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Chemical Analysis and Corrosion Testing
Performing chemical analysis of metal alloys including both ferrous and non-ferrous alloys.Chemical analysis involves determining the chemical constituents of metals and related materials.An industry leader and co-operating laboratory for qualifying Calibration Standards for Chemical Analysis.Our chemical laboratory processes include Spectroscopy – Optical Emission Inductively Coupled Plasma, gas analysers, wet chemical, Intercrystalline/ Intergranular Corrosion (including G28, G48 etc).
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Inductively Coupled Plasma Spectroscopy (ICP-OES/MS), ICP Analysis Services
ICP-OES measures the light emitted at element-specific characteristic wavelengths from thermally excited analyte ions . This light emitted is separated and measured in a spectrometer, yielding an intensity measurement that can be converted to an elemental concentration by comparison with calibration standards. ICP-MS (ICP-Mass Spec) measures the masses of the element ions generated by the high temperature argon plasma. The ions created in the plasma are separated by their mass to charge ratios, enabling the identifcation and quantitation of unknown materials. ICP-MS offers extremely high sensitivity (i.e. low detection limits) for a wide range of elements
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Inductively Coupled Plasma Mass Spectrometer
ICPMS-2030
With its newly developed collision cell and optimized internal structure, the ICPMS-2030 provides superior sensitivity. At the same time, thanks to the adoption of its proprietary mini-torch unit and provision of an Eco mode, the quantity of argon gas needed for analyses has been greatly reduced to the industry's lowest levels. As a result, low running costs are assured. The Development Assistant function of the software automatically sets the optimal analysis conditions for quantitative analysis. Then, after measurements are complete, the Diagnosis Assistant function automatically checks the validity of the necessary data. While reducing the burden on the user, the efficiency of analyses is enhanced and the reliability of the data can be increased. It complies with FDA 21 CFR Part 11.
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Inductively Coupled Plasma Optical Emission Spectroscopy / ICP-OES Systems
Industry-leading performance, speed and ease of use – no compromises
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Desolvating Nebulizer
Aridus3
The CETAC Aridus3 Desolvating Nebulizer System is a specialized liquid sample introduction accessory for inductively coupled plasma mass spectrometry (ICP‑MS). The Aridus3 can enhance analyte sensitivity up to 10 times or more and can greatly reduce solvent-based interferences such as oxides and hydrides.The Aridus3 couples a low-flow (50, 100, or 200 µL/min) PFA nebulizer and a heated PFA spray chamber with an inert fluoropolymer membrane. This combination provides enhanced analyte sensitivity while reducing solvent based interferences such as oxides and hydrides. The Aridus3 is particularly advantageous for small volume and highly corrosive samples such as those generated in the earth sciences and the semiconductor industry.
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Inductively Coupled Plasma Spectrometry
Is an analytical technique that can be used to measure elements at trace levels in biological fluids.
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ICP-OES Analyzer
ARCOS
SPECTRO Analytical Instruments GmbH
For the most demanding elemental analyses in industry and research. ARCOS analyzer represents a new pinnacle of productivity and performance for inductively coupled plasma optical emission spectrometers. SPECTRO ARCOS excels in industrial and academic applications for the most advanced elemental analysis of metals, chemicals, petrochemicals, and other materials.
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Inductively Coupled Plasma Mass Spectrometry / ICP-MS Systems
Agilent ICP-MS systems utilize innovative technology to deliver excellent sensitivity, accuracy, ease of use and productivity. Our 7800 and 7900 quadrupole ICP-MS systems offer the highest matrix tolerance, widest dynamic range and most effective interference removal for trace elements across most typical applications. The 8900 Triple Quadrupole ICP-MS (ICP-QQQ) adds MS/MS operation, providing precise control of reaction cell processes to ensure the most consistent and accurate results, resolving interferences that are beyond the capability of quadrupole and sector-field high resolution ICP-MS.
