Evolved Packet Core
LTE system core voice and data network.
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Product
9th/8th Gen. Intel® Xeon®/Core™ Processor, 3.5" SBC W/ MIOe
MIO-5393
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9th/8th Gen. Intel® Xeon®/Core™ Processor, up to 6 cores, and TDP 45W/25WDual channel DDR4-2400, up to 64GB, ECC for Xeon SKUTriple simultaneous displays with 48-bit LVDS+HDMI+DPUSB 3.1 Gen2 (10 Gbps), TPM 2.0 & NVMe/PCIe Gen3x4 SSDDual GbE, SATAIII, RS-232/422/485, CANBus, SMBus, I2CM.2 B-Key 2280/3042, (optional M-Key 2280) & M.2 E-Key 2230Supports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Air Core Line & Load Reactors
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Line and load reactors are generally serial-connected to the input and/or output terminals of three phase equipment such as motor speed controllers, inverters and UPS systems. These equipment make use of semiconductor switches such as IGBTs, thyristors, and diodes and therefore create harmonic distortion and high switching over-voltages (dv/dt). Use of such equipment has been becoming more widespread as the technology advances. However, the negative effects of these equipment should not be overlooked.
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Product
Air Core Electric Arc Furnace Reactors
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Arc Furnace Reactors are serially connected reactors that are installed in the supply systems of arc furnace transformers to stabilize arc and limit the unstable arc furnace current and voltage drop which optimize their melting process. These buffer reactors are connected in series to the primary side of the furnace transformer. Typically these reactors are tapped coils and manufactured as per customer'stap requirements.
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Product
Value Family 9th Gen Intel® Xeon®/Core™ i7/i5/i3® Processor-Based Expandable GPU Workstation Platforms
MVP-6100-MXM Series
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4 non-ECC/ECC- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: up to 4x 2.5" SATA, M.2 2280
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Value Series Industrial ATX Motherboard For 10/11th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-C46
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ADLINK IMB-C46 ATX Motherboard: Robust Performance for Industrial Applications The ADLINK IMB-C46 ATX motherboard offers a powerful platform for diverse industrial applications, powered by Intel's reliable 10/11th Gen Core processors. Engineered with the versatile Q470 chipset, the IMB-C46 excels in delivering enhanced performance and scalability. This motherboard supports up to 128GB of DDR4 memory, providing a balance of speed and efficiency critical for process-intensive tasks in environments like smart manufacturing and industrial automation.
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Product
Ka-Band Silicon SATCOM Tx Quad Core IC
AWMF-0109
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The AWMF-0109 is a highly integrated silicon quad core chip intended for satellite communications transmit applications. The device supports four dual polarization radiating elements with full programmable polarization flexibility. The device provides 22 dB of gain per channel with an output power of +12 dBm per element per polarization. Additional features include gain compensation over temperature, temperature reporting, and Tx output power telemetry. The chip features ESD protection on all pins, operates from a +1.8 V supply, and is packaged in a 48 lead 6x6 mm QFN for easy installation in planar phased array antennas.
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Modular Compact Embedded Box PC With 6th/7th Gen Intel® Core™ I CPU
UNO-2484G
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Intel® Core™ i7/i5/i3/Celeron Processor with 8GB DDR4 built-in Memory4 x GbE, 4 x USB 3.0, 1 x HDMI, 1 x DP, 4 x RS232/422/485Stackable 2nd layer for up to 4 iDoor extension or customize for domain applicationsCompact Fanless DesignRuggedized by zero cable and lockable I/O designSupports 30+ iDOOR combination with four main categoriesDiverse system I/O and Isolated Digital I/O by iDoor TechnologySupports Fieldbus Protocol by iDoor Technology3G/GPS/GPRS/Wi-Fi Communication by iDoor Technology with RED Compliance
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3U Intel® Core™ i7-7820EQ Quad-Core Processor-Based PXI Express Gen3 Controller
PXIe-3987
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The ADLINK PXIe-3987 PXI Express embedded controller, based on the 7th gen Intel® Core™ i7 processor, is specifically designed for hybrid PXI Express-based testing systems, delivering maximum computing power for a wide variety of testing and measurement applications.
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12.1" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-312S(W) RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
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- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
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Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, HDMI/LVDS And LAN
PICO512
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The PICO512 is designed to support the latest 7th generation Intel® Core™ processor or Celeron® processor 3965U. Coming with one 260-pin DDR4-2133 SO-DIMM socket supporting system memory up to 16 GB, the Pico-ITX motherboard also features a PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors for an additional I/O board/signals. It supports a 4K visual experience with dual display outputs through HDMI and LVDS. Pico-ITX SBC can withstand a wide operating temperature range from -20°C to +70°C.
