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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
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64 Channel Multihit TDC
V1190B-2eSST
The V1190B-2eSST is a 64 channel Multihit TDC, housed in a 1-unit wide VME 6U module. The unit features High Performance Time to Digital Converter chips developed by CERN. LSB can be set at 100 ps (19 bit resolution, 52 µs FSR), 200 ps (19 bit, 104 µs FSR) or 800 ps (17 bit, 104 µs FSR).
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Imaging
SLA64 (Preliminary)
A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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Breakout - General Purpose USB to GPIO+SPI+I2C
FT232H
This chip from FTDI is similar to their USB to serial converter chips but adds a ''multi-protocol synchronous serial engine'' which allows it to speak many common protocols like SPI, I2C, serial UART, JTAG, and more! There''s even a handful of digital GPIO pins that you can read and write to do things like flash LEDs, read switches or buttons, and more. The FT232H breakout is like adding a little swiss army knife for serial protocols to your computer!
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Radar Core Chips
Macom Technology Solutions Holdings Inc.
Multifunction GaAs and Silicon MCM designed for communication radar and weather applications. MACOM Core Chips deliver a complete transmit/receive function with phase and amplitude control.
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SDIO Wi-Fi Module
SX-SDMAC
This Wi-Fi SDIO module is a low-power, single-stream solution with 802.11a/b/g/n/ac support based on the QCA9377 System-on-Chip from Qualcomm Atheros. This module supports Wave 2 MU-MIMO (Client), which increases the overall WLAN system performance by 3X compared to 11n. The module’s small form factor, rich features, and low power make it perfect for portable devices.
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Data Acquisition & Control
Blue Chip Technology have been designing and manufacturing data acquisition and control boards since 1986. The current range of boards have digital and analog IO and an excellent record for reliability in the harshest of environments.
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Electrical Property Measurement
Materials Analysis Technology Inc.
This technology is used to identify the electrical characteristics, such as resistance, capacitance and inductance, of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
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Coating And Finish Durability
Our capabilities: Adhesion. Impact Resistance. Gravelometer. Chemical Resistance. Cyclic Corrosion. Hardness. Chipping. Resistance. Water Immersion
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PCI Express Digital I/O Card With Counters And IRQ
PCIe-DIO-24HC
This product is a x1 lane PCIe DIO board with basic DIO, Counter/Timers and interrupt generation capabilities. The card uses an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C is further broken into two 4-bit nybbles via software, configured as either inputs or outputs.
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32+2 Channel 12bit 5 GS/s Switched Capacitor Digitizer
V1742
12 bit @ 5 GS/s, 1-unit wide 6U VME64 module, Switched Capacitor technology based on the DRS4 chip (designed at Paul Scherrer Institute) 1024 capacitor cells per channel (acquisition window of ~ 200 ns @ 5 GS/s)
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PCI Express Digital I/O Cards With Counters And COS Detection
PCIe-DIO-24DCS, PCIe-DIO-24DC, PCIe-DIO-24DS, and PCIe-DIO-24D,
This product is a x1 lane PCIe DIO board available in four models ranging from basic DIO to advanced COS detection and Counter/Timer capabilities. The card emulates an 8255 compatible chip, providing 24 DIO lines. The DIO lines are grouped into three 8-bit ports: A, B, and C. Each 8-bit port is configured via software to function as either inputs or outputs. Port C can be further broken into two 4-bit nybbles via software and configured as either inputs or outputs.
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mmWave Sensors
The world’s most precise millimeter wave sensor available today on a single chip. The world’s most precise millimeter wave sensor available today on a single chip. TI’s CMOS single-chip sensors integrate an RF front-end with a DSP and MCU.
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TMR Current Sensors
MultiDimension Technology Co.,Ltd.
An open-close current transducer, high sensitivity and signal-to-noise ratio TMR chips are used in the design, which based on Tunneling magneto resistance effect. The transducer has a built-in temperature compensation and nonlinear compensation circuit, which can accurately measure DC, AC and pulse current. The transducer has many benefits ,such as high precision, wide bandwidth, low power consumption, excellent isolation performance and so on. Besides, the design of open-close structure makes it easier to install and unload.
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Reflection Meter
RC-088
This instrument is a special equipment for measuring the reflectivity of rearview mirror (or similar product) of motor vehicle. The product composes intelligent measuring instruments, optical integrating sphere, parallel lamp, standard light source, constant current source etc. It is easy to operate，it can measure the reflectivity quickly and accurately. On instrument structure, it adopts standardized modulation design. It takes latest single chip as its digital central processing element. After the measuring signal is converted by modulus, CPU will do some computation and compensation. The instrument can display the reflectivity of device which is measured in rear time. It operates simply and quickly, the indication is direct and accurate. It’s good for quality examination &control in the production scene as well as laboratories. This product has the convenience &quick demarcation way, can meet requirement of different occasion. It is applicable for measuring light reflection on mirror and not mirror parts.
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Automotive System-on-Chip (SoC)
R-Car
"R-Car" is the nickname for Renesas' system-on-chip (SoC) family for car information systems designed for the next-generation of automotive computing for the age of autonomous vehicles.
