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COM Express Type 10
The COM Express Type 10 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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COM Express Type 7
One of the most fundamental innovations of the COM Express Type 7 pinout is the support of up to four 10GbE interfaces, essential for the next generation of edge node appliances. Type 7 modules are headless (no graphics), which is why they are also referred to as “Server Level COM Express”.
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COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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COM Express Type 6 Compact Module With 5th/4th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor
CEM881
The CEM881 COM Express Type 6 compact form factor module is powered by the latest 14nm 5th generation Intel® Core™ i7/i5/i3 or Celeron® processor with low 15 Watt TDP. The advanced computer-on-modules CEM881 provides advanced processing and high graphics performance combined with cool and efficient operation. With one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB, the extremely small SoC module boosts its fabulous computing performance, industrial grade wide temperature, and seismic design. The rugged and powerful CEM881 is an ideal solution for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, transportation, Internet of Things-related, automated optical inspection (AOI), digital signage, gaming machines, military, and networking.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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COM Express Module
CM22202
LinkedHope Intelligent Technologies Co.,Ltd.
CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
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3.5" Embedded SBC With Intel® Celeron® Processor N2807, LVDS/VGA/HDMI, LAN And Audio
CAPA848
*Intel® Celeron® processor N2807 (1.58 GHz)*1 DDR3L-1333 SO-DIMM, up to 8GB*4 USB 2.0 ports*4 COM ports*2 PCI Express Mini Card slots and 1 SIM slot*1 Gigabit Ethernet port*LVDS/VGA/HDMI with dual-view supported
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Qseven® Reference Carrier Board
Q7-BASE
Qseven is a Computer-on-Module (COM) standard for small sized and highly integrated systems adopted by SGET. The Qseven concept is an off-the-shelf, multi-vendor, Computer-on-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board. Qseven modules have a standardized form factor of 70 mm x 70 mm or 40 mm x 70 mm and have specified pinouts based on the high-speed MXM connector, regardless of the vendor. The Qseven module provides the functional requirements for an embedded application, which include, but are not limited to, graphics, audio, mass storage, network and multiple USB ports. A single ruggedized 230 pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module. This MXM connector is a well-known and proven high-speed signal interface connector that is commonly used for -PCI Express graphics cards in notebooks.
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ZIO Module With Four COM Ports And One PCI Express Mini Card
AX93262
*Specification: 2 x RS-232/422/485, 2 x RS-232, 1 x PCI Express Mini Card*Dimension: 80 x 55 mm*Accessory: 2 x COM with bracket cable*Compliant Product: CAPA840, CAPA843, CAPA880, CAPA500, CAPA313
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COM Express Type 6 Application Board With LVDS, VGA, DDI, Dual LANs And Audio
CEB94021
*125 x 95 mini size form factor*2 GbE LANs*SATA-600*LVDS, VGA and DDI*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS- 232/422/485 and 1 RS-232
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s, 0 - 20mA, ±20mA) And 2 PCIe Mini Card Slots
IRU152-I
*RISC-based (i.MX 6UltraLite) processor 528 MHz*512MB DDR3 SDRAM onboard*8GB eMMC flash onboard*2 PCI Express Mini Card slots (Wi-Fi, 3G/4G or LoRa)*4 isolated analog input channels (16-bit, 250 kS/s, 0 - *20mA, ±20mA)*1 isolated COM port*1 isolated DIO (2-in/2-out)*Embedded Linux operating system (Yocto)*Wide operating temperature range from -40°C to +70°C*Supports LabVIEW versions later than 2016*Supports OPC UA
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COM Express Type 7
COM Express Type 7 with NXP platforms provides super speed I/O, high-bandwidth expansion interfaces, and 10 x GbE interface for data transmission.
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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COM Express
COM Express defines standardized footprints and pin-outs for Computer-on-Modules. With the Revision 2.0, PICMG added the compact footprint (95x95mm) to the basic footprint (125x95mm) and extended the pin-outs being future-proof. New Digital Display Interfaces (DDI) and super-fast USB 3.0 are available. The new Pin-out Type 10 in COM Express Revision 2.0 supports perfectly modules in the COM Express mini footprint (84x55 mm).
