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JEDEC
semiconductor test methods and standards setting organization, Joint Electron Device Engineering Council.
See Also: UFS
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Detective Logic Analyzer
DDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured StatesContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsRow Hammer Analysis for potential data corruptionInteractions among up to 8 ranks, over two slots are analyzed.Mode Register Listing providedSupports Auto-Clock rate detect and clock stoppage Connects to the target under test with DIMM, SO-DIMM, and BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Detective Logic Analyzer
LPDDR5
Provides logic analyzer like deep transaction Listing and Waveform capture. Can store up to 512M of captured States at up to 6400+ MT/sContinuous, real time analysis, not post-processing 2D (voltage & time) Eye Detector guarantees valid data acquisition on each signalExtensive Triggering and Storage Qualification allows precise insightIndustry Leading Protocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specifications, NOT post processing. No other tool can provide this!Mode Register Listing provided
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mSAT SSD for Industrial Embedded Applications
mSATA SSD Series
ADLINK’s mSATA SSD Series with the SATA 6Gb/s interface is fully compliant with the standard mSATA form factor, also known as JEDEC MO300. Utilizing Toggle 2.0 MLC flash technology, capacities of up to 1TB are available with support for read/write speeds of up to 550MB/sec and 500MB/sec respectively . Additionally, the power consumption of the ADLINK’s mSATA modules is much lower than that of traditional hard drives.
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DDR4 Parametric Test Reference Solution
Keysight's DDR4 parametric test reference solution helps verify the signal integrity of DDR4 memory designs according to JEDEC specifications.
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Automated Thermal Stress System
ATSS Series
Thermotron's Automated Thermal Stress Systems (ATSS) facilitate extremely rapid product temperature change rates in a space-saving, self-contained design that accelerate a Thermal Stress test. Thermotron's ATSS chambers meet the latest MIL-STD 883E and MIL-STD 202F thermal shock specifications as well as JEDEC and IPC test methods. ATSS chambers are capable of the following: Rapid thermal shocking, Accelerated product stressing, Controlled thermal cycling in a self-contained, compact design. With separate hot and cold zones, the Automated Thermal Stress System was designed with a patented retractable product transfer carrier that makes full use of the available working volume in both temperature zones for increased product loading and throughput. The product transfer carrier reduces the overall height requirements of the chamber and is made as light as possible to minimize thermal loading restraints. Thermotron ATSS chambers can be used as part of most commercial reliability and quality control programs, helping to determine:
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ESD, Latch-up testing / design service
ESDdoctor
ESDdoctor consulting service can identify, diagnose, and solve any ESD/EOS problem quickly and definitively, at a surprisingly low entry cost. You can choose testing and diagnosis only, or add ESD design services to the consulting package. ESD, Latch-up testing: HBM (ANSI/ESDA and JEDEC) on packaged dies. MM (ANSI/ESDA and JEDEC) on packaged dies. Latch-up JEDEC on packaged dies TLP on packaged and bare dies.VF-TLP on bare dies.
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ESD & Latch-Up Test System
Identify and help correct ESD and latch-up susceptibility issues on sensitive integrated circuit components prior to full-scale production with the Thermo Scientific™ MK.2-SE ESD and Latch-Up Test System. The MK.2-SE test system provides advanced capabilities to test high pin count IC devices to Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design addresses wave form hazards such as trailing pulse and pre-discharge voltage rise, and performs Latch-Up testing per the JEDEC EIA/JESD 78 Method.
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Memory Module
Advantech Memory module and DRAM modules offer an extensive portfolio of industrial grade memory, like un-buffered DIMMs, LONG-DIMM and SO-DIMM which are designed according to the latest JEDEC standards and cover all technologies from DDR to DDR3 memory in wide temp ranges (-40 to 85C). Advantech Memory module and DRAM modules'' synchronous design allows precise cycle control with the use of system clock. I/O data transactions are possible on both edges of DQS. Range of operation frequencies, and programmable latencies allow the same device to be useful for a variety of high bandwidth, high performance memory system applications.
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Thermal Test Boards
Thermal Engineering Associates, Inc.
TEA offers a series of thermal test boards for package characterization and design comparison that conform to to the JEDEC JESD51 standards. The board family, referred to as the TTB-1000 series, consists of two different standard sizes designed to cover a wide range of package sizes. These boards, also referred to as test coupons, provide a well defined mounting environment, will withstand temperatures to 125 oC, and have lead lands terminated in eyelets to allow for hand-wired connection to the board edge contacts. The board mates with a dual 18-pin, 3.962 mm (0.156") pitch edge-card connector.
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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ESD Testers
Hanwa Electronic Ind. Co.,Ltd.
◆Adaptable to the following international standard waveform;JEDEC, ESDA, AEC, and JEITA◆This system’s uniquely short discharge circuit is made possible by its original mechanical design.◆The short circuit minimizes the influence of inductance and capacitance on the data.◆The use of a single circuit ensures data stability for each device pin tested.
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Sideband Bus Protocol Analyzer
FS2700 DDR5
The FS27xx DDR5 Sideband Bus Protocol Analyzer is the latest DDR5 tool from FuturePlus Systems. FuturePlus has taken the complexity of 8 different JEDEC specifications and ported them into this very useful tool. DDR5 Validation Engineers and system integrators will not have to comb through complex specifications defining thousands of bits and register addresses. The tool takes care of this. Please request our data sheet for more information.
