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Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Solid-State High Power Amplifier 18 - 26.5 GHz
AMP4065LC-2
Exodus Advanced Communications
Designed for EMI/RFI, lab, and general communication applications. Exodus Broadband SSPA product feature GaN, GaAsFET discrete and Chip & Wire Hybrid technologies covering one octave through decades frequency ranges from Operating Frequency Range 18.0-26.5 GHz.
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Analyze RTL
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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PCI Evaluation Board
BCM91250E
The BCM91250E is a full-length PCI evaluation board with the SiByte® BCM1250 dual-processor System on a Chip. The board is designed for software development and for developing PCI applications that require high-performance processors.
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SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
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Production Programmers
eltek offers both traditional gang programmers and modern stand-alone models for production cluster setups. Traditional gang programmers come with four independent sockets that allow chips to be programmed concurrently.Recent trends have shifted from gang programming to cluster setups. Cluster setups consist of multiple stand-alone programmers operated by one operator for enhanced efficiency and cost-savings during production.
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Multi-Contact Wedge
The GGB Industries MULTI-CONTACT WEDGE allows for more chip design flexibility because it is custom configured to your circuit. Four Wedges can be used at the same time to probe a complete chip.
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Laser Diode
Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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Manual Label-Free Molecular Interaction Analysis Machine, Flexible Research Platform
OpenPleX
Designed to meet the demands of biologists, biochemists and biophysicists, the OpenPlex is a flexible surface plasmon resonance imaging system.OpenPlex is your companion for the development of label-free and multiplexed bio-assays and molecule detection. It is a robust and compact system designed for simple use and high versatility. Its open format, dedicated sensor chips and manual operation enable numerous types of experiments to be explored without compromise, covering chemistry, biochemistry, physico-chemistry and biomolecular interactions.
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SMT Rework Station
RW1210
Safely and precisely rework SMD, BGA, or LED chips. This all-in-one solution covers rework needs for even the most complex, densely populated PCBAs. Yet it is easy to use, enabling technicians to quickly master delicate alignment, placement, and heating controls.
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PIN Diodes
The SemiGen SGP7000 series of PIN Diodes are processed with a high-resistivity epi that have intrinsic layers that range in thickness from 4 micron to 200 micron depending on performance specifications. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures that provide low punch through voltages and minimize autodoping. They are available as chips or in your choice of packages.
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NVM Express
NVM Express is a scalable host controller interface designed to address the needs of Enterprise, Data Center and Client systems for supporting chip-to-chip, board-to-board, adapter and distance solutions. The protocol can efficiently use interconnect and fabric technologies such as PCI Express, Ethernet and Fibre Channel. Teledyne LeCroy provides protocol analysis, emulation, exerciser and other test equipment to service all NVMe storage applications.
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Infrared Moisture Analyzer
LD-LIMA-A10
Infrared Moisture AnalyzerLD-LIMA-A10is an online, fast, continuous measurement and non-contact measurement device with measurement distance range of 20 to 40 cm. It provides automated control and 4 to 20 mA current signal. This IR Moisture Analyzer emits different wavelengths of infrared light (4, 6, 8, 10 beam) to calculate the moisture content of the measured object. Designed with long-life high-speed brushless motor, imported high response infrared sensors, information processing chip FPGA + DSP + ARM9 combination, to attain real time data, improved stability and precision.
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IR Linear and 2D Sensor Array Modules
Excelitas offers Linear and 2D IR Imager Arrays based upon our Thermopile Technology. All Arrays are provided as plug-and-play Modules featuring a sensing chip, robust metal housing with focusing lens, a PCB with microprocessor for calibration and bus interface and a quick connector for streamlined plug-and-play integration. We offer 8-pixel, 16-pixel and 32-pixel Linear IR Imager Array Modules for field-proven effectiveness in scanning presence detection, non-contact temperature measurement, smart-home products, and office electronics. Custom solutions also available upon request.
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16 Channel Multihit TDC (25 ps)
V1290N-2eSST
The V1290N-2eSST is a 16 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB is 25 ps (21 bit resolution, 52 µs FSR). The module accepts NIM inputs..
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GO-NR1000 Near-Field Goniophotometer
Hangzhou Everfine Photo-E-Info Co., LTD
Suitable for LED light source, LED chip, module and other small light source, the principal function includes: spatial light intensity distribution curve, spatial color distribution curve, iso-lux curve, total luminous flux, effective luminous flux, spatial luminance curve, etc.The test data can be saved as IESNA (*.ies), CIBSE (*.cib), EULUMDAT (*.ldt), CIE (*.cie), CEN (*.cen) and other formats, which can be directly used as the input data of international general lighting design software. Spatial luminance data can be imported into near-field lighting generation software to generate light data that can be imported into third parties (TracePro and LightTools).
