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Finite Element
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Finite Element Method Magnetics Simulation Software
FEMM
Finite Element Method Magnetics
FEMM is a suite of programs for solving low frequency electro magnetic problems on two-dimensional planar and axisymmetric domains. The program currently addresses linear/nonlinear magneto-static problems, linear/nonlinear time harmonic magnetic problems, linear electrostatic problems, and steady-state heat flow problems.
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Finite Element Analysis (FEA) Solution
Femap
Siemens Digital Industries Software
Femap is an advanced engineering simulation software program that creates finite element analysis models of complex engineering products and systems, and displays solution results. Femap can virtually model components, assemblies or systems and determine the behavioral response for a given operating environment.
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Finite Element Analysis
Response Dynamics Vibration Engineering, Inc.
An understanding of structural dynamics is very important to sound Finite Element Analysis (FEA). We have been performing FEA analysis for over 30 years and in most cases we have used experimental data to guide our modeling. While our engineers have had undergraduate and graduate courses in FEA, it is the years of modeling and analysis of existing structures that has taught us the most by forcing a thoughtful analysis of the key structural dynamics and then going though the process of making adjustments to boundary conditions, expanding the dynamics of the model in places, and making simplifications and approximations where possible.
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Engineering Services
In addition to the highest quality test programming, maximizing board coverage, and efficient board testing, TTCI offers a full array of other engineering services, including CCA (Circuit Card Assembly) Testing, Design for Test, ASTER TestWay electrical design for test analyzer, Feasa LED analyzer, SMH Technologies FlashRunner in-system programmer, finite element analysus, installation, reverse engineering of Gerber to CAD, Training, Test System PC, Hardware, and Software Upgrades, and more.
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FEA and Strain Gauge Testing
Circuit Check began Strain Gauge Testing in 1999 when BGA/SMT technology started replacing PTH components, reducing strain levels was a reactive post fixture fabrication process. We quickly recognized that the “reactionary” process was neither efficient nor were we capable on knowing the lowest achievable strain levels. Our engineering team came up with visual tools utilized during design to easily identify areas of excessive probe force, though still not enough data was generated to identify the lowest possible strain. Finite Element Analysis software models the PCBA and test fixture and applies the pressures from test probes and board supports and indicates the micro strain level applied to the PCBA. Using the FEA software during our design process allows our engineers to modify fixture designs to attain the lowest possible micro strain before fabrication begins.
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Modal Exciters & Amplifiers
Experimental modal analysis, or modal testing, is a process for physically obtaining a math model of a structure’s dynamic properties. Modal tests identify a structure’s modal properties: natural frequencies, mode shapes, mass, stiffness and damping. Modal test results help troubleshoot resonant excitation from operating forces, validate and verify finite element models, predict the benefits of structural modifications, support design verification, and understand structural responses due to complex loading conditions.
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Structural Testing
Structural testing is used to verify the static strength, or fatigue strength, of a component by applying measured loads. Testing can be done to failure, to contractual requirements, or to validate finite element model predictions.
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Field Simulation Software
QuickField™
QuickField™ is a very efficient Finite Element Analysis package for electromagnetic, thermal, and stress design simulation with coupled multi-field analysis.
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FEA Software
Helius PFA
Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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Thermal Testing And Analysis
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.
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Electrical Grounding Analysis
GroundMat
SKM GroundMat is a program for substation ground grid design and analysis. It is designed to help optimize grid design or reinforce existing grids of any shape. It uses a general-purpose finite element algorithm for potential analysis and graphical facilities to validate ground system efficiency
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Detrenching Grapnel
The Detrenching Grapnel is manufactured from high tensile steel, suitable for withstanding the harsh offshore environments. The structure and material of the grapnel is tested using finite element analysis which is performed during the design phase. This simulates the various stresses and strains acting on the grapnel in a variety of differentseabed conditions and allowed for optimisation of the design.
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TRA-300 LED Thermal Resistance Structure Analyzer
Hangzhou Everfine Photo-E-Info Co., LTD
The TRA-300 accurately measures the thermal resistance, junction temperature, optical power, voltage, current and other parameters of LED packaging products.The heating and cooling curves of LED can also be obtained, and the integral and differential thermal structure functions can be obtained by establishing the finite element model.Through the structural function analysis of the TRA-300 special software, the fine thermal resistance structure of the LED (from the chip to the thermal resistance value of each package structure) can be obtained, so as to objectively evaluate the heat dissipation quality and thermal management level of the LED package products, and provide the best verification for the heat dissipation design of the LED.
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Correlation Analysis
EDM Modal Correlation Analysis allows the user to correlate two modal models; EMA and/or FEA models. Comparing the experimental data with that acquired through finite element analysis helps in validating the test results. Users can import the geometry model and mode shape data from FEA or EMA software.
