Evolved Packet Core
LTE system core voice and data network.
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Fanless DIN-Rail IPC With Intel® Core™ Processors (13th Gen)
UNO-148 V2
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Intel® Core™ processors (13th Gen) with 8GB DDR5 memoryPort isolation for 8 x DI, 8 x DO, 4 x COMSupports 2 x M.2 M key 2280 NVMe SSD storage (support RAID)Supports 1 x M.2 E Key 2230 wi-fi module and 1 x miniPCIe with Nano SIM card slotDual 2500 BASE-T Ethernet supports Time-Sensitive Network (TSN) technologyModular design for optional iDoor extensionSupport Windows 11 IoT Enterprise LTSC
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Rapidly Compile Networks For Implementation On Lattice SensAI IP Cores
Neural Network Compiler
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Analyze networks for fit in the chosen number of engines and allocated memory. After compilation, simulate networks for functionality and performance prior to testing in hardware. Graphical display of networks supports analysis and understanding.
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2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Front-access I/O, PCIe And PCI Slots
IPC962-511-FL
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The IPC962-511-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) up to 65 W with the Intel® H110 chipset, featuring high performance capability. The ultra-compact industrial computer provides flexible expansion options with one I/O module slot and two PCI/PCIe expansion slots. It has a wide operating temperature range of -10°C to +60°C, and is equipped with a wide range 19V - 30V DC power input for mission-critical environments. The ruggedized industrial PC has a creative modular design with rugged mechanisms and optimized expandability. To meet different customization requirements, it has an optional I/O module slot and three different types of I/O modules. The choices, include a 4-port isolated RS-232/422/485 module; isolated 8-in/8-out DIO module; 2-port isolated RS-232/422/485 and 4-in/4-out DIO module, can provide system integrators with a less cabling solution for a lower total cost of ownership. Additionally, the compact industrial PC provides two flexible PCI/PCIe expansion slots with three different combinations of AX96205, AX96206, AX96207: one PCIe x16 and one PCIe x4; one PCIe x16 and one PCI; 2 PCI.
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Industrial ATX Motherboard with 6th/7th Gen Intel® Core™ i7/i5/i3 Processor (Code name: Skylake/Kabylake)
IMB-M43H
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IMB-M43H is an ATX motherboard supporting the Desktop 6th/7th Generation Intel Core i7/i5/i3 Processors with Intel H110 Chipset, providing the most cost-competitive solution anywhere in embedded computing and fulfilling the specific needs of all users requiring 5 PCI add-on cards. With high-speed data transfer interfaces such as PCIe 3.0/2.0, USB 3.0, and SATA 6 Gb/s (SATA III), dual-channel DDR4 memory up to 32 GB in two DIMM slots for industrial automation applications, the ADLINK IMB-M43H carries significant competitive advantage in the market. This leading, rugged I/O design enhances user experience with robust device compatibility, durable connectivity, and extreme environment readiness.
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Intel® 6th/7th Generation Core I Desktop Compact Fanless System
MIC-7700
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Intel® 6th/7th Generation Core i Desktop CPU (LGA1151) with Q170/H110 chipset2 x RS-232/422/485 and 4 x RS232 serial ports (with expansion cable)1 x 2.5" HDD, 1 x CFast, 1x mSATA and 1 mini-PCIe with SIMSupports 2 LAN, Isolation COM, 32-bit GPIO modules2 x GigaLAN and 8 x USB 3.0VGA and DVI outputSupports Advantech’s i-module, SUSIAccess, and embedded software APIs9 ~ 36 V DC input power rangeWide operating temperature
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COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
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The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Mini-ITX Embedded Board with 8th/9th Gen Intel® Core™ Desktop Processor
AmITX-CF-G
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Targeted at gaming customers and system integrators, AmITX-CF-G is a Mini-ITX board specially designed for Gaming. AmITX-CF-G features GLI compliance, easy and flexible configuration, security enhancements, and system resilience. The values of AmITX-CF-G include amplified visual impact, guaranteed system integrity, secure transactions with fast TTM and low TCO, and maximized system uptime. AmITX-CF-G can satisfy application function requirements and meet GLI certification which cannot be offered by other conventional Mini-ITX boards.
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Sandwich Core Shear and Rigid Cellular Plastic Shear Testing
Model 3421
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Jinan Testing Equipment IE Corporation
For measuring shear properties of sandwich cores to ASTM C273. Simple clip-on design attaches in seconds and provides repeatable test results.
