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BGA
Surface mount chip package, which uses solder balls for its connectors.
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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RC BGA Interposer, LPDDR4 200-ball, Rigid, Connects Using 2x U4207A
W6602A
The W6602A LPDDR4 rigid RC BGA interposer for LPDDR4 200-ball DRAM enables capture of simultaneous read and write traffic at data rates and has been tested to 3200 MT/s. Two U4207A zero Ω, 34-channel, soft touch pro, single-ended, 4 x 160-pin direct connect probes are required to connect the W6602A LPDDR4 BGA interposer into two U4164A logic analyzer modules. The W6602A LPDDR4 rigid RC BGA interposer allows signal access to the LPDDR4 signals critical to your debug and validation effort through a U4164A logic analyzer system. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DRAM using a LPDDR4 200-ball riser (included) or an optional 3rd party socket (not provided), enabling operation and acquisition of LPDDR4 signals.
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Get Flexible, Get FlexiFLASH
LatticeXP2
*Up to 885 Kbits sysMEM™ embedded block RAM and up to 83 Kbits distributed RAM*sysCLOCK™ PLLs up to four analog PLLs per device that enable clock multiply, divide and phase shifting*Three to eight sysDSP blocks for high performance multiply and accumulate.*Pre-engineered source synchronous IOs for DDR/DDR2 up to 200 MHz and 7:1 LVDS interface support up to 600 Mbps*Available in csBGA, TQFP, PQFP and BGA packaging
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Low Power MIPI Bridging Solution With Integrated Flash
CrossLinkPlus
*Instant-on (< 10 ms) configuration with integrated flash memory*Integrated flash enables flexible reprogramming in the field*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port*11 programmable, source synchronous I/O pairs for camera and display interfacing*Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch*Comprehensive library of IP and reference designs, compatible with CrossLink
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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High-speed In-Line 3D CT Inspection System
X-eye 6300
Automatically inspects the defects of products in customer's line with high-speed 3D CT tomography.Able to inspect every defects of Double-sided PCBA & BGA mounted components precisely by solving overlapped X-ray image issue.Inspection speed of 3 sec/1FOV from loading to automatic Good/NG judgement.
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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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BGA Rework Station
PDR IR-D3 Discovery
The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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Optical BGA Inspection
Imaging hidden solder joints of BGA, IBGA, FlipChip, CSP, CGA and SMD components
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Advanced Diagnostics for ScanExpress™ JET JTAG Embedded Test Solutions
ScanExpress JET Advanced Solutions
ScanExpress JET advanced diagnostics add additional diagnostic resolution with fully automated analysis translating functional test results to down to the net and pin level, even with BGA packages.The seamless integration with ScanExpress JET and ScanExpress Runner as well as the ability to output ScanExpress Viewer fault reports for PCB visualization make ScanExpress JET Advanced Diagnostics a must-have tool for any JTAG test system.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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X-ray Inspection System
RTX-113™
Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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AOI & SPI Test Systems
Xceed AOI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The Xceed enables true 3D measurement and provides the most accurate and repeatable inspection results with the minimum false calls. It’s designed with Advanced Signal Processing which gives results in noise-less, clear, and accurate 3D images.
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BGA Interposer, LPDDR4 200-ball, 2-wing For Logic Analyzer, Connects To 61-pin ZIF
W6601A
The W6601A LPDDR4 2-wing BGA interposer for LPDDR4 200-ball BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A logic analyzer module it is compatible with. The W6601A is the smallest BGA interposer for LPDDR4 200-ball DRAM capable of capturing simultaneous read and write traffic at data rates in excess of 3.2 Gb/s. U4208A and U4209A probe/cables connect W6601A LPDDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W6601A BGA interposer wings. Refer to the W6601A data sheet for complete list of LPDDR4 signals probed with the W6601A.
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Adapters
- Pluggable BGA adapter system (Giga-snaP™) – Surface mount package emulators – Package convertors & Fix adapters – Prototype, probe & analysis adapters – Receptacles, extenders, rotators and socket plugs– Electronic modules
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Digital Demultiplexers
Advanced Science and Novel Technology, Co., Inc.
24:48 digital demultiplexer (DMUX) with SSTL1.5 input and output interfaces.Supports data rates from 1.0Mbps to 2.0Gbps.User-controllable independent internal delays for data and clock signals.1.5V I2C control interface with a user-defined 3-bit chip address.Preset function for synchronization of multiple parallel devices.Full-rate output copy of external high-speed clock input signal.Two pairs of clock divided-by-2 and synchronous clock enable outputs for supporting the tree-type demultiplexation structure.Additional synchronous clock divided-by-4 output.Dual power supply of +3.0V and +1.5V.Industrial temperature range.Low power consumption of 2.1W at 2.0Gbps.Available in custom 256-pin BGA package (13mm x 13mm x 2.5mm).
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Aspen Sockets
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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AOI & SPI, Test Systems
SigmaX SPI
Most defects in the circuit-board assembly are due to the solder paste or the process of printing solder paste. Since the transition to lead-free soldering, a whole new spectrum of problems has emerged in older paste printing and its due processes. Incomplete coalescence of ball grid array (BGA) spheres and solder paste deposits are failure modes that have increased in frequency since the transition to lead-free soldering. The SigmaXs inspection technology is unaffected by varying materials, surface conditions, or colors. The system profiles the board to generate accurate 3D shapes far superior to other brands and technologies.
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DDR4 X4/x8 BGA Interposer For Logic Analyzer, Connects To 61-pin ZIF
W4643A
The W4643A DDR4 2-wing BGA interposer for DDR4 x4/x8 BGA DRAM probing takes full advantage of the quad sample state mode on the U4164A. The W4643A is the smallest BGA interposers for DDR4 x4/x8 DRAM capable of capturing simultaneous read and write traffic at data rates exceeding 3.2 Gb/s. U4208A and U4209A probe/cables connect any W4640A Series DDR4 BGA interposer directly into the U4164A logic analyzer module from 61-pin high density zero insertion force (ZIF) connectors that attach to the W4640A Series BGA interposer wings.
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BGA Rework Station
PDR IR-E3 Evolution
The PDR IR-E3 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s PCB assemblies.
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Thermal Test Vehicles
TTV
Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
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Futureproof Your Control PLD And Bridging Designs
MachXO3
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