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Composite Material Behavior Software
Helius Composite
Helius Composite software offers detailed information on composite material behavior without finite element analysis (FEA). Use Helius Composite to integrate materials into your designs.
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Structures
Ansys offers structural analysis software solutions that enable engineers of all levels and backgrounds to solve complex structural engineering problems faster and more efficiently. With our suite of tools, engineers can perform finite element analyses (FEA), customize and automate solutions for structural mechanics challenges and analyze multiple design scenarios. By using our software early in the design cycle, businesses can save costs, reduce the number of design cycles and bring products to market faster.
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Clamping Elements
Clamping elements from the LOCKED series provide a high level of safety. These ACE products clamp and decelerate loads and are suitable for perfectly controlled holding, both linear and rotary, in all processes.
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Elemental Analyzers
Bruker manufactures instruments for elemental analysis from 100% down to the sub-ppb trace level. Easy-to-use solution packages help customers in process and quality control to meet industry norms and standards including ASTM, DIN, ISO and FDA. Highest analytical accuracy and precision enable academic research from lab to field.
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Organic Elemental Analysis
Elementar Analysensysteme GmbH
Carbon, hydrogen, nitrogen, oxygen and sulfur are the basic elements of living nature. Their quantitative determination in the most versatile combinations of substances, the elemental analysis, is the origin and essence of the Elementar product portfolio.
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Force Sensor Elements
TE Connectivity (TE) enables OEMs to measure force using MEMS-based technology load cells. The same proprietary piezoresistive silicon strain gage technology used to measure pressure can also be configured into a reliable, low-cost package to measure force.
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Lab & Elemental Analyzers
We provide accurate and reliable total sulfur and total nitrogen measurement solutions with our ATOM Instrument lab and elemental analyzers. Our products are designed to ensure optimal analytical performance while maintaining ease of maintenance. Our analyzers use patented Excimer UV Fluorescence (EUVF) Technology incorporated into the analyzer which is then designed to allow easy access to every part of the instrument. We work with customers to provide equipment that will meet and exceed expectations and evaluate application requirements to optimize total sulfur measurement systems.
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Pressure Cooling Elements
Rugged cooling elements with corrosion resistance that allow your pressure measurement devices to operate accurately at high pressure and temperature conditions.
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Inorganic Elemental Analysis
Elementar Analysensysteme GmbH
The elemental composition of a material determines its properties. Elemental analysis is therefore essential for the characterization and quality control of materials that need to meet certain requirements.Elementar's user-friendly inductar® series for inorganic elmental analysis uses the high-temperature combustion method to determine elemental concentrations of carbon, sulfur, oxygen, nitrogen, and hydrogen and is the ideal solution for R&D, routine, and high-throughput laboratories.
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Thick Film Passive Element
GBR-181
GBR-181series resistors are made in a thick film technology, or ceramic substrates (Al2O3) - 96&). Thick film resistors are characterized by a higher stability, and lower noises than a typical carbon resistors. The whole of resistor is encapsulated with epoxy resin by fluidization process. GBR-181 series elements are used both for general, and professional applications. Other values of resistance, and tolerance (up to 0.1%) are available on request.
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Compact Low-Frequency Control Element
900-LFC
The 900-LFC Low-Frequency Control Element extends the response of mid-sized P.A. systems to 35 Hz, revealing the nuances of your mix, down to the deepest bass with total accuracy.
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Process Elemental Analyzer
NEX OL
Applied Rigaku Technologies, Inc
Featuring advanced third generation EDXRF technology, the Rigaku NEX OL represents the next evolution of process elemental analysis for liquid stream and fixed position web or coil applications. Designed to span from heavy industrial through to food grade process gauging solutions, the NEX OL is configurable for use in both classified and non-classified areas.
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X-ray Diffraction and Elemental Analysis
N8 HORIZON
The N8 HORIZON is a powerful tool for both high-end research and for multi-user facilities investigating a variety of nano-materials from solid bulks, to fibers, surfaces or biological samples.
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Force Sensor Elements
The STL Force Sensing Tension Links are a series of unique force sensors. The Tension Links utilize the internal strain gage process sucessfully and are used in bolts, load pins and flat load cells. The sensing element consists of a strain gage bridge circuit internally installed in a small hole along the longitudinal axis. This unique arrangement provides a most effective means for the protective sealing of the internal electronics while minimizing the adverse effects of extraneous torsion and bending loads.
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Very Low Frequency Control Element
VLFC
Think extremely low. With a range of 13-30 Hz—the lowest reach of any Meyer Sound speaker—the VLFC extends below the threshold of human hearing to let your audience feel the sound like never before.
