testing process of circuit substrates. While improving both of these has proven difficult using the existing fixture method or flying method, Yamaha's Flying Fixture™ method has solved this.
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Universal Manipulator
LSC
The LSC is a versatile universal manipulator, compatible with probers, vertical plane handlers, and dock-from-below test systems.
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FPP Software
Four Point Probe
Materials Development Corporation
For use with a manual four point prober, the MDC FPP Software operates in a convenient, single screen that displays both measurement parameters and testresults. The FPP software can measure Resistivity, Conductivity, Resistance, Doping, Thickness, and SheetResistance when used with a compatible current source and voltmeter or SMU.
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Flying Probe Test Systems
Flying probe testers work by In-circuit testing the board via a number of moving test probes. They have the advantage over traditional In-circuit testers of not requiring a dedicated "bed of nails" test fixture thus reducing the price for each different board being tested. However, modern Flying Prober testers offer so much more than just In-circuit testing. They enable the user to combine In-circuit, AOI, Functional, Device Programming and Boundary Scan testing, in one test system.
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Die Sorter Handler
4605-HTR
4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
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Fully Automatic MRAM Probe System With Initializers
*This system can measure MRAM characteristics automatically.*Automatically initializes(resets) before and shorten the time of measurement by having a built in initializer.*Generates strong and constant magnetic fields. (Prober: Max 1.5T, Initializer: 2.7T (the highest in the industry)
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Wide Band Gap Production System
Reedholm has configured an integrated system, not just a set of boxes, for testing high power devices at the wafer level. Sophisticated testing, prober control, and database management do not carry a programming burden. As a result, fast, automated wafer testing is done in an inexpensive, compact probing platform.
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Advanced Low-Frequency Noise Analyzer
E4727B
Get a deeper, closer look at low frequency noise with the A-LFNA integrated with WaferPro Express, featuring data analysis, wafer prober control and test suite automation.
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Probe Series
AVIOR Series
The MPI AVIOR series offers a broad lineup of high performance prober systems targeting the Optical Communications market. Our prober systems are available in Top emitting (TP), Flip chip (FP) emitting and Die/Package (DP) configurations to meet your specific test requirements. Whether it be R&D or mass production, MPI has a solution that will meet your needs for accurate and reliable measurements in conjunction with a reduced cost-of-test.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Cryogenic 4K Probe Cards
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Cable Tracer Prober M-CTP-240A
Cable Tracer Prober M-CTP-240A
Fuzhou Metricu Technology Co Ltd
Cable Tester, network tester
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Probe Based Systems
The integration of additional measurement technology in probers enables you to flexibly expand the analysis options in the ongoing production process. With the introduction of our Automation Assistant software platform, we have therefore equipped a large number of probers with a wide variety of analysis tools.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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On-Wafer Measurements
Accurate DC/CV (and RF) statistical modeling of semiconductor devices requires collecting a significant amount of measured data from different wafers across several temperatures. Keysight Technologies recommends IC-CAP WaferPro as a turn-key DC/CV and RF automated characterization solution to help modeling and device engineers achieve more efficient on-wafer measurements across temperature. This new breakthrough solution is based on IC-CAP modeling software and efficiently controls DC/CV analyzers, network analyzers, probers, switching matrixes, and temperature chucks, as well as the powerful 407x and 408x Series of Keysight parametric testers.
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Cryogenic Applications
Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe card as well as DUT probing solutions. These custom cryogenic probe card solutions are widely used to test Space, Military, Medical and Quantum Computing products. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovative custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cableout designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Embedded Systems Projects
Precision Development Consulting Inc
Module Controller in Track System for silicon wafers, Static Headstack Tester, DOS Device Driver, LED Wafer Prober
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MPI SENTIO®Software Suite
MPI Advanced Semiconductor Test
By using a novel approach based on simplicity and truly intuitive operation, MPI was first to develop a revolutionary multi-touch prober control software suite to address today’s challenges of operating complex test systems. It saves significantly training time and makes the operators’ life as easy as possible!
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Wafer Prober Networking System
PN-300
The Wafer Prober Networking System PN-300 utilizes a database to facilitate data access from other systems and provides an environment that enables the user to edit data and handle processing. The system achieves wide-ranging compatibility by adopting standard hardware and operating system. In addition, it is equipped with an N-PAF (Network-based Prober Advanced Function) to provide robust support for wafer prober operation and maintenance.
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Discrete Devices Test
FTI 1000
The FTI 1000 tester consists of independent test channels that allow all DC and AC MOSFET parameters to be tested either separately, or in one handler insertion or prober touch-down.
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High Voltage 50 Ω Pulse Generator
TLP-12010A
High Power Pulse Instruments GmbH
- High pulse output current up to ±120 A (short circuit)- Ultra-fast 50 Ω high voltage pulse output with typical 300 ps rise time- Wafer, package and system level TLP and HMM testing- 180 kW peak output power into 50 Ω load- Built-in HMM pulse up to ±32 kV in 50 Ω-configuration- High speed 50 Ω trigger output for oscilloscopes (synchronous to high voltage pulse output)- 6 digital programmable pulse rise times out of: 300 ps to 50 ns (optional)- 1 built-in pulse width: 100 ns- Optional external pulse width extensions from 5 ns to 500 ns using the external pulse width extender TLP-12012A6- Built-in pulse reflection suppression- Fast measurement time, typically less than 0.2 s per pulse including one-point DC measurement between pulses- Efficient software for system control and waveform data management- The software can control automatic probers for fast measurements of complete wafers- Integrated interlock safety shut-down- Industrial isolated and EMI/ESD protected USB control interface
