ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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Rad-Hard ASIC Platforms
STMicroelectronics, a leading supplier of digital CMOS technologies, is bringing differentiation by developing advanced deep-nanometer radiation hardened technologies dedicated for the Space, Aerospace and High-Rel & Defense markets.
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ASIC
Is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use, such as a chip designed to run in a digital voice recorder or a high-efficiency video codec.
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SparkFun Qwiic MicroPressure Sensor
The SparkFun Qwiic MicroPressure Sensor is a miniature breakout equipped with Honeywell's 25psi piezoresistive silicon pressure sensor. This MicroPressure Sensor offers a calibrated and compensated pressure sensing range of 60mbar to 2.5bar, easy to read 24 bit digital I2C output, and can be calibrated and compensated over a specific temperature range for sensor offset, sensitivity, temperature effects, and non-linearity using an on-board Application Specific Integrated Circuit (ASIC). With its ultra-low power consumption and Qwiic ports, you've got yourself a power packed little sensor!
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Pressure Sensors
ESCP-MIS1 Sensor
ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES’s innovative microfabrication process for silicon capacitive sensors.
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Audio MEMS Sensors
An audio MEMS sensor is an electro-acoustic transducer housing a sensor (MEMS) and an application-specific integrated circuit (ASIC) in a single package.
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Verification IP's
SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
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ARM Development Studio 5
DS-5
ARM DS-5 is the tool-chain of choice for software developers who want to fully realize the benefits of the ARM Architecture. Comprising features such as the best-in-class ARM Compiler, powerful OS-aware debugger, system-wide performance analyzer, and real-time system simulator, DS-5 is an integrated development environment that assists engineers in delivering optimized and robust software for ARM processor-based ASICs and ASSPs.
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Transducer / Transmitter
General purpose industrial pressure transducer provides outstanding integrity concerning high shock, vibration and pressure cycling. Utilizing high-performance ASIC, digital compensation provides excellent temperature performance, while the thin film sensor enables long-term stability.
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ASICs
ams has been creating unique ASIC (Application Specific Integrated Circuit) solutions in partnership with customers for over 30 years. We enable our partners to create highly differentiated products that are smarter, safer, easier to use and more eco-friendly. Our various industry experts in automotive, industry, medical and smart building are looking forward to talk to you and to define the solution which will exactly fit your needs.
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GRIDSCAN 5000
Hydrogen Series
The H2scan GRIDSCAN 5000 Hydrogen Sensor pairs a high performance ASIC to H2scan’s field-proven solid-state hydrogen sensor. This stand-alone sensor system has been designed to provide precision hydrogen measurement, at a lower cost for the high-volume OEM or utilities. No calibrations or maintenance is needed for up to 10 years, and the GRIDSCAN 5000 is the lowest cost by thousands to any other available hydrogen DGA system. H2scan is the only company in the industry that can state retail sales of over 15,000 sensor systems worldwide with no after sale calibrations performed since 2012.
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Digital Solutions
Dexter's Digital Detectors and Temperature Sensor Modules (TSM's) are based on Dexter's superior silicon thermopile technology and incorporate an ASIC that provides a cost effective front end for reading out the detector output. The digital solutions include pre-amplification, A/D, multi-plexing and SMBus communications. Additionaly, the SMBus can accommodate communications with up to 100 digital products. Our digital solutions are housed in industry standard TO-5/TO-39 packages.
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Ultrascale FPGA PCIe Board
SE100 – Solar Express
Sundance Multiprocessor Technology Ltd.
SE100 is based on Xilinx’s Virtex Ultrascale FPGA XCVU190-2FLGC2104E, and is a powerful processing card with plenty of IO capabilities to meet the needs of modern compute-intensive applications such as Supercomputing, Data Centers and defense. The board can optionally be populated with 095, 125, and 160 devices in C2104 package for reduced cost. Host interface is via 8 lanes of PCIe Gen3 but the card can also be used as an embedded, standalone, hardware too. Multiple cards can be cascaded to provide a multi-FPGA system with cards connected together via the board’s fast IO channels to meet the needs of even more demanding applications like ASIC design and Stock Market fast trading systems.
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I/O Expanders and Level Translators
ST’s Xpander family of general-purpose input/output port expanders are used to interface digital ASICs via a two-line bidirectional bus (I²C) . ST’s dual-supply level translators are used as interface between multi-voltage chipsets and system I/Os, ranging from 5.5 V down to 1.2 V.
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VME Master - DAQ and Detector Interface
VX1394
The VX1394 board features a radiation hard 4.8 Gbps SERDES ASIC, which, in connection to a rad-hard optical transceiver implements a newer generation optical links for many detector readout systems. The ASIC performs data transmission, trigger distribution and clock forwarding towards the front-end electronics in the crate.
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Development Switch
TTESwitch Lab Space
The TTESwitch Lab Space supports laboratory testing efforts of Time-Triggered Ethernet applications; user development costs can be reduced by using the internal TTESwitch Controller HiRel ASIC that is also used in flight equipment. With advanced features like speeds of up to 1 Gbit/s, flexible physical layer configuration and three supported traffic classes, it is the optimal switching solution for a large variety of application areas. TTEthernet is a fault-tolerant, real-time communication protocol for safety-relevant systems integrating Ethernet and TTEthernet data flows onto one physical infrastructure.
