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Defect Inspection System
NovusEdge
The NovusEdge System provides high sensitivity inspection for the edge and backside of bare unpatterned wafers for current and advanced nodes. Multiple modules can be configured on the same automation platform for increased throughput while maintaining a small footprint for an improved cost of ownership.
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Wafer Edge Profile Measurement
WATOM
WATOM can carry out fully automatic, non-contact measurements of the edge profiles and diameter in accordance with SEMICON standards. A special feature is the system's ability to make measurements of the mark cut into the edge of the wafer to indicate the crystal orientation. Because of its high measurement accuracy of less than 1.5 µm, leading wafer manufacturers across the world use WATOM for shop-floor geometrical quality control.
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Surface Charge and Zeta Potential
Surface analysis is a vital method for qualifying new materials in technical and biological applications. Surface charge analysis empowers users to closely monitor the surface chemistry from small particles in the nanometer range up to large wafers. Gain insights into modifications resulting from surface treatment and surface interactions with natural environments under near-ambient conditions. Get a competitive edge in optimizing existing products and developing new ones using the Anton Paar instruments which offer zeta potential measurement for a wide range of applications.
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Laser Type Edge Detection Sensor
LD
Panasonic Industrial Devices Sales Company of America
The Panasonic LD Series Laser Type Edge Detection Sensor can easily measure the outer diameter of objects. It can also sense inclines, detect the notch of a wafer and judge the height of small objects.
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Wafer Sorter and Inspection
SolarWIS Platform
Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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WATOM
Wafer edge and notch profile measurementThe use of smaller and smaller patterns in the semiconductor industry calls for increasingly advanced materials of extremely high quality. In response to the steady improvements in the quality of wafers, KoCoS Automation has developed WATOM, a wafer edge and notch profile measurement tool which heralds a new era of extremely precise wafer geometry measurement.WATOM supports quality assurance throughout the wafer manufacturing process, starting at the very beginning and continuing on through to wafer reclaim.The WATOM Edge and Notch Wafer Geometry Analyser sets the worldwide benchmark for the quality assurance of geometrical measurements in semiconductor wafer manufacturing, combining the highest quality standards with top-class service. These high-precision, laser-based edge profile measurement tools are specially designed for optimum integration in manufacturing lines within the semiconductor industry.
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Edge Grinding Machines
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials. Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process. In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
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Wide Measurement Range Model Of Semi-automatic 4 Point Probe Sheet Resistance/resistivity Measurement
RT-3000/RG-2000 (RG-3000)
*User programable measurement pattern & programmable measuring pattern*Tester self-test function, wide measuring range*Thickness, edge, temperature correction for silicon wafer*Film thickness conversion function from sheet resistance*2 types measuring tester (S version: Standard type, H version: High range resistivity measurement type)
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Defect Inspection and Review
KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Automated High-Resolution AOI Tool Modular Inspections
LIGHTiX
Next generation macro inspection system (AOI).• All-side wafer inspection: Front, back and edge inspection.• 100% defect images without throughput impact.• Integrated high-end microscope review.• True Color Inspection (TCI) technology.• Advanced CD, 2D/3D, OVL and EBR metrology.• Automatic defect classification• Best in class cost of ownership for high resolution AOI• High-speed patterned wafer inspection• High defect sensitivity• ISO Class 1 certified• Tool – to – tool matching
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1000 BASE-T1 Ethernet
MECS-6110
- 1x Intel® Xeon® D-2100 family processor- 4x DDR4-2666 1DPC RDIMM ECC REG up to 256GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT support- TPM 1.2/2.0 modul- 2x IEEE 1588 v2 1PPS/TOD RJ-45 port and 4x 1PPS SMA input/output Specifications- Verified for Intel® Select Solution for uCPE on CentOS
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Edge Gateway
UBC-330
UBC-330 is a RISC computing box powered by a TI Sitara™ AM3352 Cortex®-A8 processor and equipped with 2 Gigabit Ethernet, 5 serial, 4 GPI, and 4 GPO ports. For industrial applications, the serial and GPIO ports feature rugged ESD and isolation protection to prevent system damage from power fluctuations. UBC-330 also supports multiple power input voltages and a wide operating temperature, making it the ideal solution for automation control in smart grid, industrial, and machinery automation applications.
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Edge Gateway
EPC-R3220
EPC-R3220 is a RISC-based box computer integrated with the TI Sitara AM3352 Cortex-A8 0.8GHz processor. It is designed for applications that require multiple connectivity points and low power consumption. The EPC-R3220 offers dual RS-232/485 serial ports with Modbus/OPC-UA protocol support for date collection, 6GPIOs for indication or device control, dual 10/100/1000 Ethernet ports, one wifi/BT onboard solution and one Mini-PCIE that can expand to an LTE solution. EPC-R3220 supports wide-ranging power input and temperature and supports both DIN-rail and wall mounting.