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Structural Test ICP® Accelerometers
Conventional structural test data systems use few to several hundred sensors. Cables bundles can be complex and confusing resulting in setup errors. Sensors with TEDS (Transducer Electronic Data Sheet) allow for an internal sensor digital chip to store sensor information. This information contains descriptive identifiers that when connected to a TEDS compatible signal conditioner or data system, reads the descriptive information and automatically aligns the data system. Human error is minimized, reducing time consuming data verification or re-test. The Series 333 ICP® accelerometers, and their accessories, are designed to address the needs of multi-point modal and structural test measurement applications. This equipment was developed in conjunction with the world renowned University of Cincinnati Structural Dynamics Research Laboratory and proven in real-world testing situations. The PCB 333 Series accelerometers delivers rapid system setup, reduces human documentation errors, maintains calibration data of each sensor, allows for “Plug-and-Play” installation, reduces overall test time lowering project test costs.
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Molded Interconnect Subtrate
A substrate interposes between an IC chip and a motherboard to enable the IC chip to communicate with the motherboard effectively. Typically, the IC chip is attached onto the substrate and assembled into an IC package before connecting to the motherboard. It is an essential part of the IC package and is responsible for a successful packaging process. Also, it plays an important role in making the IC chip to become a real product and a real solution for end customers. In the past years, semiconductor technologies were highly driven by PC applications which follow Moore’s law in technology migration. In recent years, the emergence of mobile applications increasingly, become the main driver in the semiconductor industry. These mobile applications requires a new kind of substrate that have ability for making IC packages with smaller form factor, thin profile, better thermal, mechanical and electrical performance.
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68-Pin PLCC with Die Flipped-to-68-Pin PGA for 87C196 IC and Others
68-304538-10
68P PLCC WITH DIE FLIPPED TO 68 PGA FOR 87C196 IC AND OTHERS. Correct-A-Chip technology solves problems associated with the use of alternative ICs (due to availability, obsolescence, need for better performance, etc.) by eliminating the need for new PCBs.
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Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Chip Obsolescence Solutions
Solve component obsolescence problems with an Ironwood adapter and an alternate device. Adapters convert the pinout of an alternate device to maintain compatibility with an existing footprint – no need to redesign a new circuit board. Very often, these adapters (called Package Converters) are a simple 1:1 pin mapping from the new package to the old. Here are a few examples of package converters and how they can solve chip obsolescence issues.
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Semiconductor Test Equipment
Wewon Environmental Chambers Co, Ltd.
Probe card manufacturing need the semiconductor test equipment. When we designed the thermal testing equipment, Only some commonly used test items are packaged into the IC tester, and the logic function of the verification chip is implemented in a fixed test mode. But as chip products diversify, Some thermal inducing system can no longer do it alonehttps://www.wewontech.com/semiconductor-test-equipment/
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KV CAPS
200 V
Macom Technology Solutions Holdings Inc.
The MACOM KV CAPSTM Si high voltage capacitors feature very high working voltage ratings, very low loss and excellent stability by virtue of their novel internal construction and very high-quality dielectric layers. These capacitors are available as unpackaged chips. The chips have gold bonding surfaces on both terminals to enable excellent bonding and minimum contact resistance.
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FMC Quad ADC 16-bit @ 1 GSPS and Quad DAC 16-bit @ 2.8 GSPS
FMC231
The FMC231 is an FPGA Mezzanine Carrier (FMC) per VITA 57 specification. The board has quad ADC (the ADC chips are dual channels) and quad DAC (the DAC chip is quad channel). The FMC231 utilizes TI ADS54J60 (option for ADS54J69) providing 16-bit conversion rates of up to 1.0 GSPS and a DAC DAC39J84 providing 16-bit conversion rates of up to 2.8 GSPS.
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Computational Lithography
ASML's industry-leading computational lithography products enable accurate lithography simulations that help to improve chip yield and quality
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Intelligent Power Switches
ST offers a series of intelligent power switches (IPS) for high-side and low-side configurations. These devices integrate the control section (logic interface, drivers, diagnostic and protection features) and the power stage on the same chip, with benefits in terms of compactness, increased system reliability and cost effectiveness.
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Embedded Boards
UltraZed Family
Embedded boards are boards with processors, multiple integrated circuits, interfaces and other essential components assembled on it to serve a dedicated function. Embedded boards comprise multiple technologies, including processors, core logic, networking, connectivity, and multimedia components to provide functionality and performance for embedded system design applications. Embedded boards and solutions are normally employed to ensure a faster time to market for the developer. Applications of embedded systems vary from tiny portable devices, to large commercial and industrial installations, and even largely complex systems like medical or military or aviation purposes. Embedded boards can have single MCU chip or multiple MCUs depending on the complexity of application.
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Anti-Surge High Power Thick Film Chip Resistors
Panasonic Industrial Devices Sales Company of America
Anti-Surge High Power Thick Film Chip Resistors by Panasonic
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Single Phase Multi-rate Static kWh Meter
SY 1035
Hong Kong Songyang Industrial Ltd.
Adopt ADE7755 measurement chip. High accuracy class. Large overload times. Can sum up the absolute value of positive and negative energy. Record power energy of this month, last month, and the month before last.