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Functional Testing
Functional Ethernet testing is done during the research and development phase of a product or service. It can cover many parameters depending on the DUT and the application. Using Xena’s products, your range of functional Ethernet testing includes:*Multicast*40/100G PCS and PMA Layer*Transparent Transport*Energy Efficient Ethernet (EEE)*Microbursts and random IFG*Synchronous Ethernet*Automotive Ethernet*1588v2 Performance Testing*Regression testing*Kernel drivers and NIC testing*Hardware emulation (ASIC*)
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PCI Express 4 Base Specification Receiver Test Automation
N5991PB4A
The N5991PB4A is the receiver test automation software for bit error ratio testers, allowing you to test and characterize PCI Express 4.0 ASICs.
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Complete IP Module
Scan Ring Linker SRL
The Scan Ring Linker SRLTM - is a complete IP module that can be easily embedded into a CPLD, FPGA or ASIC on a PCB to reduce the complexities and costs of designing 1149.1 (JTAG) test infrastructure for designs that use multiple scan rings. The SRL IP module links any number of scan rings (secondary scan paths) into a single high-speed test bus, which permits devices on secondary scan chains to be independently tested and configured through a single 1149.1 external interface.
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Power Bead Inductors
Power bead inductors are typically used in high current multi-phase voltage regulators that power processors, memory modules and high current ASICs and FPGA in a wide range of applications including servers, graphics cards, storage and data centers. The construction consists of a ferrite core assembled over a 1T or 2T winding and which allows for extremely low DCR, high peak current and low AC losses. Pulse has single phase, integrated phases and coupled inductor versions. Our high volume manufacturing enables us to produce components that are cost-effective while maintain exceptional quality and reliability.
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Digital Oscilloscope
MSO/DS7000
The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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PCI Express IP
Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Centralized Motion Controller
ADLINK‘s pulse train controllers provide comprehensive and application-oriented motion functions for servo and stepper motors through digital signal processing (DSP)-based and Application Specific Integrated Circuit (ASIC)-based two pulse train mode controllers to achieve excellent synchronous motion control and precise positioning suitable for laser engraving, marking and cutting applications in semiconductor, AOI, and conventional manufacturing industries.
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Function Generators
Waveform : Sine, Triangle, Square, Pulse, Sawtooth, Ramp 0.2Hz-150MHz EXT Frequency Counter(Option : 1:6 GHz or 2.7GHz) Self made insert ASIC Function : Total, RPM, Period, LPF, COUPL(AC/DC), ATT(X10) Fast,High-Resolution, 8Digits LED display Internal or External AM,FM Modulation Internal or External Burst and Linear Sweep Countrol from 1 : 1 to 100:1 TTL/CMOS Leveled Square Wave Output Maximum Attenuation of 20 dB cna be obtained Output impedance : 50 INPUT SENSITMTYKHz Range : 100mVms, MHz Range : 300mVms SWEEP WIDTH : Variable from 1:1 -100:1 RATE : 0.5Hz - 50Hz(20ms-2s) INTERNAL : Linear Bilt-in 5digits Green LED display
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Brick Power Module Test
Modern servers, workstations, and telecom equipment often use an Intermediate Bus Architecture (IBA) powered by isolated DC/DC converters known as "brick" modules. These brick converters step down the input voltage to a lower DC bus voltage, enabling designers to implement efficient, high-density, non-isolated Point-of-Load (POL) regulators that power components such as microprocessors, FPGAs, and ASICs on system boards. With smaller voltage step-down ratios now common, designing POL regulators has become more straightforward. Brick modules are so named for their standard physical formats (1/4 Brick, 1/2 Brick, Full Brick, etc.), making them easy to integrate and replace.
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CompuScope GPU CUDA Processing
Performing real-time digital signal processing (DSP) routines such as Fast Fourier Transform (FFT), Signal Averaging, Finite Impulse Response (FIR) Filtering, Digital Down Conversion (DDC) and more have traditionally required the use of dedicated DSP processors, Field Programmable Gate Arrays (FPGAs), or Application Specific Integrated Circuits (ASICs).
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Inductive Proximity Sensors
Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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FPGA Image Processing (IP) Development Kit
ProcVision
Gidel’s Vision Pro Development Kit is an optimal solution for developing,validating, demonstrating and evaluating Image Processing (IP) andpipeline designs on FPGA.The suite is designed to provide a complete and convenient envelop enablingthe developer to focus strictly on the proprietary image processingdesign. The entire Vision Pro flow is within a single FPGA, independentof the final target application(s). The Vision Pro flow is composedof a pipeline that streams simulated data to the user image processingdesign under test (DUT) and then captures the design’s output streamfor displaying, storing, analysis and/or co-processing on host software.The entire process is performed on a single FPGA without the need foradditional peripheral connectivity or tools.Vision Pro suite is plug-and-play enabling the developer to begin at oncethe IP design development and validation. A simple design example providesthe developer immediate hands-on familiarization with the systemflow and supporting tools. The final design can be ported to any IntelFPGA device or other vendors’ devices (FPGA or ASIC) by replacing basiclibraries. To significantly reduce compilation time, initial design developmentmay be on a small FPGA device and later compiled for the targetdevice(s). The target implementation may use any FPGA board. For a fullImaging/Vision system solution, Gidel offers a number of off-the-shelfgrabbers and FPGA accelerators that are designed to utilize these imageprocessing blocks and Gidel Imaging Library (GIL).
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Analyze RTL
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Linear Array Detector Cards
X-Card 0.2 to 2.5mm
A product family of high performance linear X-ray detector cards with preamplifier ASICs. The preamplifier ASIC converts the charge output from the photodiode array into voltage with serial output for easy integration with readout electronics. Can be arranged end-to-end to form large linear detector arrays.
