ICT Systems
See Also: ICT
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Audio Frequency System
Locator Set / UL 30
BAUR Prüf- und Messtechnik GmbH
Cable fault location with the BAUR Locator Set / UL 30. The audio frequency system Locator Set is used to exactly determine the alignment of cables and metal gas or water pipes. With various accessories, this system becomes a universal, indispensable device for power companies, industries, installation companies and water suppliers.* Output energy up to 50 VA* Automatic or manual impedance adjustment* Charging unit and rechargeable battery integrated; battery or mains operation* Continuous or cyclical output
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Control System
CONTROLSTIK II™
The Myron L® CONTROLSTIK II™ Rinse Tank System dramatically reduces the amount of water used in continuous flow rinse tanks. At the same time, it automatically maintains optimum water purity, ensuring effective rinsing.
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Electronic Inspection Systems
Intego's knowhow even makes it possible to identify challenging defects that may be located under the surface. One system is the inspection of chips by means of lock-in thermography, which visually represents the IR radiation intensity signal of electronics. Special lasers and flash lamps generate a very short heat impulse (10 ms) on the chip, which generates a measurable heat flow. In most cases, a resolution of < 1 μm can be achieved.
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Bus Differential System
B30
The B30 features integrated protection, control and metering for MV, HV and EHV busbars, providing cost effective, feature-focused busbar protection. Use the B30 to protect busbars with up to 6 feeders with up to two three phase differential zones. The B30 is a cost effective alternative to high impedance schemes, ideal for breaker-and-half bus schemes, with integrated feeder backup protection and metering
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Washwater Monitoring System
EG-100
Washwater Monitoring System for NOx and SOx Scrubber.Monitoring pH/Temperature, Turbidity, and PAH.EG-100 has flow type sensors.
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Thermal Monitoring System
The monitoring system for the thermal state of traction electric locomotive machines is designed for:control of the thermal state of traction electric motors (TED) as part of a high-speed traction-energy car-laboratory for testing rolling stock (TEL-C) in the acceptance and certification tests of electric locomotives;control of the thermal load of the TED and the temperature distribution by volume of the TED during the operational tests of electric locomotives;experimental determination of the most heated parts of the TED under different operating conditions;display of the current thermal state of the engine to the operator of the system;storing the thermal state data in the database for later playback.
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Semiconductor Test Software
Easily create and run robust test programs in semiconductor automated test systems with ActivATE™ test management software. Designed by test engineers for test engineers, ActivATE™ tames automated test complexities with elegant simplicity.
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Inline Test Systems
A perfect basis for an automatic integrated Test System for medium to high manufacturing volumes. Important technical and economic advantages due to their modular structure and expansion capability are evident.
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Multichamber PECVD/Etch System
IsoLok 5000
Load locked cluster toolCassette to cassette processingUp to 4 coatings can be deposited without breaking vacuumSubstrate sizes: 125 x 125mm,156 x 156mm and200mm dia. (smaller sizes can be processedusing a carrier)Typical coatings: SiOx & SiNx - doped & undoped & a- SiR&D, Pilot production and production capabilitiesRIE chambers availableFull computer controlProcess chamber is modular and interfaced with 200mm slot valve
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Automatic Test System
Star-Rec
Test entire HDI panel at once, or step & repeat in the "feed" direction. Fastest BGA Strip test system available. Star-Rec comes standard with: * loader * board cleaner * CCD Camera Alignment * electrical test section * fail and pass re-stackers * Board Marker
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EMC Test Systems
The sum of EMC is not necessarily equal to its parts; any modular electronic device from a complete aircraft down to a mobile phone needs to meet EMC requirements for the device itself, even if all the individual modules are compliant. For the enormous range of types of modular device requiring EMC test, R&S offers extremely flexible and scalable EMC test systems; practically as modular as the devices under test.
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Acoustic Emission System
Pocket AE-2
The Pocket AE-2 is a high performance, computerized, dual-channel Acoustic Emission (AE) system which is packed in a robust, portable handheld unit optimal for field use. The Pocket AE-2 offers all the performance, capabilities and features of larger, more expensive MISTRAS’ AE system (wide bandwidth, speed, AE features, sampling rates, waveform processing, audible AE) in a compact, battery-operated package.