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LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ ATX Server Board with 4 DDR4, 7 PCIe, 6 USB 3.1, 8 SATA3, Quad/Dual LANs, IPMI
ASMB-786
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- LGA 1151 Intel® Xeon® E & 8th/9th Generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 2666/2400/2133 MHz ECC/Non-ECC UDIMM up to 128 GB- One Gen 3.0 PCIe x16 link (or two PCIe x16 slots with x8 link), two PCIe x4, and three PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- Rackmount optimized placement with positive air flow design- 0 ~ 60° C ambient operating temperature range
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IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784966-01
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The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Fanless Embedded System With 7th/6th Gen Intel® Core™, Pentium® And Celeron® Processor, Compact Size For Video Analytics In Vehicle PC Market
UST100-504-FL
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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LGA 1200 Intel® Xeon® W & 10th Gen. Core™ ATX Server Board with 4 x DDR4, 5 x PCIe, 2 x PCI, 6 x USB 3.2, 5 x SATA 3, Quad/Dual LANs, and IPMI
ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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Intel Core Series - Medium Branch
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Rackmount Network Appliances with Intel® Core™ Family for NFV and SD-WAN.
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SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
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The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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COM Express Type 6 Basic Module With Intel® Xeon® And 6th Gen Intel® Core™ I7/i5/i3 Processor, Intel® CM236/QM170/HM170
CEM500
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The CEM500, a COM Express Type 6 basic module, is based on the 14 nm Intel® Xeon® processor E3-1505M v5 and 6th generation Intel® Core™ i7/i5/i3 processor (codename: Skylake-H) with Intel® CM236/QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications.
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8th/9th Gen Intel® Core™ Processor LGA1151
AIMB-286
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Supports Intel® 8th/9th Gen Core™ i processor (LGA1151) with Intel H310 chipsetTwo 260-pin SO-DIMM up to 64GB DDR4 2666 MHz SDRAMSupports PCIe x 4 (Gen 3), 1 M.2 B key, 1 M.2 E key, 6 COM, 4 USB 3.0 and 3 SATA IIISupports dual display of DP/HDMI/LVDS(or eDP)Supports TPM 1.2 / 2.0 (optional)THIN Mini-ITX with 12V DC InputSupport Windows 10 LTSC & Ubuntu 20.04 LTS; SUSI API and WISE-
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17" Fanless Panel PC With 13th Gen Intel® Core™ Processors (I7/i5/i3)
PPC-317S RPL
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True-flat touchscreen with Industrial-grade LCD panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware security
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Product
Cavium CN66xx Packet Processor AMC
AMC732
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The AMC732 is a 10-Gigabit Ethernet (10GbE) AdvancedMC™ (AMC) module which includes an on-board multi-core packet processor based on Cavium CN66XX CPU. VadaTech offers this product in a mid size (full size optional) form factor with the AMC.1, AMC.2 and AMC.4 specification. The AMC732 is based around the Cavium OCTEON CN66xx processor which has been specifically designed to intelligently process Ethernet packets at line rate. The processor can be loaded via the PCIe/SRIO interface or via an optional flash memory. The number of processor cores, speed grade, and amount of DDR3 memory is customizable based on customer needs.The module has an RTC on board and 2GB of HFA for pattern matching for deep packet inspection, etc. The SDK for the processor as well as additional software stacks are available from Cavium or third party. The AMC732 has Serial Over LAN (SOL) with a true hardware Random Number Generator.
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Open Pluggable Specification (OPS) Digital Signage Player With 4th Gen Intel® Core™ Processor, Intel® HM86 And TPM 1.2
OPS880-HM
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The OPS880-HM is powered by 4th Generation Intel® Core™ i5 and i3 processors (codename: Haswell) with the Mobile Intel® HM86 Express chipset. The OPS880-HM supports one DDR3L SO-DIMM socket with memory maximum up to 8GB. In addition, it features one mSATA interface as storage device and two PCI Express Mini Card slots for graphics-enhanced video card, wireless LAN card for 802.11 b/g/n and 3G/GPRS, and tuner/AV capture card. The outstanding OPS digital signage module is an ideal choice for various display applications in different environments, e.g., shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.