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COM Express Type 6
The COM Express Type 6 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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Mini-ITX SBC With Intel® Celeron® Processor J3355, VGA, HDMI, USB 3.0, PCI Express Mini Card Slot, MSATA And HD Audio
MANO315
*Intel® Celeron® processor J3355 (Apollo Lake)*DDR3L SO-DIMM for up to 8GB of memory*1 PCI Express Mini Card slot and PCIe x1*2 USB 3.0 and 4 USB 2.0*1 SATA-600 and 1 mSATA*4 COM supported*STD ATX Power*VGA and HDMI supported
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COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)
cExpress-BW
ADLINK cExpress-BW provides two DDI channels (with up to 4K resolution) and one eDP or DDI3 channel supporting three independent displays, enabling it to drive multiple HD screens without the need for a discrete graphics card. In addition, LVDS is optionally available to support next generation displays. The cExpress-BW offers up to five PCI Express lanes x1. A wide range of operating systems are supported, including Linux, Windows 7 and 8.1u, Windows Embedded Standard 7, Windows Embedded Industry 8.1 and VxWorks.
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Computer On Module
ITX-M-CC452-T10
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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COM Express Type 6
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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Open Pluggable Specification (OPS) Digital Signage Player With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170 And Intel® AMT 11.0
OPS500-501
The OPS500-501 is a 4K resolution OPS compliant digital signage player supporting Intel® Active Management Technology (AMT) 11.0 for better remote management. The space-saving OPS signage module is powered by the 6th generation Intel® Core™ processor with Intel® Q170 chipset. It has one 260-pin DDR4-2133 SO-DIMM socket with up to 16GB memory capacity. Compliant with the Intel® OPS architecture, the 4K-ready signage player provides a high level of compatibility as well as simplified installation, maintenance and deployment for a lower total cost of ownership. The outstanding digital signage player, the OPS500-501, is connected to OPS-compliant display via a standardized JAE TX-25A plug connector that supports DisplayPort, HDMI 2.0, UART, audio, USB 3.0 and USB 2.0 signals. To meet various application needs, the powerful digital signage system offers rich I/O interfaces on its front panel, including one USB 2.0 ports, two USB 3.0 ports, one COM port, audio (in/out), HDMI and a Gigabit Ethernet port. This space-saving OPS signage player has one PCI Express Mini Card slot for WLAN connectivity and features one 2.5” SATA HDD for extensive storage needs.
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Fanless Embedded System With Intel® Celeron® Processor N3160, VGA, HDMI, 4 COM, 2 GbE LAN, 4 USB, 2 PCI Express Mini Card Slots And 9 To 36 VDC
eBOX626-853-FL
The eBOX626-853-FL is a slim-type fanless embedded system with wide range temperature and wide range DC input support. The cost effective compact embedded box PC is designed to support the Intel® Celeron® processor quad-core N3160 (codename: Braswell) integrated with Intel® Gen 8 graphics and DirectX 11.1. One DDR3L 1333/1600 SO-DIMM socket supports up to 8 GB memory. The IP40-rated industrial computer eBOX626-853-FL combines low power consumption with high performance graphics and computing for smart automation, transportation, industrial gateway, multiple media kiosk and other IoT&M2M applications.
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COM Express Type 7 Development Baseboard
CEB94701
*Two 10GBASE-KR SFP+ ports*2 SATA-600*VGA*4 USB 3.0*2 PCI Express Mini Card slots*2 RS-232/422/485
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COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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Computer-On-Module
ETX®
ETX is one of the earliest successful computer-on-module form factors. Today it is still widely used in applications such as industrial automation, transportation and medium and low level medical appliances. While high-end Intel® Core™ applications have mostly migrated to COM Express, ETX is still very much alive in the lower power segment, mostly notably using Intel Atom® SoCs.
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COM Express Type 10 Development Baseboard
CEB94017
*COM Express Type 10 baseboard*2 SATA-300 and SD card slot*1 PCI Express Mini Card slot*5 USB 2.0 and 2 USB 3.0*Port 80 display for debugging
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COM Express Type 2 Basic Module With Intel® Celeron® Processor J1900/N2807
CEM841
The CEM841 computer on module is based on the ultra-low power Intel® Celeron® processor J1900/N2807 which provides impressive CPU and graphics performance improvements. The CEM841 is equipped with double deck DDR3L SO-DIMM sockets supporting system memory maximum up to 8 GB. Coming with 8 PCI Express lanes, the power efficient system module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs and HMI and industrial automation controllers.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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COM Express Type 6 Basic Module With 5th Gen Intel® Core™ I7 & 4th Intel® Core™ I7/i5/i3 & Celeron® Processor And Intel® QM87
CEM880
The CEM880 COM Express Type 6 basic module features 5th generation Intel® Core™ processor (H-processor line), one onboard 4 GB extended temperature DDR3L chip, and one 204-pin SO-DIMM DDR3L socket supporting up to 8 GB. With outstanding computing performance, low power consumption, wide temperature range, and seismic design, the rugged basic-size SoM (system on module) drives Internet of Things innovation and is ideal for graphics-intensive and rich I/O applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking.
