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Bump
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Bump Tester
KD-163
King Design Industrial Co., Ltd.
*Comply with IEC-68-2-29 testing specification(10g/ 16ms、15g/6ms、 40g/6ms、100g/2ms).*Easy installation and simple operation; Low noise; no maintenance required; function holds long.*Well-designed and no resonant-structure, air anti- vibration pad can effectively isolate floor vibration.*Accelerometer adopts repeated measurement and adjustable half-sine wave generator; to control the data is precise.*Magnesium alloy platform is anodized, Servo motor cam to drive, and can adjust the frequency automatically.*The adjustable acceleration value and shock domain is patent design (1ms-13ms).
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IC Test Services
With knowledge gathered from decades of supporting Tier 1 and emerging industry leaders, Amkor understands test solutions must address advanced technology, quality, performance and cost of test. We offer full turnkey solutions including wafer processing, advanced bump, wafer probe, assembly, final test, system-level test, burn-in and end-of-line services.
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Wafer Thickness Measurement System
MPT1000
Laser based Wafer Thickness and Roughness Measurement System designed by Chapman Instrument Inc., USA and OEM by Creden Mechatronic Sdn Bhd. A non-contact measurement system measures several parameters in a single system. (wafer & tape thickness, roughness, TTV, bump height, bow and warp measurements)
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Optical VisionInspection System
NIDEC-READ's inspection systems serve to locate open/leak circuits on printed substrates forming different conductor patterns within inner/outer layers. These vision inspection systems are also used to measure the shape of via holes and solder bumps and to find scratches and stains on them.
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X-ray Inspection Performance
MXI Quadra 7
Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Stellar 4000 Bondtester
STELLAR 4000 is the platform of choice for all manually operated pull and shear production bond testing. Configure as a simple bond wire pull tester, or upgrade for ball shear, die shear, bump pull, and tweezer pull testing.
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Cantilever Probe Card
MPI Cantilever Probe Card is widely applied on gold bump and pad wafer testing for display driver, logic, and memory device. MPI’s cantilever probes are the corresponding answer to the demands of fine pitch, small pad size, high speed, less cleaning, multi-DUT, high pin count, and ultra-low leakage requirements. With outstanding craftsmanship, innovative architecture and proven methodologies based on mechanical and electrical simulation/measurement results, making MPI the top cantilever provider worldwide.
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Light and Energy Meter
Model 659
UV Light and Energy Meter for use with all wafer steppers. For over 45 years, OAI is a world leader in UV Light and Energy Measurement Instrumentation used for reliable accurate calibrated control of the photolithography processes in the Semiconductor, MEMS, Wafer Packaging and Wafer Bumping Industries. The New Model 659 is an advanced UV exposure analyzer specifically designed for use with all wafer steppers including high intensity wafer steppers. This meter averages up to 400 exposure readings, has Ethernet and USB interface for downloading recorded measurements, and has intensity range of up to 7,500mW/cm2. Probes are available in wavelength of 365nm, 400nm, 420nm & 436nm. OAI has a complete certified calibration lab to maintain the performance, quality and reliability of our meters. The Model 659 meter is traceable to NIST standards.
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Auto Bump/Calibration Station
PS500
Teledyne Gas & Flame Detection
To provide accurate performance and results, the PS500 has to be properly used and maintained. The Auto Bump & Calibration Station (ABC) provides bump testing, calibration and data management options and is compact, robust and intuitive to use.Two versions of the ABC are available allowing either a single gas cylinder or up to three cylinders to be connected. Additionally, a special three cylinder version is available for reactive gases.
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Semiconductor
Aerotech has a long history of engineering and manufacturing motion systems and components for high precision wafer processing, scanning electron microscopy (SEM), wafer bumping, 450 mm wafer manufacturing, lithography equipment and advanced laser micromachining. We also specialize in systems and components for vacuum applications, such as EUV lithography. So whether you need off-the-shelf wafer bumping components or a custom-engineered SEM system manufactured and tested to exacting specifications, Aerotech can provide the optimal solution for your application.
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Shock Test System
Labtone Test Equipment Co., LTD
Products are inevitably affected by impact, bump, free fall, tumbling etc. during production, transportation, loading and unloading as well as during the use of the products. All of these are transient excitation on the object, causing the object to produce mechanical characteristics of high speed, acceleration, strain rate instantly. These kind of characteristics are completely different from that in static load, and may cause problems to the object in terms of structural strength and stability and sometimes the object may fail. Therefore, it's necessary to study the effect of impact and reproduce the shock environment, to assess the structural strenghth and performance of the object under shock environment.
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Vibration Testing System
Torontech is now offering Vibration Test Systems, Shock Test Systems, Bump Test Systems, Drop Tester, and Packaging Transportation Simulators.