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4CH GigE Vision Compact Vision System with 6th Generation Intel® Core™ i7/i5/i3 Processors
EOS-1300
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ADLINK’s EOS-1300 is a high performance compact vision system equipped with 6th Generation IntelR Core? i7/i5/i3 processors and four independent PoE (power over Ethernet) ports, delivering data transfer rates up to 4.0 Gb/s. EOS-1300’s FPGA based DI/O provides programmable de-bounce filter, on the fly trigger, and user wiring Sink/Source DO and Encoder functions, making it the ideal solution for machine vision applications requiring high computing power and time deterministic solutions with minimal footprint.
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High Core Density 2U Network Appliance With Security And Acceleration Features Ready. Ideal For Network Security And Crypto Acceleration Workloads.
FWA-6080
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Single AMD EPYC™ 7003 Processors, up to 64 Cores16 x DDR4 ECC RDIMM slotsHot-swap 2.5" disk bays and system fan, redundant PSU, 2 x HH/HL Gen4 PCIe x16 slotIntegrated security features with secure boot, memory encryption, and virtualizationIPMI v2.0 compliant, with web interface8 x Advantech network module expansions w/ PCIe Gen4 bandwidth
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3.5” Embedded SBC With 4th/5th Generation Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® HM86 (Intel® QM87 Optional), LVDS/ VGA/Dual HDMI,Dual LANs And Audio
CAPA881
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The CAPA881 3.5-inch embedded board supports the 22nm 4th generation Intel® Core™ i7/i5/i3 processors (codename: Haswell) with Intel® HM86 or Intel® QM87 chipset (optional). The 3.5-inch single board computer comes with a DDR3L SO-DIMM socket up to 8 GB. The highly integrated 3.5-inch embedded board features high performance, graphics, power efficiency, security, and remote management capabilities (Intel® AMT), making it ideal for a broad range of intelligent systems such as embedded applications, gaming, DSA, DVR, IoT/M2M-related, network computing, and many more.
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Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
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- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Mini Type COM-HPC Module With Intel® Core™ Ultra Processor (Meteor Lake)
COM-HPC-mMTL
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Combining a power-efficient Intel® Core™ Ultra processor with up to 64GB LPDDR5 memory in a 95x70mm size makes this ideal for battery-powered, space-limited, high-performance edge applications like medical ultrasound devices, industrial automation, data loggers, autonomous driving, and AI robots.
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Product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
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The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
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*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, HDMI, DVI-D, VGA, 8-CH PoE, 6 USB And 24 VDC
eBOX671-517-FL
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The eBOX671-517-FL supports 8-port Gigabit PoE and able to work under harsh temperatures. Its eight Gigabit PoE ports allow multiple cabling to cameras and any PoE power device; and, the eBOX671-517-FL is specifically designed for security surveillance, optical inspection, and edge computing applications. This rugged NVR embedded box PC is powered by the 7th/6th generation Intel® Core™ (Kaby Lake/Skylake) or Intel® Celeron® processors with a 35W/65W TDP and comes with Intel® Q170 chipset. The eBOX671-517-FL comes in great expansion possibilities, including a flexible I/O module slot with a wide selection of PCIe Mini modules and four PCI Express Mini Card slots. It also has two front-accessible SIM slots and four SMA-type antenna connectors. For storage, this high performance fanless embedded system has two SATA HDD drive bays with a height of up to 15 mm and one optional mSATA for RAID 0 and 1. Moreover, the embedded device supports two non-ECC 260-pin DDR4 SO-DIMM slots for up to 32GB of system memory.
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Product
15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
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Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Product
18.5" FHD TFT LED LCD Touch Panel Computer With 13th Gen Intel® Core™ Processors And ATEX Explosion-Protected Certification
SPC-618WE
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Industrial-grade 18.5" FHD TFT LCD with 50K lifetime and LED backlightIntel® Core™ Processors (13th Gen ), i7-1365URE deca-coreBuilt in single DDR5 4800 RAM with 32GB capacityBuilt in sTLC SSD of 256GB with extreme longevity and reliabilityCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionSpecialized enhanced impact proof touchscreen with PCAP touch control and IP65-rated front panelDiverse system including Type C connector with USB 3.2, DP 1.4a, 15W power deliverySupport TPM2.0 hardware securityIEC Ex & ATEX certification for Zone 2/22 criteria and Class I Division II explosion proof certification





























