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Chip
Passive or active components test and their interconnected circuitry in silicon or germanium.
See Also: Integrated Circuit, IC
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Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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3U OpenVPX High Density Multifunction I/O Board
68CB6
The 68CB6 is a Configurable Open Systems Architecture™ (COSA®) 3U OpenVPX™ board that is preconfigured with 10 different “inboard” I/O, measurement and communication functions. This Combination-function Board (CB) provides a full suite of some of the most common & useful function interfaces supporting many different applications. The 68CB6 features a wide but dedicated selection of functions: Standard Functionality Discrete I/O (DT1); Successive Approximation Register (SAR) ±100 V Analog-to-Digital (AD); Isolated High Voltage Analog-to-Digital (ADF); ±10 V Digital-to-Analog (DA); Thermocouple (TC1) or Resistance Temperature Detector (RT1); Full-bridge Strain Gauge (SG1); Transmission/gear box Chip Detection and Fuzz Burn (CD1); LVDT-to-Digital linear (LD6) displacement (position) measurement, AC Reference Source output (AC2); CAN bus communication (CB8). The 68CB6 offers unparalleled programming flexibility, a wide range of operating characteristics, and a unique design that eliminates the need for external intermediate circuit considerations such as pull-up resistors or mechanical configuration jumpers. Inboard functions are software controlled and memory addressed, accessed in similar COSA® modular fashion to maintain seamless common NAI Software Support Kit & API/library structures.
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Big Easy Driver
The Big Easy Driver, designed by Brian Schmalz, is a stepper motor driver board for bi-polar stepper motors up to a max 2A/phase. It is based on the Allegro A4988 stepper driver chip. It's the next version of the popular Easy Driver board.
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Digital Color Camera for Microscopy
LC30
The LC30 is a 3.1 megapixel digital color camera for microscopy that combines versatility with performance. The LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications. The Olympus LC30 color camera for microscopy combines versatility with performance. With up to 37 frames per second (fps), faithful color reproduction, full integration into Olympus imaging platforms, and an excellent cost-performance ratio, the LC30 is the ideal entry-level microscope camera for quality bright-field imaging － suitable for material science applications.. The sensitivity and frame rate of the 3.1-megapixel CMOS chip can be increased using various binning modes, resulting in easy observation and focusing. The LC30 camera can be quickly and easily mounted on all microscopes equipped with a standard C-mount adaptor, and requires only a single USB 2.0 cable for high-speed data transfer and power supply. Its complete integration into the OLYMPUS Stream imaging platforms helps ensure the seamless interaction of microscope, camera, and additional devices, delivering intuitive and efficient operation.
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Spectrometer - OSA
HighFinesse optical spectrometers LSA and HDSA are designed to analyse the multi-line or broadband spectrum of (un-)known light sources like cw and pulsed lasers, gas discharge lamps, super luminescence diodes, semiconductor laser diodes and LEDs. They are suitable to analyze the spectrum of telecom signals, resolve Fabry-Perot modes of a gain chip, and produce a spectral measurement of gas absorption.
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500-1000W AC Power Source
CX-P150
Shenzhen Chuangxin Instruments Co., Ltd.
The AC power source is made by adopting microcomputer processing chip and high power device. It provides a stable pure sine wave and has voltage,
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Laser Diode
Is a Polarization Maintaining CWDM Coaxial DFB-LD for CWDM analog communication, CATV return-path, laboratory instrument, and R&D applications. This cost-effective, high reliability DFB laser chip has a selectable wavelength with range between 1270 nm to 1610 nm. The versatile DFB-CWDM also features a built-in InGaAsP monitor photodiode, built-in optical isolator and 4-pin coaxial- pigtailed package, single mode coupling, and an FC/APC connector. Contact Optilab for more information.