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Compact Bump Gas Solution
Eco Bump
Teledyne Gas & Flame Detection
Importantly, bump testing is the only way to validate that gas detectors will respond to gas and trigger user alarms.Simplified configuration (no software).Measuring only 7.2” (180mm) in height (including the push button regulator), the pocket-sized EcoBump can easily be stored and transported with minimal shipping costs.With 5.5L of bump gas capacity, EcoBump provides approx. 250 bump tests from a single cylinder making it our most cost effective bump solution.
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330 System
NSX
With a combination of inspection plus metrology, NSX 330 System measures multiple applications including wafer-level metrology for micro bumps, RDL, kerf, overlay, and through silicon via (TSV) in a single wafer load.
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Structural Dynamics
Structural Dynamics by OROS - bump tests, operating deflection shapes, modal analysis, and more
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Easy3DMatch
Align a scanned 3D object with another scan or with a reference meshCompute the local distances between 3D scans and a golden sample or reference meshDetect anomalies such as misplaced features, geometric distortions, gaps, bumps,...Compatible with all 3D sensors that produce point clouds, depth maps or height maps
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Shock/Bump Multifunctional Tester
DP-201
King Design Industrial Co., Ltd.
Shock or bump test mainly simulate the impact effects of product and its components encountered in usage and transit process. Through standard and high-reproducibility instant energy exchange, you can analyze the product ability to tolerate the strong external stress and the degradation of structural weaknesses to quickly obtain the data of structure strength, anti-shock appearance and anti-drop. Shock tester is one of destructive experiments, and do destructive test on the product to evaluate the product reliability and monitor the consistency of production line.
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Advanced Packaging & TSV
FilmTek 2000M TSV
Scientific Computing International
Advanced semiconductor packaging metrology system providing an unmatched combination of speed, accuracy, and precision for high-throughput measurements of resist thickness, through silicon vias (TSVs), Cu-pillars, bumps, redistribution layer (RDL) and other packaging processes.
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Mems-Based Probe Cards
MEMSFlex
Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Environmental Test Chamber
Labtone Test Equipment Co., LTD
Environmental test system, Electro-dynamic Shaker, Shock Test Systems, Drop Tester, Bump Test Systems, Combined Environmental Test Systems
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Analysis
External appearance due to non-destructive semiconductor · X-ray fluoroscopic observation, SAT observation, electrical operation confirmation, ESD fracture analysis, plastic opening observation of Chip, search for abnormal portions by EMS / OBIRCH, package (PKG) analysis, Please do not hesitate to contact us anything related to semiconductor analysis, such as observation by polishing / parallel polishing (ball and bump observation etc.), peeling observation of defective part, analysis of foreign matter by EDX · FT - IR etc.
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Vertical Shock/Bump Tester (Pneumatic)
HIACC Engineering & Services Pvt. Ltd.
The pneumatic vertical shock and bump test system features an advanced design with a high degree of performance and automation. The testes is easy to use and have low maintenance requirements.
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Bump Test Machine
Labtone Test Equipment Co., LTD
Bump test systems for electrical products repeating impact testing during transportation
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Fastest Flying Probe Test System for Semiconductor Substrate Interconnect Test
GATS-3200
* Test individual packages or * Test Multi-image panels with Step&Repeat Function * single flying probe top using very high speed voice coil motor (VCM) technology * 50 - 100 tests per second ... high throughput * Dual Flying Probe Top for testing bump-to-bump nets * flying probe head allows testing of all nets including each power and ground point * 4-wire test capability
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Pneumatic Vertical Shock Test System
KRD11 series
KRD11 series pneumatic vertical shock test system is featured with advanced design, high degree of automation and reliability, simple operation and convenient maintenance. The system meets the requirements of both shock and bump test, can perform conventional half-sine wave, post-peak sawtooth wave, trapezoid wave and other waveform shock tests.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Probe Card
VS Series
Japan Electronic Materials Corp.
*Vertical contact Probe Card with Spring*Suitable for Area array Bump Test
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C-Band Separate Dispersion Compensation Raman Fiber Amplifier
DRA5228/F
Hangzhou Huatai Optic Tech. Co., Ltd.
Raman Fiber Amplifier (RFA) utilizes the optic gain in the Stimulated Raman Scattering (SRS) in the optical fiber and realizes the amplification of the signal optic. FRA, with very low equivalent noise and a wide gain scope, can further widen the gain bandwidth by adopting multi-wavelength optical bump, which represents the development direction of the new optical fiber amplifier.
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Scanning Acoustic Microscope
Pulse2
This industry-leading scanning acoustic microscope provides a universal inspection tool for packaged semiconductor development, production and failure analysis. With the ability to detect air defects as thin 0.05 micron and spatially resolve defects down to 10 microns, the ECHO is perfect for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.
