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Zynq Ultrascale+ MPSoC (ZU19/17/11EG) 3U-VPX Plug-in Module
iW-RainboW-G35V®
AMD Xilinx’s ZU19/17/11EG Zynq Ultrascale+ MPSoC64bit, 8GB PS DDR4 RAM with ECC (Upgradable)Dual 64 bit, 8GB PL DDR4 RAM (Upgradable)8GB eMMC Flash (Upgradable)3U VPX Connectors based on ANSI/VITA 46.30 (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B) based on VITA66.4
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s, 0 - 20mA, ±20mA) And 2 PCIe Mini Card Slots
IRU152-I
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*4 isolated analog input channels (16-bit, 250 kS/s, 0 - *20mA, ±20mA)*1 isolated COM port*1 isolated DIO (2-in/2-out)*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports LabVIEW versions later than 2016*Supports OPC UA
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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Qseven Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
Q7M311
The Q7M311 has adopted the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4GB (or optionally up to 8GB) DDR3L memory onboard and 32GB eMMC flash memory (optional). With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK350A (SD card / eMMC tester)
This product is compatible with SD Memory Card Physical Layer Specification Version 3.01. Supports UHS-I interfaces (SDR12,25,50,104,DDR50). There is a SpeedClass measurement mode that measures SpeedClass that supports SDXC, and a simple performance measurement mode that performs sequential / random access to any address. In addition, the SD card access library (for Visual Studio) is open to the public, and any command can be executed on the SD card in any pattern.
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COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Universal Automated Programming System
4900
The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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IP Solution
eMMC 5.1
Demand for mobile content capacity and bandwidth for video, pictures and music is ever increasing. To address this demand in the next generation of smartphones, tablets, and portable devices, the eMMC 5.1 Specification from JEDEC, improves the current HS400 speeds operating at 3.2Gbps, with "command queuing" making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.
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SD Card
SD Card v.3.0 / eMMC v.4.51 IP Family
Designed for embedded applications that require high performance, small form factor, and high storage capacity, eMMC provides the support for embedded mass storage memory on embedded host systems. The eMMC protocol simplifies the access to NAND flash memories (such as MLC) to the host by hiding the functional differences among suppliers. Compliant to the latest JEDEC eMMC specifications, Arasan’s eMMC IP supports power-on-booting without the upper level software driver. The explicit sleep mode allows the host to instruct the controller to directly enter the sleep mode. The interface supports interface voltage of either 1.8V or 3.3V.
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SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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QSeven
ROM-7510
*TI Sitara AM5728 Dual core cortex-A15 1.5GHz high performance processor*Onboard DDR3 memory 2 GB and eMMC Flash 8 GB*Support 1 LVDS, 1 HDMI, 1 USB2.0 OTG, 4 USB2.0 HOST, 1 USB3.0,2 UART, 1 CAN, 1 SATA, 2 I2C, 1 I2S, 2 PCIE 1 lane,*Operating temperature 0 ~ 60 °C / -40 ~ 85 °C*Supports Linux Yocto
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SMARC V1.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio, CAN, MIPI And PCAM
SCM120
*SMARC 1.0 (82 x 50 mm)*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android 4.3*Audio
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Automated Programmer Superpro Sb05
※ Four Pick & Place nozzles, Eight socket pressing actuators and 2 tape feeders※ High throughput up to 2400UPH※ Embeded with eight ultra-high speed programmers SuperPro / 7500, each with up to 4 sockets, totally 32 sockets. Throughput 60 times higher than SuperPro / SB01 for eMMC devices※ Supports over 80,000 devices from over 300 IC manufacturers※ Supports tray, tape and tube input and output. Supports laser and ink marking※ Short change-over time※ Intelligent s/w cuts learning curve and setup time, makes task management an easy job※ Compact sizeHigh throughput：4 nozzles, 8 independent socket pressing actuators and 2 tape feeders. Up to 2400 UPH for devices with programming time less than 50 sec. Throughput 0.6 to 60 times higher than SuperPro/SB01, especially higher for large capacity devices like eMMC, NAND /NOR FLASH,SPI FLASH. Suitable for both small and large capacity devices. Prog. Time (S) 50 60 120 180 240 300 UPH (unit per hours) 1600 1600 840 560 420 336 Accurate positioning：Equipped with high performance servo system, precise CCD cameras and vision algorithm for device alignment and sockets / pick & place spots positioning.High performance programmers： 8 ultra-high speed universal gang programmers SuperPro/7500 resident. Each with up to 4 sockets, totally up to 32 sockets in the system. Supports up to 100,000 devices from over 300 IC manufacturers and growing.Varied I/O devices：Supports tray, tape and tube input and output. Supports laser and ink marking. Supports packing conversion and can work as a packing conversion machine alone.Short change-over time：I/O devices and socket adaptor are easy to be changed when programming task need to be changed. Socket positioning can be performed automatically. Projects can be loaded automatically with barcode scanning.Powerful and intelligent software：Setup data saved for next operation, log file and statistic reports for quality and yield traceability, flexible sockets prohibition strategy promises high yield rate for unattended operation, graphical user interface cuts learning curve, prevents chip over-lapping by socket checking before chip placing.Remote Control：Remote project loading, quality monitoring, volume control, file security.
