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Open Top BGA Sockets
Ironwood has the most comprehensive collection of open top BGA and QFN sockets that can be used for qualification application, silicon FIB testing, system development, thermal characterization, burn-in application, etc. IC socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. Typical packages include BGA, LGA, QFN, QFP, WLCSP, etc. Open top allows access to the top side of IC. Below is an example BGA socket that uses low cost elastomer contact technology.
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Burn-In Test Sockets
The selection of the test socket is critical to the performance of a device during qualification testing where electrical bias and signals are applied. Key factors such as mechanical compatibility, operating temperature, ability to withstand high moisture levels, signal speed and lead inductance/capacitance all need to be taken into account when selecting the best socket for the test application.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Burn-In Test
C.C.P. Contact Probes Co., LTD.
Customized Burn-In Test Sockets for temperatures of up to 180°C.
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Test & Burn-In Socket for Devices up to 13mm Square
CSP/MicroBGA
Test & Burn-In Socket. Socket is easily mounted and removed to & from the BIB due to solderless pressure mount compression spring probes which, are accurately located by two molded plastic alignment pins and mounted with four stainless steel screws. Standard molded socket format can accommodate any device package of 13mm or smaller, by using machined (for small quantities) or custom molded (for large quantities) pressure pads and interposers.
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BIB Loading
FALCON Series
The Falcon Series is an automated BIB loading and unloading machine. It is designed to provide precise high-speed loading of DUTs from Trays/Tube to Burn-in boards and precise high-speed unloading of DUTs from Burn-in boards to Trays/Tube for different device packages. The Falcon Series also has a simple conversion kit which allows end-users to re-configure the equipment for different types of sockets and package combinations.
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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Burn-In Board Tester
Focus-275
Focus275 is a tester for burn-in board.It can improve reliability of burn-in board by inspecting boards for burn-in test by Focus275 regularlyBoth short open test and component test can be done by sending electric signals for special socket contactor and edge part.
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QFN/QFP35 Sockets
Test sockets are designed for testing today’s high-performance QFN, QFP, DFN and SOIC devices. For development, characterization, at speed burn-in, and low volume production manual testing.
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Burn-in and Test Sockets
Loranger International Corporation
Loranger International Corporation designs and manufactures thousands of socket styles for the burn-in and test of semiconductors and electronic components. Some of the socket styles are listed below.
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Burn-in Systems
Incal Offers A Line Of State-Of-The-Art Burn-In Testing Hardware And Software For Retrofit And/Or Total, Customized Burn-In System Configurations.
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Burn-in System
Sonoma
High power burn-in system with advanced testing functionality at DUT level for substantially lower cost and high performance using State-of-the-Art technology
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Burn-in Board Continuity Tester
CT-1
Burn-in Board Coninuity Tester. Verifies burn-in board continuity and component tolerances. 768 I/O channels, can be forced to the constant current source or grounded independently. Highly accurate measurement of resistance, voltage, and capacitance using a pair of precision instrumentation amplifiers.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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Hybrid Socket
CSP/Ballnest
Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Test Sockets
MEMS Device
Patented MEMS Sockets from Ardent Concepts use a unique scrubbing action contact set which is ideal for today’s sensitive MEMS devices, including accelerometers, gyroscopes, MEMS microphones and other specialized devices used in mobile electronics applications
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RF Burn-In Services
Innovative Circuits Engineering, inc
There are many burn-in services that we offer such as HTOL, RFBL, ELFR, LTOL, etc and our focus on quality and customer service when providing burn-in custom solutions is second to none. We work closely with our customers to make sure we provide them with the best possible burn-in regardless of their lot size or pin count. We can also provide you with other electrical stress tests such as THB and HAST, and we can provide you with comprehensive status reports for your tests as they progress whether they be burn-in, THB, HAST or any other test.
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GFCI Socket Tester
TEL5
Standard Electric Works Co., Ltd
● Fast, easy wiring check.● Easy to read light indication.● Confirm the correct wiring of AC socket.● Test GFCI for correct wiring & operation.● Detect 5 wiring faults.● GFCI circuit trips to confirm the tester is working.● The testing current for GFCI is about 8mA.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
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Socket Testers
Socket testers are portable devices used for testing the wiring of power outlets. These testers are used widely in home and commercial buildings. UNI-T’s socket testers can speed up the testing process considerably and obtain reliable and accurate information socket status.
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Environment And Burn-in Temperature Chambers
Delta 9000 Series Temperature Chambers offer a wide choice of temperature ranges and capacities in addition to smart electronics. Field proven by satisfied customers for over four decades, Delta chambers are quality instruments that provide service longevity and integrity unique in their field. Over the years, Cohu has added advanced features to the proven basic chamber design and has refined system components and programming capability to deliver outstanding quality and value.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Inverter Socket
Series 6621
Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
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Meter Socket Logger
PM2000
The PM2000 Meter Logger (USA only) is a 5-channel data logging system built into an electric meter housing. It is ideal for responding to residential voltage complaints and power consumption problems.
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Three-Phase Smart Socket
WECO 3230
Utilize the RW-3X's features while on site in the van, as well as back at the shop with the WECO 3230 Three-Phase Smart Socket. The 3230 features built-in laser optics, Smart Socket™ technology and automatic meter form selection. Connect the RW-3X to the 3230 side panel using the included cables and the RW-3X Winboard Embedded software automatically sets the meter form, which will then populate on the WECO 3230 LCD display panel, and now you are ready to test. Not only does the 3230 make testing meters a snap, but it expands the current capability of the RW-3X to a full 50 amps, allowing the user to test class 320 amp meters.
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RF Bias Burn-In System
These systems deliver an unbeatable combination of advantages over a wide range of RF frequencies and power levels. The Automated Multi-Channel RF-Biased Burn-In Test System is a turnkey system that incorporates all of the capability needed for accelerated aging and parametric testing of RF semiconductor devices. Its powerful software elegantly supports data acquisition, storage, and presentation. Accel RF’s customers choose system features to meet their technical needs and capital budget. In addition to cost savings, use of Accel-RF’s solutions accelerate product time-to-market, saving many months of product development.
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SLT Socket
Mobile Phone, Tablet, TV Board, Set-top box etc.LEENO can provide a System Level Test solution on various types of packages.