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Product
15.6" Fanless Widescreen Panel PC With Intel® 13th Gen Core™ I7/i5/i3 Processor
PPC-415W
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15.6" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i7-1365URE/i5-1345URE/i3-1315URE processor with fanless system designSupports PCIe x4 or PCI expansion1 x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technology3 x Independent displays1 x M.2 bay (2242/2280) for storage onlySupport TPM2.0 hardware security
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Quad Core KeyStone™ DSP + UltraScale™ FPGA Module
SMT6657-KU35
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Sundance Multiprocessor Technology Ltd.
The SMT6657 DSP+FPGA module is a reliable and flexible platform for digital signal processing applications requiring high-performance integer and floating-point computation.It is applicable to both symmetric multiprocessing applications in which the computational load is shared by the two DSPs and asymmetric applications where one of the DSPs is responsible for hard real-time processing and the other acts as a supervisor, handling all non-deterministic communication and optionally running under control of an operating system.
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Product
TAP Adapter for Corelis JTAG Controllers
Low Voltage Adapter
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High technology, energy efficient, and small form factor products push JTAG interfaces to the limits; low power and high performance means low voltage, high speed, and high drive requirements. Building specialized interface circuits on product Printed Circuit Boards (PCBs) is inconvenient and costly—an out-of-the-box, external solution is needed.The Corelis Low Voltage adapter is an add-on accessory that provides existing scan controllers with an active, plug-in interface to access low voltage scan chains, without sacrificing performance.
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Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43
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The ADLINK IMB-M43 is industry's first 6th/7th Gen Intel Core i7/i5/i3 Processor (formerly codenamed Skylake/Kabylake) based industrial ATX motherboard in the LGA1151 package with Intel Q170 Express chipset. The ADLINK IMB-M43 supports high-speed data transfer interfaces such as PCIe3.0, USB 3.0, and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2133/2400 MHz memory up to 64 GB in four DIMM slots.
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Product
1U Intel Core Series
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1U Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
ATX Server Board With Intel® Core™ Ultra 9/7/5, DDR5, And PCIe Gen5 For Workstations, General-Purpose Servers, And Multi-Tasking.
ASMB-789
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Features an LGA 1851 socket for Intel® Core™ Ultra 9/7/5 processors with the W880 chipset, delivering next-gen performance.Supports up to 192 GB of high-speed DDR5 ECC/Non-ECC UDIMM memory at up to 5600 MT/s.Provides extensive expansion with one PCIe x16 (Gen5), one PCIe x8 (Gen5), and five PCIe x4 slots.Drives triple independent displays through DisplayPort, VGA, and HDMI 2.0 for advanced visual workspaces.Includes four SATA 3 ports for traditional storage and seven USB 3.2 ports for high-speed peripherals.Features one M.2 2280 slot (PCIe x4) for fast NVMe SSDs, accelerating boot times and application performance.Its rackmount-optimized design ensures positive airflow, enhancing cooling and system reliability in server environments.Built to operate reliably in a 0 ~ 60°C (32 ~ 140°F) ambient temperature range, suitable for various industrial settings.
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Product
Dual Quad Core Multiprocessor
DSP282A
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Designed for size, weight and power (SWaP) sensitive applications, Abaco's high performance embedded computing (HPEC) platforms deliver expanded mission capabilities across a wide range of manned- and un-manned airborne, ground and naval platforms.
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SC9-TOCCATA, CompactPCI® Serial CPU Card Equipped With 11th Generation Intel® Core™ & XEON® W Processors (Tiger Lake H45 Platform)
EKF-SC9-TOCCATA
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SC9-TOCCATA is a rich featured high performance 4HP/3U CompactPCI® Serial CPU board, equipped with an Intel® 11th Generation XEON® Processor (Tiger Lake H45 platform) for demanding industrial applications.
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Product
Mini-ITX Embedded Board With 12th/13th/14th Gen Intel® Core™ Desktop Processor
AmITX-AD-G
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The AmITX-AD-G is a mini-ITX board specifically designed to be in compliance with GLI standards for the gaming industry. The AmITX-AD-G gaming board supports enhanced display specifications, ensures system integrity, and guarantees secure transactions while also offering fast time to market (TTM), low total cost of ownership (TCO) and maximum system uptime for mission critical applications.
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Product
Embedded System Supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
DLAP-3000-CF Series
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ADLINK provides an optimized, highly-available computing platform with expandability options, including the MXM cards. The DLAP-3000-CF series platforms support performance-hungry workloads (e.g., deep learning) with active cooling for applications requiring very high levels of computing in a limited space. DLAP-3000-CF Series features: - Smallest Embedded GPU Platform (3 liters) - Reliable MXM GPU Design with Low TDP - Scalable Graphics Processing Ranging from Pascal to Turing GPUs
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Product
Industrial ATX Motherboard For 12/13/14th Gen Intel® Core™ I9/i7/i5/i3 Processors
IMB-M47H
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ADLINK IMB-M47H Industrial ATX Motherboard offers high computing performance with diverse I/O for industrial automation applications. It is the suitable choice for applications requiring real-time processing and high-level graphic capability.