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COM Express Type 6 Compact Module With 5th/4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor
CEM881
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Imaging
SLA64 (Preliminary)
A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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Memory Testing
C.C.P. Contact Probes Co., LTD.
Standard and Custom test solutions for RAM, Flash and many other memory chips.
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Balanced Measurements
The unbalanced interface of a VNA is not very well suited for measuring balanced circuits like antennas, transmission lines or chip impedances. In fact it is nearly impossible to get a decent calibration on a balanced 2-port measurement using coax cables.
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Electrical Receiver Conformance Test Application for IEEE 802.3bs/ cd
M8091BSCA
IEEE 802.3bs receiver test application for 200GAUI-4 and 400GAUI-8, covering chip-to-module, chip-to-chip, backplane, and copper cable interconnects.
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2D CMOS Image Sensor
Lince6M5
Lince6M5 is a single chip, fully digital, high speed CMOS active pixel sensor which is designed for maximum flexibility. It has excellent performance in a large variety of applications, ranging from low noise, high dynamic range surveillance, to high speed slow motion analysis, including high resolution machine vision applications. Lince6M5 incorporates a high speed 6.5MP CMOS active pixel image sensor providing both global and rolling electronic shutter, as well as High Dynamic Range (HDR) features. The sensor array utilizes active CMOS pixels with pinned photodiodes to deliver high image quality whilst maintaining the size, cost, and integration advantage of the CMOS technology.
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Probe Cards
PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & Wireless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Mitsubishi, Honda, Hyundai,.. ,most of the global IC design houses with DTV chips, and also military entities in NATO. With the same customer-proved Software Defined Radio architecture, we have introduced Wi-Fi, Bluetooth tester since 2014. It will soon cover other current/future wireless standards such as 4G/LTE, 802.11ax, 802.11ah, etc.
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RFSoC Board
VP431
VP431, the next generation of our highly successful VP430, is a 3U VPX commercial off-the-shelf direct RF processing system that features the 3rd-generation Xilinx Radio Frequency System-On-Chip (RFSoC). The VP431 maximizes I/O channel density, reduces the radio frequency signal chain complexity, and allows for heterogeneous processing capability.
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Clock Generation Devices
Analog Devices offers ultralow jitter clock generation products for wireless infrastructure, instrumentation, broadband, automatic test equipment, and other applications demanding subpicosecond performance. Our clock products are ideal for generating the high speed, low noise clock signals required to clock high performance analog-to-digital converters (ADCs) and digital-to-analog converters (DACs). ADI clock ICs integrate PLL cores, dividers, phase offset, skew adjust, and clock drivers in small chip scale packages.
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R&D Solutions From Teledyne LeCroy Quantum Data
Teledyne LeCroy offers a wide variety of products for engineers in the R&D lab. R&D testing entails functional testing for source and sink devices as well as interoperability testing for diagnosing problems between A/V devices. Solutions for silicon chip manufactures are available for both source and sink devices. Quantum Data solutions are available for testing HDMI, MHL, DisplayPort, HDBaseT and 3G-SDI products.
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Mass Flow Controllers for Gases
Sensirion''s mass flow controllers are characterized by fast and accurate control of gas flow over a wide dynamic range. Based on the innovative CMOSens Technology, the heart of these mass flow controllers is a calorimetric microsensor (MEMS), which is integrated with the complete signal conditioning electronics on one single chip. While the flow is measured using the thermal measurement principle, efficient control is provided by an analog controlling circuit. This unique integrated technological approach results in excellent performance and reliability - at a very attractive cost.
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Compact Goniophotometer
LSG-1200A
The compact goniophotometer of LSG-1200A is used to measure the luminous intensity distribution curve, intensity data, spread angle and other parameters for Chip LED, LED Module, LED Spotlight and all other light which beam angle is no more than 180 degree. • Meets the requirements of IEC, CIE and LM-79 standards • Measures beam angle automatically: staple half intensity angle as well as 1/4 intensity angle, 3/4 intensity angle and 1/10 intensity angle which meets the special requirements. • Measured data is matched with international standard form (IES) and can be applied for lighting design by other lighting design software such as DiaLux • LSG-1200A has included a dark room, measures the maximum size of lamps: 180mm • Test range of luminosity: 0.1～30,000lx. Test accuracy of detector: Class 1 • The distance between the tested lamp and detector is 316mm/1000mm • Angle interval: Horizontal angle: 1°/5°/10°/15°/22.5°/30°/45°/90°, Vertical angle: 0.5°/2°/1.5° • The LSG-1200A horizontal automatic rotating on 0°~360° and Vertical automatic rotating on -90°~+90° • Test accuracy of angle: ±0.2° Work with the follow instruments as a System