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High-Temperature Test Systems
HT-PEM (high-temperature polymer electrolyte membrane) technology represents a further development of PEM fuel cell technology. Unlike conventional PEM fuel cells, which operate at lower temperatures, HT-PEM fuel cells can reach temperatures of up to 200 °C.
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Precision Positioning Systems
CAES is a world leader with 35 years of proven experience in design and manufacture of precision positioning systems, including multi-axis gimbal platforms that accurately acquire, track, and point a variety of RF and EO sensor payloads in military land, sea, and airborne environments.
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Measuring System
K-5201MA
To solve this problem, the following composition of the complex was chosen in the test stand conditions:laptop in a protected version PanasonicTBCF-53;measuring block - NIUSB-4431 with a set of vibroaccelerometers AP-2037;vibration excitation system LW 139.151-30 with mounting kit for the disk.The software of the complex provides the following functions:spectral analysis of vibration signals in the regulated range;search for natural excitation frequencies in given frequency ranges;Formation of database of existing disks;generation of reporting forms;and etc.
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ICP Microphone System
378C10
This model includes a 1/4" microphone cartridge, a mated preamplifier with TEDS, and system calibration.
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Machine Vision System
PD60/PD65
Panasonic Industrial Devices Sales Company of America
Panasonic Machine Vision System
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Voice Communications Systems
NAVICS
The NAVICS® fully IP based ICS from Rohde & Schwarz uses a uniform IP network to connect distributed on-board voice terminals and other subsystems for internal and external communications. The ruggedized, highly available IT technology with creditable security is also from Rohde & Schwarz
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Containerized Dynamometer Systems
The Fully Contained Transportable (FCT) Dynamometer Series uses specially engineered shipping containers as a mobile testing facility for engine or transmission testing.
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DUV Lithography Systems
ASML's deep ultraviolet (DUV) lithography systems dive deep into the UV spectrum to print the tiny features that form the basis of the microchip.
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Labelling System
3000BL
The Model 3000BL Labelling System is an expanded standard Model 3000B, incorporating the Zebra 90xi label printer and Exatron automatic label apply mechanism for a complete Program/Test/Label Handling System.
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Test System
Tessy
TESSY automates the whole unit test cycle including regression testing for your embedded software in C/C++ on different target systems. As an easy-to-install and easy to operate testing tool TESSY guides you through the unit test workflow from the project setup through the test design and execution to the result analysis and reporting. TESSY takes additionally care of the complete test organization as well as the test management, including requirements, coverage measurement, and traceability.
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Transportation Embedded System
Certified by the strict railway/vehicle/marine safety and EMC criteria, the transportation embedded systems (tBOX) are designed for transportation industry applications. The tBOX embedded systems feature wide operating temperature ranges, powerful computing performance, and high vibration resistance. The tBOX box PCs can work in various applications including fleet management, passenger infotainment systems, onboard and wayside surveillance systems, onboard device controls, gateway and dispatching systems, and more.
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Long-Term Systems
A long-term system from LI-COR lets you accomplish more with your multiplexed soil gas flux measurements. Connect up to 36 chambers to evaluate both spatial and temporal flux variation across a footprint of up to 2800 square meters.
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Custom Test Systems
Circuit Check has extensive expertise in the design, development, and deployment of custom test systems. Each of the Circuit Check solutions are formulated with modularity in mind. Our broad-based knowledge of testing principles, automation and wide customer base allow us to deploy solutions for even the most challenging application.
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Ion Beam System
Veeco's unmatched Ion Beam know-how delivers proven etch and deposition performance enabling the data storage and MEMS markets for decades.
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Electroluminescence Test Systems
The products of the SolarModule EL-inline family are integrated into a module production line, before lamination, after lamination or at the end directly after the performance measurement. High-resolution cameras provide excellent image quality and allow the automatic detection of relevant defects. A manual evaluation of images is no longer necessary, which means that considerable costs can be saved. Communication to upstream and downstream processes is flexible and can be adapted to all common interfaces.
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Dynamic Jack System
This is a structural fatigue testing machine for researching the dynamic behavior of full-size or model structures by applying repeated loads. The actuator that supplies the loads to the specimens can be installed on load frames, reaction floors, reaction walls, etc.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
