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Systems Tool Kit
STK
STK is a free 2D and 3D modeling environment used by engineers, mission analysts, operators and decision-makers from more than 700 global organizations to model complex systems (such as aircraft, satellites, ground vehicles and their sensors) to evaluate their performance in real or simulated time. Built on a time-dynamic, physics-based geometry engine, AGI software answers fundamental questions essential to solving dynamic analysis problems
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Camera Testing
FLIR
CI Systems' FLIR turn-key test stations carry out all the necessary tests to verify and compare the quality of an infrared/thermal camera. The FLIR test systems are based on CI Systems' NIST traceable blackbody radiation sources, collimators and special thermally controlled targets, designed to provide very accurate IR test patterns. All these combine to project standardized targets with known geometry and intensity to the Unit Under Test(UUT).
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Rock Mechanics
ROCK3D
ROCK3D is a program for stability analysis of removable blocks on planar rock slopes. It identifies and analyses all the blocks that have formed under each kinematic mode. Once the geometry of the rock blocks has been identified, the bolt forces necessary to reach a required safety factor are calculated.
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Accuscan XE200i
Rotary Precision Instruments UK Ltd
Fully understanding components geometry prior to assembly is critical when faced with the ever growing environmental pressures and increasing fuel prices. The significantly more reliable measurement data collected by AccuScan™ enables rotor stacking software to accurately manipulate component parts, resulting in precisely aligned rotor assemblies. AccuScan™ has been independently verified and proven to offer our customers significant operational improvements over their traditional measurement methods.
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Multibeam Echosounder - Deep Water
SeaBat 7160
The SeaBat 7160 transducer array is comprised of linear receive and transmit arrays mounted together on a support base. The T-shaped array geometry provides the basis for a compact, high-resolution sonar which is easily installed for portable or hull mounts – a first for a high-resolution system in this frequency range. The system features a pitch-stabilized transmitter and an active roll compensated receiver.
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High Precision Angular Positioning, Calibration and Geometry Inspection
LabStandard COMPACT
Rotary Precision Instruments UK Ltd
Designed for horizontal or vertical applications with a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Benchtop Non-Contact Directional Geometry Spectrophotometers
Hunter Associates Laboratory, Inc.
Unique measurement methods that don’t require instrument contact with your samples. These benchtop spectrophotometers are perfect for samples that are not smooth, uniform or are messy. These solutions reduce sample preparation time and cleanup time while ensuring absolute measurement accuracy and consistency.
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Substrate Manufacturing
KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types and sizes including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.
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Entry-level Price Interferometer for Geometry Measurement of Single Fibers
3D SCOPE-V2
Specifically designed for use in a production environment, 3D Scope-V2 is a robust, compact and easy to use interferometer that brings speed and precision to operators. 3D Scope-V2 supports our Blink software platform. Non-compressed, real time and high quality images are transfered from the hardware to the software via a USB 2.0 link in addition to the automation and control commands.
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Circular Helmholtz Coils
Helmholtz-Coils are especially designed to generate precisely defined magnetic fields from DC to the upper end of the audio frequency range and beyond. The generated fields are in a strongly linear relation to the coil current. The field- strength can be calculated exactly by analytical (or numerical) methods, based on the coils' geometry, the number of turns and the coil current.
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Rotman Lens Designer
Rotman Lens Designer (RLD) is a software tool for the design, synthesis, and analysis of Rotman Lenses and their variants. It is based on Geometrical Optics combined with the classical Rotman Lens design equations. It is intended for rapid development and analysis of Rotman Lenses given several physical and electrical input parameters. RLD generates the proper lens contours, transmission line geometry, absorptive port (dummy port) geometry, provides an approximate analysis of performance, and generates geometry files for import into Remcom's XFdtd® for further analysis and fabrication.
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Linear Strain Gauges
Linear Pattern Strain Gages are the most straightforward geometry of strain gauge, designed to indicate strain in only a single direction.
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X-ray Diffraction and Elemental Analysis
D8 ADVANCE
The intelligent beam path components of the D8 ADVANCE with DAVINCI design provide true plug'n play functionality requiring minimum or even no user intervention. Featuring automatic and tool-free switching of the diffraction geometry without the need for complex adjustments, the D8 ADVANCE with DAVINCI design broadens the analytical capabilities for a wide community of X-ray diffraction users.
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Portable Connector End Face Geometry Interferometer
Thorlabs’ Vytran® Connect-Chek® Interferometer automatically and precisely measures radius of curvature, apex offset of polish, and fiber undercut or protrusion on any PC or APC, single-fiber connector. The CC6000 interferometer uses a non-contact tilted-phase-analysis technique for fast, reliable measurements of connector end faces. This compact interferometer has a carrying handle and must be attached to a desktop or laptop computer (not included) with a standard USB 2.0 port for operation. The included CC6000 software, which is used to control the interferometer, can be installed on a computer with the minimum requirements in the table below. Designed for use in both the factory and the field, this interferometer provides crucial quality information needed to assure long-term performance of fiber optic connectors. One CC250P Mount for Ø2.50 mm PC Connectors and one RT250P Reference Tool for calibrating the CC250P mount are included with the CC6000 interferometer; mounts and reference tools that enable measurement of other PC or APC, single-fiber connectors are available separately below. When used with an appropriate mount for APC connectors, the CC6000 interferometer is also capable of measuring the APC angle and key error.
