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BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Silver Ball Matrix Sockets
SM Contact is a unique contact that has precise silver balls held together by a proprietary conductive formulation. These conductive columns (diameter optimized for 50 ohm impedance) are suspended in a non-conductive flexible elastomer substrate with a patented solid core for enhanced durability and reliable performance over time, temperature and cycles. This flexible substrate is very compliant and resilient and enables the conductive columns to revert back to original shape when the force is removed. Solutions are available for 0.25mm to 1.27mm LGA, BGA, QFN, CSP, POP, WLP and other packages. The silver ball matrix contact technology is also available with a protective plunger matrix (a gold plated copper cylinder) that sits on top of the conductive columns. This plunger matrix protects the conductive column from contamination from various solder ball interfaces. A quickly replaceable plunger matrix enables minimal downtime during final production test. The product family code for this line of sockets is SMP.
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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Near Zero Footprint SMT Spring Pin Sockets
Ironwood Electronics socket is a device size or near device size footprint test socket incorporating industry standard high performance spring pins. Ironwood can design a socket to work with any type IC packages- BGA, LGA, QFN, DFN and even leaded devices where you need to fit a socket in place of your device to allow fast, easy testing and development.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Application Software for Electronic Test & Instrumentation
Application software provides configuration-based workflows for electronic test and instrumentation applications. Application software is part of the NI software portfolio.
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6TL24 Combinational Base Test Platform
H71002400
The 6TL24 is the Base platform ideal for Combinational test (ICT+FCT) in low to mid volume, high-mix electronics productions. A dual-stage pushing mechanism will allow performing both, the FCT and the ICT test, without the need of changing the test platform and with a low cost fixturing technology. To do so, the exchangeable cassette fixture must be designed with two-level probes. IN the 6TL24, the second level is reached thanks to a pneumatic actuator.
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Battery Management (BMS) Environmental Test System
The BMS Environmental Test System is a configurable platform simulating the essential signals used by Battery Management Systems (BMS) and cell-monitoring modules with the ability to perform environmental testing on multiple BMS units simultaneously. The system implements single-point value testing to evaluate specific BMS functions such as cell over and under voltage scenarios, cell leakage current, lost communications, or faulty system IO.
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Semiconductor Test System
TS-960e
The GENASYS Semi TS-960e PXI Express Semiconductor Test System is an integrated test platform that offers comparable system features and capabilities found in proprietary ATE systems. Available as a bench top system or with an integrated manipulator, the TS-960e takes full advantage of the PXI architecture to achieve a cost-effective and full-featured test solution for device, SoC and SiP test applications.
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PCIe 5.0 Test Platform
PXP-500A
The Teledyne LeCroy PXP-500A Test Platform provides a convenient means for testing PCIe 5.0 cards with a self-contained portable and powered passive backplane. The PXP-500A provides power required for both cards under test.
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Communication Test System
CTS-2700
The CTS-2700 is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The field-upgradeable, software-defined architecture features easy-to-use graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets can be created easily using the included TestEZ® software suite.
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Test Workflow Pro
Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
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6TL10 Table Top Test Base
H71001000
The 6TL-08 base platform was designed to cover the most common testing and in-system programming (ISP) needs with a reduced initial budget. The system includes a robust manual linear push mechanism allowing a low-cost fixture strategy thanks to the exchangeable cassettes.The platform enclosure features an 8-Slot fixture receiver, compatible with VPC 90 Series Mass Interconnect Module, as well as 6TL intelligent YAVModules (YAV90MMU &YAV90059), with room for fast ISP devices, optional PXI chassis and various power supplies. A removable back panel allows easy placement of custom connectors or test auxiliary circuitry.
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Advanced SoC/Analog Test System
3650-EX
Chroma 3650-EX is specifically designed for high-throughput and high parallel test capabilities to provide the most cost effective solution for fabless, IDM and testing houses.