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Edge Gateway
EPC-R3710
EPC-R3710 is an Arm based Box Computer powered by a high-performance Rockchip RK3399 ARM dual Cortex-A72 and quad Cortex-A53 high performance processor which supports 4K display from HDMI. It offers both rich display as dual HDMI/LVDS/eDP and rich IO as dual GbE/2serials/3USB/12GPIO. EPC-R4710 also features Mini-PCIe slot for integrating Wi-Fi, Bluetooth, and 3G/4G modules. It is an ideal solution for HMI, IoT gateway, healthcare application.
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Edge AI Box
EPC-R5710
Advantech EPC-R5710 is an AI edge intelligent industrial gateway integrating NXP's high performance of video coding/decoding and AI function. It can provide 2.3-28.3 TOPS NPU AIcomputing power, and support multiple network ports, a variety of industrial interfaces and storage, as well as wireless technologies including 5G/4G,Wi-Fi5/6. It also supports 8-wayMIC array to realize audio and video AI analysis. Integrated cloud collaboration functions.EPC-R5710 supports a variety of PLC data acquisition and industrial protocol conversion. With its high performance and high quality, it is widely used in AI video surveillance, machine vision and industrial data acquisition applications in the fields of security, smart city, smart transportation, smart factory, energy and power.
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Wafer Test
Automatic KLA wafer probers with tray-to-tray-wafer-handling are operated 24h a day and 7 days a week. Data retention bake/tests are done at wafer level
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Wafer Inspection Products
Sonix provides manual and automated wafer inspection and metrology systems for wafers ranging from 100mm to 300mm, with extensive analysis capabilities at both the wafer and device level. These industry-leading automated wafer inspection systems are used by the world’s top manufacturers to ensure quality from development through production.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Wafer Chucks
American Probe & Technologies, Inc.
High Performance Chuck for your needs Introducing the American Probe & Technologies’ HC-6000 series of thermal chucks,
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Wafer Cathodoluminescence Microscope
Säntis 300
Attolight’s Quantitative CL-SEM offers “No Compromise” large field fast scanning simultaneous acquisition of SEM images, hyperspectral CL maps, and optical spectra. Smaller diameter wafers, or miscellaneously shaped substrates are manually loaded on intermediary 300mm susceptors subsequently handled automatically by the tool.
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5G Edge Servers
ADLINK is committed to developing industry-leading edge computing platforms to drive the transformation of communications network architectures, and enable customers to explore new services and business models across various market segments. Validated for NGC-Ready and AWS IoT Greengrass, ADLINK’s OTII-compliant Edge Server MECS series provides a versatile, cost effective and scalable white-box solution to facilitate deployment of 5G RAN and private networks, and enable a wide range of 5G use cases, including 5G DU/CU in open RAN and private networks in smart factory, mining, transportation and more.
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Wafer Sort
TestEdge offers complete wafer sort solutions. Our range of wafer sort capabilities demonstrates our ability to handle a wide range of devices and device characteristics. State of the art Electroglas probers Sort experience with high probe count Less than 4 mil pitch on probes Experience with C4 Bump and Aluminum pad Experience on Bipolar, CMOS, GaAs, & SiGe Overhead sort or cable harness sort Microsite testing capability
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Industrial IoT Edge Gateway
Advantech IoT Edge Gateways help bridge data from edge devices to cloud, acting as protocol converters, data collectors, or data loggers.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Compact Wafer Transport with Integral Wafer Pre-Aligner
GB4P
The GB4P Robot System with integral wafer pre-aligner is the most compact robot and pre-aligner package available on the market today for wafer handling applications up to 200mm, standard payload and throughput.Identical in size to Genmark’s original GB4 robot, the GB4P houses a built-in pre-aligner for wafers ranging from 2"- 8" in diameter. The adjustable feature on the pre-aligner allows for simple and fast configuration for different wafer sizes. Engineered for single or dual wafer transport, the GB4P robot is available with an extensive variety of reach and vertical stroke combinations.
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MPI PA Wafer Probers
MPI Photonics Automation is the industry-leading provider of turnkey wafer test and measurement solutions. We offer a complete line of high-performance wafer probers designed to address the diverse and complex needs of the Photonics, Optoelectronic, Semiconductor, and Laser industries.
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Solid Edge
Maya Heat Transfer Technologies Ltd.
Solid Edge® is an industry-leading mechanical design system with exceptional tools for creating and managing 3D digital prototypes. With superior core modeling and process workflows, a unique focus on the needs of specific industries, and fully integrated design management, Solid Edge® guides projects toward an error free, accurate design solution.
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Full Wafer Test System
FOX-1P
Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