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Interferometers
Sumix interferometers are designed for inspection of fiber optic ferrules, patch cords, pigtails and bare fiber in the process of polishing and assembly. They enable you to check polishing quality, test connector end face geometry per IEC, Telcordia or your own custom standards and generate reports to supply with your patch cords.
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Wheel Running Tester up to 15000 kg axle load
MINC II EURO | VP 420005
Maschinenbau Haldenwang GmbH & Co. KG.
The test lane-compatible MINC II EURO guarantees a verification of the axle geometry in seconds when the test vehicle drives over (up to 15.0 t axle load) as well as a fully automatic evaluation of the deviation in m / km. The measured values are displayed either in analog form on a dial or by transmission to a PC screen (including graphic representation).
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Disposable Spiral Mixers
Using simple, time-proven geometry, Nordson EFD’s patented disposable Spiral Mixers™ deliver complete and thorough mixing for a wide variety of two-part materials.
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Coordinate Measuring Machines
Coordinate Measuring Machines (CMMs) measure the geometry of physical objects by sensing points on the surface of the object with a touch probe. They are commonly used in manufacturing processes to inspect a physical part or assembly against the design specification.
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Checking the Geometry and the Placement of the Weld
Based on the real geometric three-dimensional profile of the weld (groove) on the outside of a large diameter pipe, determine the offset of the center of the weld (groove) from the weld line. Provide continuous output of results through the RS-232 interface to the welding process control system. Provide a graphical picture of the current profile, the values of the specified and calculated geometric parameters to the operator.
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Hardware and Software Complex for Measuring Geometric Parameters
Vishera
Non-contact measurement of the geometry of objects using telecentric lenses Opto Engineering, illuminators of various modifications, 3D scanner Sick Ranger. The telecentric pair, in conjunction with modern digital cameras from Basler, ensures high accuracy in measuring the geometric parameters of objects, the principle of laser triangulation ensures high accuracy and scanning speed.
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Manual Spin Air Bearing Rotary Table for Optimal Circular Geometry Inspection
GeoInspec
Rotary Precision Instruments UK Ltd
Inspect circular components in a shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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SANA 2 Interferometer
CA3004
SANA 2 fiber endface interferometer is a type of cost-efficient non-contact test instrument with excellent performance. It is able to measure the fiber endface geometry parameters such as radius of curvature, apex offset, fbre height and polishing angle of APC connector.
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Colorimeter Measurement
DRK8620
Shandong Drick Instruments Co., Ltd.
WSC-S Colorimeter measurement is a superior performance, versatile and convenient operation colorimeter,suitable for the determination of various objects reflection color, whiteness test, chromaticity and color object with two objects. It is equipped with a geometry test head, that the provisions of CIE 0 / d. WSC-S Colorimeter measurement with two portable desktop, digital display, and available for print. The instrument can be widely used in textiles, dyes, printing and dyeing, paper, building materials, ceramics, food, printing, metrology and other departments.
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Day Camera Testing
CI Systems' CCD test stations are used to carry out all the necessary tests to verify and compare the quality of a CCD based camera. These stations are based on CI Systems' reflective collimators, Visible Radiation Sources, special targets and integrated software, to project standard patterns with known geometry and intensity to the Unit Under Test. As a result, these stations are turnkey solutions for the CCD camera testing needs.
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Fiber Geometry System
FG500
The FG500 is a fiber geometry system that measures the physical dimensions of the fiber including core, cladding, and coating diameter, non-circularity, and eccentricity. The FG500 is designed to produce accurate measurements quickly and with confidence.
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High Temperature Operating Life
7000 Series
With ever decreasing geometries, the way we perform HTOL requires careful consideration. In lower geometry device leakage currents are not only higher but vary greatly. Temperature control at DUT level – required to achieve correct junction temperature at every DUT. For higher geometries, HTOL can be performed in a more traditional way but with devices consuming more power, the ambient temperatures required varies greatly. Multiple temperature zones are required – multi zones system or multiple smaller HTOL systems.
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Software to Simulate Large Area Semiconductor Devices
Laoss
Laoss is a powerful software to simulate large area semiconductor devices (OLED, thin-film PV), taking into account the voltage drop in the electrodes due to important resistive effects when the size of the device increases.Simulation of large area semiconductor devices (OLED, thin-film PV)Coupling law input: analytical or tabulated (experimental or simulated) IV curveDevice optimization (electrode material, device geometry etc...)High speed computation
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Thin Film Analyser
TFA
The TFA instrument has be designed to monitor dissolution rates with a minimal volume of developer, typically ≤ 1 ml. The design uses surface tension to hold the developer in a small gap between the sample and the detector head. The instrument allows multiple measurements on the same sample. Thickness measurement can be made in the same geometry as dissolution measurements.
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LCD monitor
EZ3-4.5 (Triple LCD in 2U)
Murraypro was first to introduce the Triple 16:9 in 2U format. Designed for applications where 16:9 and 4:3 aspect pictures must be monitored with correct geometry, it will also be useful where picture quality is important too. EZ3-4.5 is ideal for compact and space limited applications, fitting within a 2U rack envelope and yet it is only 70mm deep.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