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IR Linear and 2D Sensor Array Modules
Excelitas offers Linear and 2D IR Imager Arrays based upon our Thermopile Technology. All Arrays are provided as plug-and-play Modules featuring a sensing chip, robust metal housing with focusing lens, a PCB with microprocessor for calibration and bus interface and a quick connector for streamlined plug-and-play integration. We offer 8-pixel, 16-pixel and 32-pixel Linear IR Imager Array Modules for field-proven effectiveness in scanning presence detection, non-contact temperature measurement, smart-home products, and office electronics. Custom solutions also available upon request.
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SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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K-Band Silicon SATCOM Rx Quad Core IC
AWS-0102
The AWS-0102 is a highly integrated silicon quad core IC intended for satellite communications applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain with a noise figure of 3.4 dB. Additional features include gain compensation over temperature and temperature reporting. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 56 lead 7x7 mm QFN for easy installation in planar phased array antennas.
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48-CH DIO & Timer/Counter Cards
cPCI-7248/7249R
- PICMG 2.0 Rev 2.1- 48-CH digital TTL/DTL input/output- Emulates 4/2/1 industry standard 8255 PPI (mode 0)- Direct interface with OPTO-22 compatible I/O modules Output port status read back- On board 8254 timer/counter chip
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Radio Module (2x2)
SX-PCEAC2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Probe Series
CAPELLA Series
MPI Photonics Automation is the industry leading provider of turnkey test solutions for the LED / Mini LED manufacturing industry. With more than 10,000 MPI probers installed worldwide, the CAPELLA series of probers have a proven track record of superior performance and reliability. The CAPELLA series probers support electrical and optical characterization of all LED product types (Vertical chip, Lateral chip, Flip-chip) from wafer to packaged die level. Whether you need a high-performance, cost-effective or specialty prober system, MPI PA has the most comprehensive range of LED wafer/chip probers to meet your exacting requirements.
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Rectifier Diodes
Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead. The small signal 0603, 1005 and 1206 Chip Diodes are lead free with Cu/Ni/Au plated terminations while the other packages (SMA, SMB, SMC, 1408, 1607, 2010, 2419, 8L NSOIC, 16L NSOIC, SOT23, SOT23-6, 16L WSOIC) use 100% Tin terminations. All Bourns® diodes are compatible with lead free manufacturing processes, conforming to many industry and government regulations on lead free components.
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Cut Susceptibility Tester
King Design Industrial Co., Ltd.
*Equipment conforms to IEC61730 MST12 specification.*Pre- or post-round can be selected for control wiring connection.*With weights block’s positioning pin is removed before test; and is inserted in the rear positioning hole for the remaining time.*Equipped with rings at both front and rear end; used to connect a rope and control the driving direction.*Use replaceable special cutting chip.
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Peak Track Instrument
90323
The model 90323 Peak Track Instrument is a general-purpose sensor readout device designed to complement our AutoID line of load cells and torque sensors. AutoID is a term that indicates that the calibration information for a sensor is stored on a chip inside the sensor’s connector. AutoID allows true “plug and play” operation without manual calibration procedures of any kind. The unit is also equipped with a 2-line alpha-numeric display and single button operation for simplicity.
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USB-8452, 3.3 MHz I2C, 50 MHz SPI I2C/SPI Interface Device
781964-02
The NI USB‑8452 is a master interface for connecting to and communicating with inter-integrated circuit (I2C) and serial peripheral interface (SPI) devices. With plug‑and‑play USB connectivity, the USB‑8452 is a bus-powered, portable solution to communicate with consumer electronics and integrated circuits. It also includes eight general-purpose digital I/O lines for a variety of applications, such as configuring the address of I2C devices, toggling LEDs, or strobing convert and data ready lines common to analog converter chips. You can physically place the USB‑8452 more closely than PCI interfaces to I2C/SPI devices, which reduces I2C bus length and minimizes noise problems. Additionally, the interface provides +5 V and GND to power circuits with no external power supply.
