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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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High Speed Test Bench
AT444
AC motor with mechanical multiplying gearbox test benches allow precise programming of all drive parameters required for accurate rotating devices test.The use of special high-speed bearings, mechanical components and parts wear resistant leads to a large life. The supply includes the electronic drive and control as well as the entire oil cooling unit.
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Faraday Chamber for RF w/Exchangeable Cassettes 340x350mm RCV 9025 for 6TL36
AN133
The Faraday Chamber is an add-on for the 6TL36 test handler. This kit is installed into the 6TL36 in the same way a normal test fixture would be installed, being the only difference the fact that different products to be tested will, from that moment on, only need an additional exchangeable cassettes to be tested.
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Benchtop Communication Test System
ATS3000A
The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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In-Circuit Test (ICT) Fixtures
At Forwessun we support and manufacture In-Circuit Test Fixtures for a range of Test Systems. We regularly build fixtures that are supported on a range of systems including - - HP3070- Agilent- Keysight- GenRad- TeradyneWith over 50 years in the industry, we provide a weatlth of knowledge and support to our customers. We are a global company and can support businesses all over the world with the help of over 30 experienced test engineers.
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FPD Tester Model
27014
Chroma 27014 Flat Panel Display Tester is a complete testing solution that meets the Liquid Crystal Module testing requirements of production line. With integrated video generator, multi-channel precision power supply and process control unit, the system allows a complete test of signal, pattern and electrical parameters of LCM through a PC or remote control box.
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EVSE Test Platform
To manage both the challenging high-power requirements of electric vehicle supply equipment and the market demand, it is crucial to rely on a test system that performs to your specs. The right system needs to combine the tools for reliable asset communication, microgrid management, effective protocol simulation and high-power testing. This EVSE platform combines the right energy regeneration equipment with 25+ years of test experience to deliver the results you need to meet conformance in the time you need it.
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FADEC/EEC Test Platform
The FADEC/EEC Test Platform provides a hardware in-the-loop (HIL) closed-loop test environment for dynamic and maintenance testing of full-authority digital engine control (FADEC) and electronic engine control (EEC) units of both rotary- and fixed-wing airframes. The system simulates one or more turbofan engines, including its sensors and actuators for use with the most sophisticated FADECs and EECs on the market. The system delivers repeatable, cost-effective testing in a fraction of the time needed with typical in-house simulation test systems.
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VLSI Test System
3380
The 3380 VSLI test system equipped with a maximum of 1280 I/O channels, 256 VI sources, flexable architecture and comprehensive optional function boards (ADDA/Hi-voltage DPS) can meet the high parallel multi-test tendency.
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PXIe Optical Test Modules
Coherent Solutions’ expanding portfolio of PXIe optical test modules bring a wide range of new mixed-signal test capabilities to the PXI platform. The new modules offer seamless integration with PXI Platform and deliver reliable and repeatable results across a wide range of optical and mixed-signal test applications.
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ESS Performance Test System
The Energy Storage System (ESS) Performance Test System is used to evaluate, test, and certify the performance of energy storage systems up to 2MW. The system is a configurable platform with over 200 channels of simultaneously measured AC and DC voltages and currents, environmental temperatures, airflow, and communications. Intuitive software provides real-time monitoring and analysis of power, energy and efficiency to adhere with industry standards. The test system interfaces hardware such as load banks, and controls the ESS to simulate utility applications such as peak shaving and frequency regulation.
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RF Testing Platform for ATx05
AT118
The functional test of modern devices with wireless connectivity always requires RF isolated cameras, as the only way to have the parameters controlled and to guarantee operation under the specified conditions.
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Test Platforms
Leverage 20+ Years of Test Industry Experience with Built-In IP for Maximum Reuse
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VR/AR/MR Calibration Platform
AR, VR and MR device calibration is critical for product performance. Leverage Averna’s standardized alignment platform to efficiently calibrate cameras and Inertial Measurement Unit (IMU) modules with supreme accuracy. Easily customize or upgrade the base platform into the automated quality solution to best fit your manufacturing requirements.
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In-Line Test System
With an Averna in-line test system, clients boost production/yields, catch defects invisible to the human eye, reduce equipment downtime, and ensure repeatable results.
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Electronics Functional Test
Functional test for productive manufacturing. Manufacturers of products enabled by electronics must assure proper operation prior to shipment. Bloomy’s line of universal test systems are ideal for functional test of your PCBAs and subassemblies, from the simplest to the most complex. The UTS family of products combines high-performance test instruments, switching, power control and mass-interconnect hardware with our robust UTS software suite into a low-risk, cost-effective and powerful test solution for your device under test (DUT).
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Regenerative Battery Pack Test System
17020E
Charge/discharge modes (CC, CV, CP)Power Range: 10kW / 20kW per channelVoltage Range: 60V/ 100VCurrent Range: 100A/200A/300A/400A/ 500A/600A/700A/800A per channelRegenerative battery energy discharge, efficiency 85%Channels paralleled for higher currentsDriving cycle simulationFast current conversion without current interruptHigh precision measurementSmooth current without over shootTest data analysis functionData recovery protection (after power failure)Independent protection of multi-channel
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NTS Platform
Manufacturers all over the world are leveraging our NTS platform for products with rotating or otherwise moving parts, or produce sounds. Typical applications include mass production of air conditioning units, pumps or small electric motors, where errors in assembly can cause malfunctions or significantly shorten service life. This test platform is customized to your specification and application. Feasibility studies are available to ensure your solution is exactly what you are looking for.
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6TL60 Rotary Test Handler
H79006010
6TL60 has been designed according to the 6TL philosophy, following the concepts of flexibility, modularity and scalability, and with the aim of improving production efficiency as well as increase production capacity and reduce costs.The 6TL60 is the best production solution to automate test processes to reduce the cycle time and the footprint used in the manufacturing plan
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ARINC 818 Tester
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
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End of Line Test System for Automotive Seats
AS519
AS519 is specifically designed to perform ECU’s EOL tests in the automotive industry. It integrates a programmable power supply up to 20V 20A with high reading resolution. Interaction with the DUT is established through CAN bus by an interphase adapter in a USB port of the test managing computer.
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6TL08 Benchtop Test Platform
H710008
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettesThe platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