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Inductively Coupled Plasma Emission Spectroscopy
Inductively Coupled Plasma Emission Spectroscopy
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ICP Plasma System
The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Multichamber Plasma CVD & RIE Processing Systems
Model MPS-2000
Accurate linear wafer transporter with low particulate generation. Automated options with programmable controls. Safety interlocked with local and global interfaces. Base pressures to 10-8 torr. Optional clean room load lock entry port. Option for inductively coupled plasma processing is available. Complete and ready to operate.
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Plasma Processing Systems
PlasmaSTAR
The PlasmaSTAR® Series of Plasma Processing Systems from Axic, Inc. defines a new concept in barrel plasma processing. The systems are based on a modular design concept. Starting with a universal base unit, multiple electrode modules are available for easy insertion into the base unit. You will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma.
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Plasma Power Generators
Advanced Energy’s field-proven, Precision PowerTM solutions offer extreme control, peerless arc handling, and cutting-edge match technology. Unlock new fabrication processes and benefit from our plasma power generators’ comprehensive capabilities.
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Time-domain Field-Device-Circuit coupled simulator
EM-SUPREME®
Time-domain Field-Device-Circuit coupled simulator for modeling of passive structures, active components, and complete RF & millimeter-wave modules. EM-Supreme is used for EM modeling of power amplifiers, switches, filters, active antennas, and complete RF modules such as antenna-switch, switch-filter, switch-filter-amplifier, and front-end modules with no approximations.
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Plasma Profiling TOFMS
PP-TOFMS
Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Microwave Plasma Subsystems
AX2600 And AX2700
The AX2600 and AX2700 Microwave Plasma Delivery Subsystems are complete and highly reliable solutions for the cost-effective generation and safe delivery of atomic species to the wafer. Available in 3 kW, these highly reliable, field-proven plasma delivery subsystems deliver highly concentrated atomic species. Suitable for multiple chemistries, the high speed and precision of this plasma system’s automatic tuning guarantees immediate ignition and fast transition from plasma conditions for high productivity. Robust closed-loop control ensures high accuracy, precision, and optimal repeatability of the process from wafer to wafer and system to system.
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RF Plasma Generators & Amplifiers
100 W to 2400 W 13.56 MHz Analog/Digital, RS-232, USB interfaces Low Harmonic Distortion Automatic and Manual Gain Control High Speed Pulsing (Bursting) controls Compatible with T&C''''s Matching Networks GUI Software (complete PC control) Includes all essential RF power/communication cables and mounting brackets Air cooled (Air & Water 1200 W +) Half rack mount or stand alone versions Ideal for: Industrial, Scientific, and Medical Applications
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Inductively Powered Telemetry Systems
Advanced Telemetrics International
ATi Inductively Powered Telemetry Systems are typically used to transmit data from rotating shafts or machinery to a stationary receiver.
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DC Coupled Differential Switching System
BS1553F(X)
Universal Switching Corporation
The BS1553F(X) is a modular passive DC coupled differential switching system. It is designed as an automated "patch panel" for interconnecting numerous MIL-STD-1553 devices, cables and hardware, or for routing other differential signals such as '422 clock/data or kelvin ATE measurements. The I/O capacity is scalable from a small 8x8, up to 64x64 in one 5RU unit.
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Plasma Process Monitors
Plasma process monitors to monitor plasma emissions during semiconductor manufacturing processes such as etching, sputtering and CVD.
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Remote Plasma Source
Xstream
The highly efficient Xstream® RPS dissociates large volumes of NF3 and quickly cleans chambers, improving your overall tool performance. Its plasma chamber showcases high-purity aluminum alloy and patented cooling capabilities. Built to last for years without repair or expensive chamber coatings, the Xstream RPS is the smart choice for dependability and efficient performance.
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Plasma CVD & Reactive Ion Etching System
MODEL DRIE-1100-LL-ECR
The Tek-Vac DRIE-1100-LL-ECR series systems are designed for both high-density plasma chemical vapor deposition and reactive ion etching of sub-micron integrated circuits, optical devices and RF microwave electron devices.