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Qseven V2.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio And CAN
Q7M120
*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
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QSeven
ROM-7720
*NXP i.MX8 QuadMax 8-Core Processor with 2 Cortex-A72, 4 Cortex-A53 and 2 Cortex-M4F*Multi OS support in Ubuntu/Debian/Yocto Linux and Android*64-bit LPDDR4 4GB*4K h.265 decoder, HD h.264 encoder*Onboard eMMC Flash 16GB, boot selection from SPI/MMC/SD or SATA*3 USB 3.0 with OTG, Dual lane MIPI Camera*Yocto, Android, QNX OS support
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Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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Fanless Edge AI System With NVIDIA® JETSON™ TX2 Series SoM, 1 HDMI, 2 GbE LAN, 2 USB, 2 COM Or 2 CAN And 12 Or 24 VDC
AIE500-901-FL
The AIE500-901-FL is an advanced Artificial Intelligence embedded system for edge AI computing and deep learning applications. The high-performance embedded system employs an NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM® A57 processor; NVIDIA® Pascal™ GPU with 256 CUDA cores; and 8GB of 128-bit LPDDR4 memory. To withstand the rigors of day-to-day operation, the AIE500-901-FL has an extended operating temperature range of -30°C to +60°C and vibration of up to 3 Grms with its strong construction. This fanless Artificial Intelligence edge system is dedicated to achieving operational excellence, efficiency, reliability in smart manufacturing and intelligent edge applications. The edge computing device provides solutions as Edge AI embedded system, specifically designed for video analysis, object classification, computer vision, quality control and more. Under the ultra-compact enclosure design, the AIE500-901-FL comes with 32GB eMMC onboard and is equipped with one M.2 Key M 2280 SSD slot with PCIe and SATA signal and one Micro SD slot for massive data processing and AI applications. Besides, this reliable embedded system has one full-size PCI Express Mini Card slot and one SIM slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections.
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COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor
CEM310
The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).
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SMARC V1.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC,1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN, MIPI And PCAM
SCM120-120-EVK
*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Open GL ES2.0*Linux3.0.35/Android 4.3*Audio
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO 2-in/2-out (Source Type) And 2 PCIe Mini Card Slots
IRU131-SO
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*1 isolated COM port*1 isolated DIO 2-in/2-out (source type)*Power input range of 9V to 48V DC with terminal block*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports OPC UA
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, 1 COM, 1 LAN, DIO (4-in/4-out) And Optional CANbus
Agent200-FL-DC
*RISC-based (i.MX 6UltraLite) processor 528 MHz*256MB DDR3 SDRAM onboard*4GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi or 3G/4G)*4 digital inputs and 4 digital outputs*Power input range of 9V to 48V DC with terminal block*Embedded Linux (Yocto) operating system*Fanless and compact design*Wide operating temperature range from -40°C to +70°C
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SMARC V2.0 SoM With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB RAM, 64GB EMMC, CAN, MIPI CSI/DSI And HDMI 2.0
SCM180
The SCM180 is a SMARC v2.0 system on module with a choice of quad- or dual-core Arm® Cortex®-A53 processors. The ultra low power, high performance, RISC-based module measures only 82 x 50 mm and utilizes the powerful i.MX 8M processor. Its scalability, optimized pinout schematic and low profile design offers high level of versatility to help system integrators drive their important projects forward. The SCM180 is unique among other SMARC modules of its kind because it features Trusted Platform Module (TPM) for optimum security. With a discrete, dedicated microcontroller designed to support hardware encryption and decryption, the SCM180 delivers enhanced security for an added layer of protection. It also offers a choice of operating temperature ranges and can operate reliably in harsh environments. The SCM180 is suitable for a wide range of smart, portable/mobile-integrated IoT applications including robotics, automotive, factory automation, smart agriculture, casino gaming, medical, retail, surveillance and more. With its NXP artificial intelligence core technologies-enabled capabilities, the SMARC module can be programmed to support smart automation and machine-learning application requirements.
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Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Robust Din-rail Fanless Embedded System With RISC-based (i.MX 6) Processor 4 COM, 2 CAN Bus And DIO
rBOX630
*Fanless design*RISC-based module (i.MX 6) processor*1 GB DDR3 SDRAM onboard*4 GB eMMC onboard*Completed industrial AP development software*Wide range DC power input (12 - 48V) with terminal block*Ready-to-run embedded Linux operating system*Wide temperature operation of -40°C ~ +70°C
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Qseven V2.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC, 1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M120-120-EVK
*Ultra low power consumption Cortex™-A9*High flexibility Qseven v2.0 compliant design*2 CAN 2.0B*18/24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android4.3*Audio
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SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