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Memory Tester for DDR4 DIMMS
RAMCHECK LX
USBWith the RAMCHECK LX DDR4 memory tester package (part number INN-8686-DDR4) you can quickly test and identify DDR4 DIMMs that comply with JEDEC standards. Tests are fast, reliable and easy to do. The RAMCHECK LX DDR4 package includes the RAMCHECK LX base tester and 288-pin DDR4 DIMM adapter. (This package is also available with the DDR4 DIMM Pro adapter, featuring a very rugged test socket).
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IP Solution
eMMC 5.1
Demand for mobile content capacity and bandwidth for video, pictures and music is ever increasing. To address this demand in the next generation of smartphones, tablets, and portable devices, the eMMC 5.1 Specification from JEDEC, improves the current HS400 speeds operating at 3.2Gbps, with "command queuing" making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.
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SD Card
SD Card v.3.0 / eMMC v.4.51 IP Family
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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HBM Discharge Simulator
PSD-510
The PSD-510 is a low cost, light weight, battery powered Human Body Model (HBM) simulator designed to help customers determine the HBM ESD sensitivity of a device in accordance with ANSI/ESDA/JEDEC JS-001.
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DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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Warpage Metrology System
TableTop Shadow Moiré (TTSM)
Measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Flash SATA Disk /mSATA SATA 3 SLC,MLC
FSA 300 Series
*SATA III (6.0Gb/s) interface*Capacity: SLC 1 GB to 64 GB, MLC 4 GB to 128 GB*iSMART disk health monitoring*Intelligent error recovery system*Write protection security*Anti-vibration mechanical design*Excellent data transfer speed*Zero mechanical interference*JEDEC standard MO-300B dimension
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test measurement unit
ITC59100 Rg/Qg
The ITC59100 Test Measurement Unit (TMU), which plugs into the ITC59000 Test Platform, performs gate charge (Qg) measurements that conform to MIL-STD-750C, Notice 2, Method 3471 and JEDEC Standard JESD24-2. In addition the ITC59100 TMU performs an internal gate resistance (Rg) test method that conforms to JEDEC Standard JESD24-11.
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Surface Mount-to-DIP JEDEC SOT-25, SOT-23A-6 Adaptor
1110748
Surface Mount to DIP Adapter for SOT-25, SOT-23A-6. Allows for breadboarding or substitution of microgate SOT-23A-6 and SOT-25 IC and transistor packages into .100 [2.54] pitch proto boards or PC boards. Solder masked top-side pads allow user to hand solder devices directly to topside of adapter with fewer problems of solder bridging. Longer male bottom pins are available at special request for easy use of probe clips. Large topside pads allow for soldering test pins, jumpers, etc. to top of adapter.
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Post Wire and Die Bond Inspection Machine
IV-T3300
IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Detective Logic Analyzer
LPDDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured States at 1600MT/sContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsMode Register Listing providedSupports Auto-Clock rate detect and clock stoppageConnects to the target under test with Flying Lead, BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Rugged Half Slim SATA3
RunCore Innovation Technology Co. Ltd.
Standard Half Slim SATA SSD JEDEC MO-297.
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LPDDR
A large number of LPDDR sockets have been developed to cover the wide variety of ball I/O configurations. This catalog supports the JEDEC 209 Standard configuration.
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Flash SATA Disk/mSATA Mini SATA 3 SLC, MLC
FSA 301 Series
*SATA III (6.0Gb/s) interface*Capacity: SLC 1 GB to 32 GB, MLC 4 GB to 64 GB*iSMART disk health monitoring*Intelligent error recovery system*Write protection security*Anti-vibration mechanical design*Excellent data transfer speed*Zero mechanical interference*JEDEC standard MO300B dimension
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Walk-In Climatic Test Chamber
WEIBER climatic test chamber is ideally suited for specimen test requiring quick changes of temperature. It covers various applications from JEDEC and IEC test standards. The climatic chamber is equipped with advanced technology such as specimen temperature control which allows linear specimen temperature rates of change during rapid thermal cycling or accurate temperaThe walk in option provides facility to test large sized, heavy weight specimen as well as the facility to test the specimen in bulk. Capacities ranging from 2000 to 10,000 Lt are available. Standard as well as customizable sizes and facilities are provided.
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Universal Flash Storage
UFS
Universal Flash Storage (UFS) is a JEDEC standard for high performance mobile storage devices suitable for next generation data storage. The UFS is also adopted by MIPI as a data transfer standard designed for mobile systems. Most UFS applications require large storage capacity for data and boot code. Applications include mobile phones, tablets, DSC, PMP, MP3, and other applications requiring mass storage, boot storage, XiP or external cards. The UFS standard is a simple, but high-performance, serial interface that efficiently moves data between a host processor and mass storage devices. USF transfers follow the SCSI model, but with a subset of SCSI commands.The Arasan UFS IP family consists of Host controller IP, Device controller IP, and MPHY.
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Analyzer Probes
The following probes are available for the MA51x0 and MA41x0 series analyzers. These probes are designed for low-voltage and high-speed midbus probing or probing with an interposer. The following JEDEC memory standards are widely used by these probes: DDR5 (JESD79-5), DDR4 (JESD79-4), DDR3 (JESD79-3), LPDDR5 & LPDDR5X (JESD209-5), LPDDR4 & LPDDR4X (JESD209-4), and LPDDR3 (JESD209-3).
