Solder Paste Inspection
assures volume and area of paste application.
See Also: Solder Paste, Solder Paste Measurement, 3D Solder Paste Inspection
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Replacement Solder Tip Leadset for Use with D410/D610
Dx10-SI-HiTEMP
The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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Protective Coating Inspection Kit 3
Measurement parameters include:Surface profileSurface temperatureClimatic conditionsCoating thicknessAdhesion
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Luminescence Defect Inspection System
INSPECTRA® PL Series
This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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Powder Coating Inspection Kit
Elcometer has produced this kit to enable the inspection of powder coatings on all surfaces. For a smooth surface, the digital Elcometer 415 Paint and Powder Gauge may be used but for more demanding, uneven surfaces, the Elcometer 1542 Cross Hatch Adhesion Tester is included.
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PHOTOMASK INSPECTION MACHINE
NEGATIVE FILM
Negative film and photomask inspection originated from the extensive use of printed circuit boards. Negative films and photomasks are used in large quantities. The early detection method is to use the "inspection light table" for inspection, which requires too much manpower and material resources, and manual testing may be due to eye fatigue and negligence.
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Standard DIP Socket with Solder Tail Bifurcated Contacts
Series 511
Standard DIP Sockets with Wire Wrap Bifurcated Contacts. Features: Standard DIP sockets are available with solder tail or wire wrap pins, all with bifurcated contacts. Consult Data Sheet No. 12005 for wire wrap pins. Aries offers these standard DIP sockets in more sizes than any other manufacturer.
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AXI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AXI Inspection Systems
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Tool, Solder Kit, Mini Coax with Solder Sleeve
910121144
Used to solder Mini Coax Solder Sleeve contacts.
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Coax, Patchcord, ITA, 20", Mini Coax, Solder Sleeve, RG316 Tan, Single-Ended
7-339116000-036
Mini Coax, ITA, Solder Sleeve (50 Ohm, 2 GHz) to RG316 Tan (50 Ohm, 3 GHz).
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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High Precision Angular Positioning, Calibration and Geometry INspection
LabStandard AIR
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The LabStandardAIR has been designed as a “Contact Free” system and eliminates features, which may detract from achieving the optimum rotational performance. The rotating elements are supported on super high precision, air lubricated, hydrostaticbearings and are not subject to disturbances associated with gear drives.
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Automated Optical Inspection (AOI)
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects (e.g. fillet size or shape or component skew). It is commonly used in the manufacturing process because it is a non-contact test method.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Wafer & Die Inspection
SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Portable Strain Gage Welding and Soldering Unit
700
A battery-operated capacitive discharge spot welder for attaching and wiring weldable strain gages and temperature sensors.
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Solar Power Plant Inspection Service
We provide various performance/safety tests including insulation resistance measurement, ground resistance measurement as well as string I-V inspection, EL inspection, and IR inspection using thermography. We provide services of pre-operation voluntary test and pre-operation self check, mandated by revision of FIT scheme in 2017 for solar plants of 500kW – 2,000kW.
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Visual Counting & Inspection Systems
Sciotex has created a comprehensive line of visual counting and inspection systems. These systems can be custom configured for a wide range of applications and are often delivered, ready-for-installation in your environment.Our Products:PerfectCount, Ball Coleman SeedView, ConveyorView Inspection Systems, Sciotex ImageView, MultiView Inspection Systems
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Automated And Manual Sample Inspection
In addition to typical in-process, continuous dynamic measurement applications, LaserLinc’s non-contact measurement equipment is well suited for manual and automated off-line sample inspection. Inspecting cylindrical products with long, thin characteristics, such as camshafts and catheters requires checking multiple locations and dimensions for accuracy. Manual inspections of these areas can be difficult because of the complex profile as well as the need for numerous measurement stations, different equipment and skilled personnel.
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High Precision Angular Positioning Calibration and Geometry Inspection
LabStandard
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.Designed for horizontal and vertical applications with self-locking worm gearing and a high accuracy angular encoder ensures sensitivity and fine positioning for metrology and precision testing.
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Solder Cup Connector Kit
Y1142A
Used to build custom cables for 34950A – 78-pin Dsub male – 60 V.
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Motor Vehicle Inspect Lines Engineer Program
Foshan Analytical Instrument Co, Ltd.
It is suitable for measurement of motor vehicles equipped ignition engine with max total mass more than 3500kg. Including the dual idle speed method test. Meet the requirement of GB18285-2005"Limits and Measurement Methods for Exhaust Pollutomts from Vehicles Equipped Igintion Eigine under Two-speed Idle conditions and simple Driving Mode Conditions". The system can select the prompt mode of the dirver mode or the prompt mode of lattice screen.
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Solder Cup Connector Kit
Y1141A
Used to build custom cables for 34951, 34952 – 50-pin Dsub male – 125 V.
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X-Ray Inspection System
MX1
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Structural Adhesive Bead Inspection
Predator3D
The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Wafer Chip Inspection System
7940
Chroma 7940 wafer chip inspection system is an automated inspection system for postdiced wafer chip inspection.
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Thickness and Flaw Inspection
MultiScan MS5800
Eddy current testing is a noncontact method used to inspect nonferromagnetic tubing. This technique is suitable for detecting and sizing metal discontinuities such as corrosion, erosion, wear, pitting, baffle cuts, wall loss, and cracks in nonferrous materials.
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Fiber Optic Inspection & Cleaning
One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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Magnetic Particle Inspection(MPI)
Magnetic particle inspection is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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High Precision Angular Position, Calibration and Geometry Inspection
GeoOrdinate
Rotary Precision Instruments UK Ltd
Ultra precise rotary tables intended for fine inspection, metrology and test applications.The GeoOrdinate has been designed specifically for the inspection of large and heavy components and is fully compatible with any shop floor environment whilst maintaining world class accuracies more commonly seen in the standards laboratory.
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In-Process Wafer Inspection System
7945
Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