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Functional Test
xUTS
Extend test to encompass copious test points and DUT varieties along with real-time, hardware-in-the-loop and other state-of-the-art instrumentation. extendedUTS (xUTS) is a custom product for high complexity functional test. Configured for the unique needs of a class of devices under test (DUTs), the xUTS employs our universal test system approach that combines the best open platform instrumentation and software along with mass interconnect technology.
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Test Instruments
Test instrumentation from COTS to custom, including VXI, PXI and LXI-based platforms.
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FADEC/EEC Test Platform
The FADEC/EEC Test Platform provides a hardware in-the-loop (HIL) closed-loop test environment for dynamic and maintenance testing of full-authority digital engine control (FADEC) and electronic engine control (EEC) units of both rotary- and fixed-wing airframes. The system simulates one or more turbofan engines, including its sensors and actuators for use with the most sophisticated FADECs and EECs on the market. The system delivers repeatable, cost-effective testing in a fraction of the time needed with typical in-house simulation test systems.
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Fixture Kit In-Line 6TL35 455x600mm
AH500
Fixture Kit for Platforms featuring receiver Virginia Panel 9025 and external pusher system. Its heavy duty design supports more than 3000N.nnThe fixture kit includes the Base fixture (probe plate) as well as the Puhsers plate.
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Photodiode Burn-in Reliability Test System
58606
The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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OLED Lifetime Test System
58131
The 58131 Lifetime Test System is designed specifically for the OLED industry. Model 58131 provides twoquadrant constant current (CC) and constant voltage (CV) stimulus to each OLED panel and acquires electrical and optical characteristics automatically. Two independent and isolated precision source-and-measure units (PMU) are incorporated in one modular card, which is capable of testing two OLED panels. Additional instrument cards are added to expand test capacity. Hot plug and play is a key feature of 58131. When a UUT fails or an instrument card needs to be replaced, 58131 does not have to be shutdown and testing continues for other UUTs. Hot plug and play obviates life test cycle restarts due to isolated faults and significantly improves life test efficiency. We firmly believe that hot plug and play capability should be mandatory for all lifetime test systems.
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EVSE Test Platform
To manage both the challenging high-power requirements of electric vehicle supply equipment and the market demand, it is crucial to rely on a test system that performs to your specs. The right system needs to combine the tools for reliable asset communication, microgrid management, effective protocol simulation and high-power testing. This EVSE platform combines the right energy regeneration equipment with 25+ years of test experience to deliver the results you need to meet conformance in the time you need it.
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Fixture Self-Test Controller and Calibration Check
AQ818
The module AQ818 includes all the electronic blocks required to perform an effective test platform self-test. Thanks to this module, a chain of tests can be performed, which will end up not only with a report of the defective instruments or switch modules, but also with the relay contacts live expectancy report.
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Advanced SoC Test System
3680
The Chroma 3680 is an advanced SoC test system with data rate up to 1Gbps. The Chroma 3680 is capable of conducting parallel tests on multiple chips to meet the digital and analog IC testing requirements, with applications including MCU, digital audio, digital TV, set-top box, DSP, network processor, field programmable gate array (FPGA) and consumer electronics.
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6TL23 Off-Line seat operation Base Test Platform w/o Table
H71002301
- 18U height 19inch rack space (580mm depth)- VPC G12 or G12X interface- Man Machine interface H73000301 (not included)- stand-up operation
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Test Platforms
Leverage 20+ Years of Test Industry Experience with Built-In IP for Maximum Reuse
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6TL22 Off-Line Testing Platform
H71002200
Learn about our Build to print service for Test Platforms. The 6TL22 Platform is a perfect base for the conception of a real modular Automatic Test Equipment for low to mid manufacturing volumes.A system designed around the 6TL22 is simple, easy to maintain and cost effective. The rack is prepared for the direct integration of the three platform based receivers from Virginia Panel, the S6, G12 and G12X.