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Product
Pico-ITX SBC With 4th/5th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, DisplayPort/LVDS, LAN And Audio
PICO880
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The PICO880 is an extremely compact Pico-ITX SBC with onboard 14nm 5th generation Intel® Core™ i7/i5/i3 and Celeron® processors. The palm-sized PICO880 enhanced performance enables greater multitasking at low power meeting the needs of the growing retail mobile device marketplace. The industrial grade embedded SBC is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F). Designed with expandability in mind, the tiny embedded board has a full-size PCI Express Mini Card slots with mSATA support. The Axiomtek PICO880 also provides two flexible board-to-board connectors that integrate audio, four USB 3.0, one PCIe x1, one DisplayPort, two UARTs, LED, and power on/off interfaces. The pico-ITX motherboard PICO880 is equipped with standard features such as one DDR3L SO-DIMM with up to 8 GB memory capacity; one USB 2.0 port; one SATA-600 interface, one 10/100/1000Mbps Ethernet port that supports Wake-on-LAN, PXE; one DisplayPort and LVDS display interface with integrated Intel® HD graphics 5500 and 6000 that delivers high-resolution Ultra HD 4K display support for immersive visual retail experience. The single board computer also offers two optional expansion boards, AX93275 and AX93276 for additional RS-232/422/485, USB 3.0, HDMI, VGA and LAN ports. This outstanding embedded SBC runs well with Windows® 7 and 8.1 operating systems.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
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The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
Pico-ITX SBC With 7th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor, DisplayPort, LVDS And 2 GbE LAN
PICO51R
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The PICO51R is powered by the 7th generation Intel® Core™ i7/i5/i3 or Celeron® processor (code name: Kaby Lake). With the onboard CPU attached on the rear side of the board, the PICO51R can aid the heat-extraction process to make fanless design possible and make system integration fast. The pico-ITX embedded board also provides practical expansion interfaces within its limited dimensions including one M.2 Key E slot for wireless modules and one M.2 key B slot for storage cards. This powerful 2.5-inch Pico-ITX embedded motherboard is designed for minimum maintenance and maximum ruggedness. In addition to two USB 3.0 (USB 3.1 Gen1) ports in support of industrial cameras for machine vision applications, the PICO51R also comes with an M.2 Key E slot for wireless communication capabilities and two Gigabit Ethernet ports for mass data transmission or LAN port teaming functions.The Intel® Core™-based PICO51R supports one 260-pin DDR4-2133 SO-DIMM for up to 16GB of system memory. Moreover, the pico-ITX single board computer utilizes Intel® HD graphics engine to bring a true high definition visual experience with dual display configurations through DisplayPort and 18/24-bit single/dual channel LVDS. In addition, this industrial motherboard can withstand a wide operating temperature range from -20°C to +60°C (-4°F to 140°F) for use in rugged and harsh environments.
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Product
Core Loss Testers
S30 and S30S Series
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Stacks built with punched laminations can have a lot of quality issues. Even though the lamination material is tested in sheet format before any process, that alone is not sufficient to guarantee good quality stators. Wear and tear of the punch, bad welding, bad insulating coating in annealing add to the magnetic losses in the stator. It is always advisable to test the stator core in it's final format before winding to ensure good quality throughout the production batch.
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Product
cPSB 2.16 Compact Packet Switch 16 Slot, 14 node, 2F
107PS22616-4157R
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CompactPCI CPSB 2.16 6U 16 slot,14 node, 2 fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
Ultra-compact, Uncooled Thermal Imaging Core
Dione S 640 CAM Series
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The Dione S 640 CAM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution and NETD of less than 40 mK (available upon request) and 50 mK. The camera cores are optimized for low SWaP (Size, Weight and Power). The Dione S 640 CAM is lightweight and small with mechanical shutter. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione S 640 versions have the same SAMTEC ST5 connector and are GenICam compliant. Dione S 640 CAM is a LWIR uncooled thermal imaging SWAP module with housing supporting M24/M34 lens (optional).The ultra-compact Dione S 640 CAM series find application in safety and security systems, as well as in industrial thermal imaging systems.
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Product
Tilera GX72 Processor AMC, 72 Core
AMC740
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The AMC740 is ideal for packet filtering, intelligent networking, multimedia, video transcoding, cloud and other applications. The device includes 72 identical processor cores (tiles) interconnected with Tilera’s iMesh™ on-chip network. Each tile consists of a full-featured, 64-bit processor core as well as L1 and L2 cache and a non-blocking Terabit/sec switch. The high processing density and high internal bandwidth of the GX72CPU make it ideal for intensive computing tasks.