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Development Kit
The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Radio Module with PCIe Card
SX-PCEAC2
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the QCA6174-5, which features 2x2 wave 2 MU-MIMO technology. It is a dual-band 802.11 a/b/g/n/ac module with Bluetooth support which is designed for devices that require wireless connectivity in a small form factor combined with high performance with throughputs reaching up to 867Mbps.
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Interface RS-232
The RS-232 specification allows for reliable data transmission from one transmitter to one receiver at data rates of up to 20 kbps over relatively short distances (up to 50 feet). On more recent RS-232 transceiver chips, data rates of up to 1 Mbps are achievable over shorter distances (up to 5 feet). The most common applications for RS-232 transceivers are computers and peripherals, mobile phone data cables, and diagnostic data ports.
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Imaging
SLA64 (Preliminary)
A 1 x 64 element silicon-based thermopile array. Each active area is 0.45mm x 2.0mm with a time constant of 42ms and a low Temperature Coefficient of Responsivity of -0.06%/C. It is packaged in a 68-pin QIP. Includes internal 30k 5% NTC chip thermistor provides ambient package temperature measurement. See Thermistor Options p/n: MT04.
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COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
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Synchro to Digital-Resolver to Digital Converters
MRDC
Computer Conversions Corporation
Computer Conversions’ MRDC64-3 is a miniature single chip solution for providing a complete 1 x 64 speed resolver interface into any demanding industrial or military application.
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Model MCPC: Lab Moisture Analyzer
AM-MCPC-RS
PC-Based lab/production moisture analyzer connects through RS-232 Serial Port. Designed for nuts, granules, powders, pellets, chips, or flakes. Includes two sample cups, MCPC-RS test chamber, windows PC-based software, and more. See product link for complete features and minimum computer requirements.
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Digital I/O Card w/CoS IRQ
mPCIe-DIO-24S
The mPCIe-DIO-24S is a type F1 PCI Express Mini Card (mPCIe) and optional cable assembly (D-Sub 37-pin Male connector) designed to be easily panel-mounted in any application environment. It uses the high speed PCI Express bus to transfer digital data to and from the card. The digital I/O is compatible with 8255 PPI chips making it easy to program.
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Value Added Services
For over three decades, Teledyne RF & Microwave has built a strong heritage delivering advanced value added services to the military, space and industry sectors of aerospace. With test capabilities up to 40 GHz, Teledyne offers chip and wire assembly of products ranging from single die through complex hybrids which can then be submitted to a combination of customer-specified RF and DC testing and environmental screening. We offer a complete portfolio of screening and testing services for device sorting, labeling, lead forming and tinning, and tape-and-reel packaging, as well as LAT services on packaged devices or bare-die, including diodes, transistors, and MMICs.
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RF & Wireless Test Solutions
Adivic/Chroma Group has been in the development of RF & WIreless test solutions for more than a decade. Take RF Recorder as an example, it has been adapted by all major Japanese & Korean automotive brand names such as Toyota, Mitsubishi, Honda, Hyundai, Daewoo...etc., most of the global IC design houses with DTV chips such as Broadcom, Marvell, MTK...etc., and also defense entities around the world.
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Chip Scale TVS Arrays
ProTek's patented* Flip Chip TVS Arrays are designed for small circuit board applications with limited size and space availability. To reduce installation costs, the Flip Chip can be mounted directly onto the printed circuit board; similar to chip resistors and capacitors. These devices are ideal for use in portable electronics such as Cellular Phones, Cellular Phone Accessories, Personal Digital Assistants (PDAs), Laptops and Pagers.
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802.11b/g/n Radio/Baseband (SiP)
SX-SDPGN
The Silex SX-SDPGN (Qualcomm Atheros AR6103) is a third generation wireless LAN solution, featuring 802.11n. Based on the game-changing AR6003 Wireless LAN chip, the SX-SDPGN brings 802.11n throughput, range and power eficiency to portable devices including patient monitors, printers, handheld terminals and more.
