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Vertical Shock/Bump Tester (Pneumatic)
HIACC Engineering & Services Pvt. Ltd.
The pneumatic vertical shock and bump test system features an advanced design with a high degree of performance and automation. The testes is easy to use and have low maintenance requirements.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Pneumatic Bump Test Machine
KRD20 series
The KRD20 series pneumatic bump test machine replaces the traditional mechanical cam-type crash bench and is suitable for repeated impacts on electronic components, equipment and other electrical and electronic products during transportation or working.
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Director's LCD Monitor with Wireless RF Link
EZ-ROAM D
The highly portable "EZ-ROAM D" has been designed for life on the road, and is ruggedly constructed in an extruded aluminium case sealed to IP67, and tough enough to take every day knocks and bumps. Battery powered (and with an external dc input too), the EZ-ROAM D with it's 7" LCD provides robust diversity radio reception, whilst the recessed controls offer selection between video inputs, 16:9 or 4:3 aspect ratios, Horizontal & Vertical flip, and stereo audio monitoring. There is even an RX OP on BNC.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Environmental Test Chamber
Labtone Test Equipment Co., LTD
Environmental test system, Electro-dynamic Shaker, Shock Test Systems, Drop Tester, Bump Test Systems, Combined Environmental Test Systems
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Nano-focus X-ray Inspection System
X-eye NF120
Nano-focus Tube of 400 nano resolution is installed which is specialized for Semiconductor Packaging, Wafer Level Packaging(WLP) requiring detection of Sub-micron defects.Able to trace and inspect defected area precisely by precise movement of axis with Anti-vibration table.Tomography is available if 3D CT module is added and Wafer Bump Automatic Inspection is available from loading to inspection with wafer handler systems.
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Shock Tester
DP-1200
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Audio + Vision Generation and Monitoring
Test Chest 3G (Multi Function Test)
Quick and very easy to use, the amazing Test Chest boasts instantaneous Audio + Video generation and Monitoring. NO tedious boot-up means Test Chest is “First out of the blocks” every time by 10s of seconds, and it’s intuitive touch-screen speeds Engineers to the required function, saving precious time and giving their investigations a real head start. 10bit precision signal generation is standard with Test Chest, as are the analysis utilities which are displayed on it’s superb 5” high resolution touch screen Monitor screen, and stereo sound too (when present).Ease of use and protection whilst in service are serious matters, so Test Chest is fitted with ‘Ez-Grip’ resillent rubber end sleeves; these assist grip, and provide additional protection against everyday knocks and bumps. During transportation your Test Chest’s tough extruded alloy housing is cradled within a customised go-anywhere foam lined ABS Carry-case for complete protection.
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Automatic Optical Cell/Wafer Inspection System
7200
Among several factors for PV to achieve grid-parity, Reliability of the PV Modules plays an important role. Since its known that some of the cell defects such as edge chips/ flakes, bumps of cell surface were proved to be source of infant mortality of the c-Si PV modules, therefore, to detect those defects is very important for c-Si cell manufacturers.
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Bump Tester
KD-163
King Design Industrial Co., Ltd.
*Comply with IEC-68-2-29 testing specification(10g/ 16ms、15g/6ms、 40g/6ms、100g/2ms).*Easy installation and simple operation; Low noise; no maintenance required; function holds long.*Well-designed and no resonant-structure, air anti- vibration pad can effectively isolate floor vibration.*Accelerometer adopts repeated measurement and adjustable half-sine wave generator; to control the data is precise.*Magnesium alloy platform is anodized, Servo motor cam to drive, and can adjust the frequency automatically.*The adjustable acceleration value and shock domain is patent design (1ms-13ms).
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Structural Dynamics
Structural Dynamics by OROS - bump tests, operating deflection shapes, modal analysis, and more
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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C-Band Separate Dispersion Compensation Raman Fiber Amplifier
DRA5228/F
Hangzhou Huatai Optic Tech. Co., Ltd.
Raman Fiber Amplifier (RFA) utilizes the optic gain in the Stimulated Raman Scattering (SRS) in the optical fiber and realizes the amplification of the signal optic. FRA, with very low equivalent noise and a wide gain scope, can further widen the gain bandwidth by adopting multi-wavelength optical bump, which represents the development direction of the new optical fiber amplifier.
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Auto Bump/Calibration Station
PS500
Teledyne Gas & Flame Detection
To provide accurate performance and results, the PS500 has to be properly used and maintained. The Auto Bump & Calibration Station (ABC) provides bump testing, calibration and data management options and is compact, robust and intuitive to use.Two versions of the ABC are available allowing either a single gas cylinder or up to three cylinders to be connected. Additionally, a special three cylinder version is available for reactive gases.
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Solid Measuring Viewer
SMV system is designed to perform automatic final inspecting system. SMV integrates professional vision and optics technology. Besides, reliable mechanical system reduces the maintenance time. It is especially suitable for the demand for high quality and low cost inspection. Unique inspection techniques adapt to all 3D measuring. It can detect laser Via, dimple, bump, copper plating thickness, line, SMT, BGA, etc. SMV provides 3D image and 3D measuring result. SMV adopts programmable LED lighting to obtain the best image.
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Solar Cell Backside Printing Surface Inspector
7213-AD
Defects causes by back-side printing process of C-Si PV cells will also cause performance, reliability impact. Among all the back-side printing defects, bumps caused by improper printing may cause high cell breakage rate during lamination of c-Si module process.
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Easy3DMatch
Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
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Stellar 4000 Bondtester
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
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ArgoBot Kit
ROB-00001
The ArgoBot Full Kit is a fully assembled robot and controls development platform. It is based on the Digilent chipKIT WF32(TM), a WiFi enabled development platform, and configured for LabVIEW targeting. Most importantly ArgoBot was designed with FIRST Robotics Competition teams in the front of our minds! Named after the FRC Team 1756 mascot, Argos, the ArgoBot development platform includes a fully-assembled, ready to drive mini WiFi enabled robot (about 8" x 5" x 4"), as well as tons of FRC controls tutorials and example code (LabVIEW VIs). Features included on the ArgoBot will look very familiar to anyone who has worked with National Instruments products (Compact RIO and RoboRIO) in the past. This includes three 5V Digital I/O modules (with jumpered pull-ups), three 5V analog inputs, and an I2C header. Example VIs have been streamlined to enable a 1-click configuration style to accelerate your development process. We also added a 2-channel motor driver that is used to supply the ArgoBot drive motors. Our ultimate goal is that everything you can build, control or implement on ArgoBot can be easily leveraged on your FRC bot! Complimenting its many electrical features, ArgoBot is easy to work with and easy to maintain. The chassis is a polycarbonate (the extremely tough stuff that is easy to drill and modify but easily takes bumps and bruises without cracking) case that is fully intact - meaning that ArgoBot doesn't just come with a case... it is a case! Clean-up and organization is simple - just close the case and turn off the power switch.
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G3 System
Dragonfly
Unique 2D imaging technology provides fast, reliable inspection for sub-micron defects to meet today's R&D needs and tomorrow's production demands. Onto Innovation's patented Truebump® Technology combines multiple 3D metrology techniques to deliver accurate 100% bump height metrology and coplanarity.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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330 System
NSX
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