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Tailor-Made to Simulate Low-Temperature Plasma Sources and Systems
Plasma Module
The Plasma Module is tailor-made to model and simulate low-temperature plasma sources and systems. Engineers and scientists use it to gain insight into the physics of discharges and gauge the performance of existing or potential designs. The module can perform analysis in all space dimensions 1D, 2D, and 3D. Plasma systems are, by their very nature, complicated systems with a high degree of nonlinearity. Small changes to the electrical input or plasma chemistry can result in significant changes in the discharge characteristics.
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Microwave Plasma Atomic Emission Spectroscopy / MP-AES Systems
Agilent’s industry-leading microwave plasma-atomic emission spectrometer (MP-AES) systems are powerful, cost-efficient and easy-to-use for a wide range of applications from routine analysis to complex precious metals analysis. By running on air, Agilent MP-AES systems both cost less and are safer than alternative methods that rely on flammable gases. The innovative Agilent 4210 MP-AES system offers higher sensitivity and faster throughput capabilities than flame atomic absorption.
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Plasma Etcher / Asher
PA-3000-A ETCHER
Process chamber with plasma view window and full access hinged door. RF hot process shelves with opposing ground electrodes. Throttle valve. Capacitance manometer. Internal pumping system with option for Fomblin filled chemical series mechanical pump. Flow control electronics and cabinet. Up to four mass flow control assemblies can be incorporated into our system. RF matching network and 600 watt maximum power supply. Fully enclosed cabinet. Custom internal fixturing to accommodate specific substrate shapes and sizes. Plasma gas selection for optimal performance.
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Plasma CVD & Etching Systems
MODEL DRIE-1000
A High Quality Plasma Deposition & Etch System, Ideal for R&D and Small Scale Production. Modified designs with capabilities of 12" wafers. Substrate heating to 500 C. Top loading / Optional loadlock. Multifunctional plasma network. Diversified pumping configurations. Variable electrode spacing. Customized features and components for specific applications.
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AC Coupled, 14-Bit Digitizer For ExpressCard 54, 2 Channels 150 MS/s
EC14150A
The EC14150A (EC) is an AC-coupled dual channel waveform capture board that provides a remarkable combination of high speed and high resolution sampling along with a very large memory capacity all in a very compact and low power consuming ExpressCard form factor. At 4.5 W, the EC represents one of the lowest power consuming digitizer cards ever created for its class. Signal frequencies up to 200 MHz can be accurately captured either in baseband or in higher order Nyquist zones using under-sampling techniques. Where DC-coupling is required, the EC14150D should be considered.
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Particle-in-Cell Plasma, Electromagnetic & Electrostatic Simulation Software
VSim
The VSim electromagnetic, particle, and plasma high performance application is a flexible, multiplatform, Particle-in-Cell (PIC) simulation tool for running computationally intensive modeling problems. VSim enables you to switch easily between 1, 2, or 3 dimensions and then watch your model run lightning-fast. Using algorithms designed for the exacting demands of high performance computing systems, VSim can run simulations on your laptop or supercomputing cluster.
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PXIe-4480, 1.25 MS/s, 3.4 Hz AC/DC-Coupled, 6-Input PXI Sound and Vibration Module
784277-01
1.25 MS/s, 3.4 Hz AC/DC-Coupled, 6-Input PXI Sound and Vibration Module—The PXIe‑4480 is designed for high-bandwidth audio, acoustic, and vibration measurements. It provides six channels of dynamic signal acquisition, and you can use one of four gain settings to configure your input range. The PXIe‑4480 also includes software-configurable AC/DC coupling, charge measurement, voltage excitation, IEPE excitation, and TEDS support, making it ideal for measuring acoustic transducers, pressure sensors, and hydrophones. Common applications include audio test; noise, vibration, and harshness (NVH) analysis; and underwater acoustic measurements. For measuring sudden changes, such as high speed blast and pressure events, the PXIe-4480 can sample up to 20 MS/s per channel in time-domain mode.
